Compaq BL10e ISS Technology Update, Volume 8, Number 3
Compaq BL10e - HP ProLiant - 512 MB RAM Manual
 |
UPC - 613326445501
View all Compaq BL10e manuals
Add to My Manuals
Save this manual to your list of manuals |
Compaq BL10e manual content summary:
- Compaq BL10e | ISS Technology Update, Volume 8, Number 3 - Page 1
SR-IOV-What is the difference 1 Three-phase power distribution in c7000 enclosures 3 PUE and DCE-Useful metrics for overall data center efficiency 6 Meet the Expert-Wayne Vuong ...7 Recently published industry standard server technology papers 8 Contact us ...8 HP Flex-10 and SR-IOV-What is the - Compaq BL10e | ISS Technology Update, Volume 8, Number 3 - Page 2
. See http://h20000.www2.hp.com/bc/docs/support/SupportManual/c01608922/c01608922.pdf for more detailed information on Flex-10. It is important to note that Flex-10 is an available HP technology for ProLiant BladeSystem servers, while SR-IOV is a released PCI-SIG specification at the beginning of - Compaq BL10e | ISS Technology Update, Volume 8, Number 3 - Page 3
marked on the input module as A and B, respectively. Feed A supplies power supplies 1, 2, and 3 while feed B supplies power supplies 4, 5, and 6. As with all ProLiant servers that use AC power, the power supplies themselves use single phase current. Figure 2-1 illustrates that with the 3-phase c7000 - Compaq BL10e | ISS Technology Update, Volume 8, Number 3 - Page 4
AC input module. Volume 8, Number 3 Calculating 3-phase input power Figure 2-2 shows how the power is electrically mapped for both North America and International 3-phase power into the singlephase power supplies. International 3-phase power uses five conductors, including a true neutral conductor - Compaq BL10e | ISS Technology Update, Volume 8, Number 3 - Page 5
2-2. Electrical diagrams of 3-phase power to a c7000 AC input module Volume 8, Number 3 Additional resources For additional information on the topics discussed in this article, visit this website: Resource HP BladeSystem c7000 Enclosure URL http://h18004.www1.hp.com/products/blades/components - Compaq BL10e | ISS Technology Update, Volume 8, Number 3 - Page 6
not intended to measure the efficiency of specific power and cooling systems within data center infrastructures. Rather, they are useful as "field" metrics to quantify overall C., "Metrics to Characterize Data Center & IT Equipment Energy Use," Digital Power Forum, Richardson, TX (September, 2006). 6 - Compaq BL10e | ISS Technology Update, Volume 8, Number 3 - Page 7
performance through HP iLO (Onboard Administrator) is phenomenal. Power and thermal controls embedded into Onboard Administrator reduce server power consumption by regulating processor speed and the operation of other server components, such as fans, power supplies, and unpopulated I/O and memory - Compaq BL10e | ISS Technology Update, Volume 8, Number 3 - Page 8
for a Scalable Compute Infrastructure http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00593 119/c00593119.pdf Power Capping and Dynamic Power Capping for ProLiant Servers Memory technology evolution: an overview of system memory technologies The Intel® processor roadmap for industry
-
1 -
2 -
3 -
4 -
5 -
6 -
7 -
8
 |
 |
HP Flex-10 and SR-IOV—What is the difference?
.......................................................................................
1
Three-phase power distribution in c7000 enclosures
.................................................................................
3
PUE and DCE—Useful metrics for overall data center efficiency
..................................................................
6
Meet the Expert—Wayne Vuong
................................................................................................................
7
Recently published industry standard server technology papers
...............................................................
8
Contact us
..................................................................................................................................................
8
HP Flex-10 and SR-IOV—What is the difference?
Improving I/O performance
As virtual machine software enables higher efficiencies in CPU use, these same efficiency enablers place more overhead on
physical assets. HP Flex-10 Technology and Single Root I/O Virtualization (SR-IOV) both share the goal of improving I/O
efficiency without increasing the overhead burden on CPUs and network hardware. Flex-10 and SR-IOV technologies
accomplish this goal through different approaches. This article explores the differences in architecture and implementation
between Flex-10 and SR-IOV.
How these two technologies differ and why it matters
HP Flex-10 Technology
Flex-10 technology is a hardware-based solution that enables users to partition a 10 gigabit Ethernet (10GbE) connection and
regulate the bandwidth of each partition. HP Flex-10 is available only with Virtual Connect (VC), and is currently available for
implementation only with supported HP BladeSystem servers.
Flex-10 can be deployed now with HP BladeSystem servers, and with relatively little modification to existing I/O architecture.
Adding Flex-10-capable network devices and virtual connect modules to existing HP BladeSystem infrastructure allows
administrators to take advantage of the considerable I/O control and refinement delivered by Flex-10 technology.
Using Flex-10 technology, administrators can configure a single BladeSystem 10Gb network port to represent four physical
network interface controllers (NICs), also called FlexNICs, with a total bandwidth of 10Gbps. These four FlexNICs appear to
the operating system (OS) as discrete NICs, each with its own driver. While the FlexNICs share the same physical port, traffic
flow for each one is isolated with its own MAC address and virtual local area network (VLAN) tags between the FlexNIC and
ISS Technology Update
Volume 8, Number 3
Keeping you informed of the latest ISS technology