Dell Unity 550F EMC WEEE Disassembly Instructions TAE and TAE-DC DAE
Dell Unity 550F Manual
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- Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 1
WEEE DISASSEMBLY INSTRUCTIONS for the TAE and TAE-DC Disk Array Enclosure Abstract This document provides clear guidance for end-of-life recyclers on how to identify and - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 2
in this publication requires an applicable software license. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be the property of their respective owners. Published in the USA. WEEE Disassembly Instructions for the 2 TAE and TAE-DC Disk Array - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 3
Part Number: 300-015-574 WEEE Disassembly Instructions for the 3 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 4
Table of Contents 1.0 Document Purpose ...6 2.0 Important Notice...6 3.0 How to Use these Instructions 6 5.0 Brand Owner Identification ...6 6.0 Acronyms ...8 7.0 Product Identification ...10 7.0.1 TAE and TAE-DC Disk Array Enclosure 10 8.0 Product Photos ...11 9.0 Locating Materials-TAE and TAE- - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 5
13.0.4.3 Removing materials in the DC Power/Cooling Module 41 13.0.5 Disassembling the Chassis for Recycling and Retrieving the Midplane PCB.......... 43 14.0 RoHS Restricted Materials 45 WEEE Disassembly Instructions for the 5 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 6
Disassembling the TAE and TAE-DC Disk Array Enclosure for removal procedures. 5. 4.0 Related Documentation EMC provides separate WEEE disassembly instructions per product platform. Contact the EMC WEEE administrator at [email protected] to request additional documentation as required. 5.0 Brand Owner - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 7
http://www.emc.com WEEE Disassembly Instructions for the 7 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 8
High-Density Polyethylene Mercury Link Control Card Low-Density Polyethylene Lead Polybrominated Biphenyls Polybrominated Diphenyl Ethers Polycarbonate Printed Circuit Board Polychlorinated Terphenyl WEEE Disassembly Instructions for the 8 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 9
Polyvinyl Chloride Restriction of Hazardous Substances Serial Attached SCSI Storage Processor Storage Processor Enclosure Solid State Disk Volt Waste Electrical and Electronic Equipment WEEE Disassembly Instructions for the 9 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 10
the base chassis. However, each platform supports many different EMC products. Contact your EMC Sales Representative for product-specific part numbers. Less than 45 pounds with 25 drives installed 87.0 mm (H) x 447.2 mm (W) x 355.6 mm (D) WEEE Disassembly Instructions for the 10 TAE and TAE-DC - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 11
8.0 Product Photos Figure 1. TAE or TAE-DC front view (fully populated with twenty five hard disk drives) Figure 2. TAE or TAE-DC rear view (TAE shown) WEEE Disassembly Instructions for the 11 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 12
in Table 10 through Table 12. 1 3 2 2 3 Figure 3. TAE Chassis and front view Table 3 Decoder and Disassembly Sequence Item Component 1 TAE 25-slot Chassis (sheet metal) 2 Power/Cooling Module 3 LCC I/O Assembly WEEE Disassembly Instructions for the 12 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 13
Sequence Item Component Item Component 4 Connector Fence (non-ferrous) 7 SAS Connector Cage (not visible, under air dam) 5 Plastic LCC Guide (ABS plastic) 8 Heat Sink (aluminum) 6 Air Dam (ferrous) 9 LCC PCB WEEE Disassembly Instructions for the 13 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 14
numbers below correspond with reportable materials listed in materials listed in Table 10 through Table 12. 10 Figure 5. TAE AC Power/Cooling Module WEEE Disassembly Instructions for the 14 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 15
Figure 6. Materials located on the SAE AC Power/Cooling Module PCBs Table 5. Decoder and Disassembly Sequence Item Component Item Component 10 Top Cover (sheet metal) 14 Wiring (cable sheathing, copper) 11 Top PCB 15 Bottom PCB 12 Coils (copper) 16 Fan Pack Assembly (ABS Plastic) 13 Large - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 16
disassembly procedures. Item numbers below correspond with reportable materials listed in Table 10 through Table 12. 18 Figure 7. TAE DC Power/Cooling Module WEEE Disassembly Instructions for the 16 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 17
6. Decoder and Disassembly Sequence Item Component Item Component 18 Top Cover (sheet metal) 23 Coils (copper) 19 Fan Pack Assembly (ABS Plastic) 24 Cooling Module Carrier (sheet metal) 22 Wiring (cable sheathing, copper) WEEE Disassembly Instructions for the 17 TAE and TAE-DC Disk - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 18
Sequence Item Component 27 Two Power/Cooling Module Air Flappers (ABS plastic) 28 Two LCC Assembly Air Flappers (ABS plastic) 29 Midplane PCB WEEE Disassembly Instructions for the 18 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 19
TAE and TAEDC Components 2.5-inch Hard Disk Drive Yes See Locating Materials on a 2.5-inch Hard Disk Drive, and Disassembling the Hard Disk Drive WEEE Disassembly Instructions for the 19 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 20
and Disassembly Sequence Item Component 21 SAS PCB 22 PCB 23 Plastic Disk Carrier (Lexan plastic) Figure 12. Close up of SAS PCB WEEE Disassembly Instructions for the 20 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 21
10.0 TAE and TAE-DC Disk Array Enclosure PCBs 2.5-inch Hard Disk Drive PCB (SAS) LCC PCB Midplane PCB WEEE Disassembly Instructions for the 21 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 22
components which contain asbestos Absent Cathode ray tubes Chlorofluorocarbons (CFC), Hydrochlorofluorocarbons (HCFC), Hydrofluorocarbons (HFC)or, Hydrocarbons (HC) Gas discharge lamps Absent Absent Absent WEEE Disassembly Instructions for the 22 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 23
