Asus F1A55-M LX3 PLUS R2.0 F1A55-M LX3 PLUS R2.0 User's Manual - Page 8

F1A55-M LX3 R2.0 Series specifications summary APU Chipset Memory Graphics Expansion slots Storage / RAID LAN Audio USB AMD® A- & E2- series accelerated processors with AMD® Radeon™ HD 6000 series graphics, up to 4 CPU cores, FM1 package DirectX® 11 support AMD® Turbo Core Technology 2.0 support* * The AMD® Turbo Core Technology 2.0 support depends on the APU types. ** Refer to www.asus.com for the AMD® CPU support list. AMD® A55 FCH (Hudson D2) Dual-channel memory architecture 2 x 240-pin DIMM slots support maximum 32GB unbuffered non- ECC DDR3 1866 / 1600 / 1333 / 1066 MHz memory modules * The maximum 32GB memory capacity can be supported with 16GB or above DIMMs. ASUS will update the memory QVL once the DIMMs are available in the market. ** R efer to www.asus.com for the latest Memory QVL (Qualified Vendors List). *** When you install a total memory of 4GB capacity or more, Windows® 32-bit operating system may only recognize less than 3GB. We recommend a maximum of 3GB system memory if you are using a Windows® 32-bit operating system. Integrated AMD® Radeon™ HD 6000 series graphics in the LIano APU Supports D-Sub with max. resolution up to 1920 x 1600 @60Hz Supports Microsoft® DirectX 11 1 x PCIe 2.0 x16 slot 1 x PCIe 2.0 x1 slot 1 x PCI slot AMD® A55 FCH southbridge: - 4 x Serial ATA 3.0Gb/s connectors support RAID 0, RAID 1, RAID 10, and JBOD configurations Qualcomm Atheros® 8161 Gigabit LAN controller Realtek® ALC887 3-jack 8-channel High Definition Audio CODEC* * Use a chassis with HD audio module in the front panel to support an 8-channel audio output. AMD® A55 FCH southbridge: - 8 x USB 2.0/1.1 ports (4 ports at the mid-board, 4 ports at the back panel) (continued on the next page) viii