Asus P5LD2 SE Motherboard Installation Guide - Page 18

USB 2.0 technology, Gigabit LAN solution, Temperature, fan, and voltage monitoring

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Page 18 highlights

USB 2.0 technology The motherboard implements the Universal Serial Bus (USB) 2.0 specification, dramatically increasing the connection speed from the 12 Mbps bandwidth on USB 1.1 to a faster 480 Mbps on USB 2.0. USB 2.0 is backward compatible with USB 1.1. See pages 2-24 and 2-28 for details. Gigabit LAN solution The motherboard comes with a PCI Express Gigabit LAN controller to provide a total solution for your networking needs. The Gigabit LAN controller uses the PCI Express segment to provide faster data bandwidth. See pages 2-23 to 2-24 for details. Temperature, fan, and voltage monitoring The CPU temperature is monitored by the ASIC (integrated in the Winbond Super I/O) to prevent overheating and damage. The system fan rotations per minute (RPM) is monitored for timely failure detection. The ASIC monitors the voltage levels to ensure stable supply of current for critical components. See pages 4-33 and 4-34 for details. 1-18 Chapter 1: Product introduction

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1-18
Chapter 1: Product introduction
USB 2.0 technology
The motherboard implements the Universal Serial Bus (USB) 2.0
speciļ¬cation, dramatically increasing the connection speed from the
12 Mbps bandwidth on USB 1.1 to a faster 480 Mbps on USB 2.0. USB 2.0
is backward compatible with USB 1.1. See pages 2-24 and 2-28 for details.
Gigabit LAN solution
The motherboard comes with a PCI Express Gigabit LAN controller to
provide a total solution for your networking needs. The Gigabit LAN
controller uses the PCI Express segment to provide faster data bandwidth.
See pages 2-23 to 2-24 for details.
Temperature, fan, and voltage monitoring
The CPU temperature is monitored by the ASIC (integrated in the Winbond
Super I/O) to prevent overheating and damage. The system fan rotations
per minute (RPM) is monitored for timely failure detection. The ASIC
monitors the voltage levels to ensure stable supply of current for critical
components. See pages 4-33 and 4-34 for details.