liquid, such as oils and acids in particular Absent Components containing refractory ceramic fibers Absent Photo-conducting drums containing cadmium or selenium Absent WEEE Disassembly Instructions for the 23 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 24
Assembly 6 Air Dam Power/Cooling Module 10,17 Top Cover and Carrier LCC Assembly 5 Plastic LCC Guide Fan Pack Assembly 16,19 Fan Blades and Assembly Midplane Assembly in Chassis 27 Two Power/Cooling , Various) See PCBs WEEE Disassembly Instructions for the 24 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 25
84 g >PC+ABS-FR(40)< Two LCC Assembly Air Flappers 78 g >PC+ABS-FR(40)< Fan Pack Assembly 268 g >PC+ABS-FR(40)< WEEE Disassembly Instructions for the 25 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 26
the battery type recommended by the equipment manufacturer. - Discard used batteries according to manufacturer's instructions. - Do not attempt to reuse or install batteries in any other system, for any other purpose. WEEE Disassembly Instructions for the 26 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 27
and Disassembling a 2.5-inch Hard Disk Drive 1. If installed, remove the front bezel. The bezel is required for EMI compliance when the enclosure is powered up. Follow the instructions in Related Documentation to obtain the appropriate WEEE instructions for EMC bezels. 2. Press on the disk's latch - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 28
13.0.2 Removing an LCC 1. Press the orange handle buttons to release the LCC, pull the latches outward. 2. Remove the LCC from its slot. Figure 15. Removing an LCC WEEE Disassembly Instructions for the 28 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 29
from the LCC PCB. 2. Remove the two screws that attach the plastic LCC guide (circled), and lift off of the PCB. 3. Drill the four rivets that attach Removing the connector fence, LCC guide, air dam, and SAS connector WEEE Disassembly Instructions for the 29 TAE and TAE-DC Disk Array - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 30
. b. Flip the LCC PCB over and remove the two screws that attach the black insulator. The LCC PCB is now ready to recycle. WEEE Disassembly Instructions for the 30 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 31
type) 1. Press the orange handle button to release the module. 2. Pull the latch outward and remove the power/cooling module from its slot. WEEE Disassembly Instructions for the 31 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 32
Figure 19. Removing a power/cooling module WEEE Disassembly Instructions for the 32 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 33
cover screws b. Turn the power/cooling around to the opposite end and remove the third screw (circled), and lift off the top cover. WEEE Disassembly Instructions for the 33 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 34
off. Figure 22. Removing four top PCB screws 3. Disconnect the power/cooling module wiring from the bottom PCB and remove the top PCB. WEEE Disassembly Instructions for the 34 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 35
that attach the capacitor to the PCB. b. Remove the large capacitor. The top PCB is ready to recycle after all components are removed. WEEE Disassembly Instructions for the 35 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 36
Large C it Figure 24. Removing top PCB materials WEEE Disassembly Instructions for the 36 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 37
the cable. The bottom PCB is ready to recycle when all components are removed. Two Transformers with Figure 25. Removing bottom PCB materials WEEE Disassembly Instructions for the 37 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 38
the assembly, disconnect the wiring. The power/cooling module carrier is ready to recycle when the last item (fan pack assembly) is removed. WEEE Disassembly Instructions for the 38 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 39
to release the module. 2. Pull the latch outward and remove the power/cooling module from its slot. Figure 28. Removing a power/cooling module WEEE Disassembly Instructions for the 39 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 40
tabs on the fan pack assembly towards the middle, and pull up to remove. 2. Remove four screws (circled) that attach the top PCB. WEEE Disassembly Instructions for the 40 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 41
. Figure 31. Removing the top PCB 13.0.4.3 Removing materials in the DC Power/Cooling Module 1. Detach the heat fins. 2. To remove the wiring: WEEE Disassembly Instructions for the 41 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 42
to the PCB. b. Remove the large capacitor. The PCBs and power/cooling module carrier are ready to recycle after all components are removed. WEEE Disassembly Instructions for the 42 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 43
that attach the midplane PCB to the midplane assembly. b. Detach the black, frame-like insulator from the midplane PCB. Figure 33. Midplane PCB WEEE Disassembly Instructions for the 43 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 44
WEEE Disassembly Instructions for the 44 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 45
flip chip packages RoHS Exemption 24: Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors WEEE Disassembly Instructions for the 45 TAE and TAE-DC Disk Array Enclosure - Dell Unity 550F | EMC WEEE Disassembly Instructions TAE and TAE-DC DAE - Page 46
WEEE Disassembly Instructions for the 46 TAE and TAE-DC Disk Array Enclosure
Abstract
This document provides clear guidance for end-of-life recyclers
on how to identify and disassemble reportable materials in
compliance with the Waste Electrical and Electronic Equipment
(WEEE) directive. The document does not replace disposal
WEEE DISASSEMBLY
INSTRUCTIONS
for the TAE and TAE-DC Disk Array Enclosure