HP BL680c HP BladeSystem c-Class architecture

HP BL680c - ProLiant - G5 Manual

HP BL680c manual content summary:

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    scalability and reliability 18 Power and cooling architecture with HP Thermal Logic 18 Server blades and processors ...19 Enclosure ...19 Meeting data center configurations 19 High-efficiency voltage conversions 19 Dynamic Power Saver Mode...20 Active Cool fans...20 PARSEC architecture ...20
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    Reduced logistical delay time ...26 Conclusion...26 For more information...27 Call to action ...28
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    enclosure http://h20000.www2.hp.com/bc/docs/support/SupportManual/c01204885/c01204885.pdf • HP BladeSystem c-Class server blades-describes the architecture and implementation of major technologies in HP ProLiant c-Class server blades; including processors, memory, connections, power, management, and
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    power hungry and facility costs rise. Early generations of server blades solved some data center problems by increasing density and reducing cable count, how servers are deployed • Server virtualization tools that would also affect processor, memory, and I/O configurations per server HP determined
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    server, storage, or I/O option blades. Figure 1. HP BladeSystem c7000 Enclosure as viewed from the front and the rear c7000 enclosure - front Half-height server blade Full-height server blade Storage blade .www2.hp.com/bc/docs/support/SupportManual/c00816246/c00816246.pdf. The HP BladeSystem
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    enclosure holding up to eight blades, to a rack containing seven enclosures holding up to 56 server, storage, or option blades total. Figure 2. HP BladeSystem c3000 enclosure (rack-model) as viewed from the front and the rear Figure 3. HP BladeSystem c3000 enclosure (tower model) as viewed from the
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    active-standby mode. The Insight the enclosure, HP designed the support many different options of server blades, storage blades, and interconnect devices. BladeSystem c-Class supports ProLiant server blades using AMD or Intel x86 processors, Integrity IA-64 server blades, StorageWorks storage blades
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    blades slide into the enclosure horizontally rather than vertically. The HP configuration using wider device bays offers several advantages: • Supports Enables the use of standard-height dual inline memory modules (DIMMs) in the server blades for cost effectiveness. • Provides improved performance
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    weighing memory capacity, power use, and cost. Interconnect form factors HP selected interconnect modules and blades • Optimized form factors for supporting the maximum number topology that provides more bandwidth to each of the server blades. When using a double-wide module, redundant connections
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    NonStop signal midplane provides flexibility The BladeSystem c-Class uses a high-speed, NonStop signal midplane that provides the flexibility to intermingle blades and interconnect fabrics in many ways to solve a multitude of application needs. The NonStop signal midplane is unique because it can
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    Double Data Rate (DDR) InfiniBand Quad Data Rate (QDR) PCI Express PCI Express (generation 2) 1x 1x 1x 4x 4x 4x 1x - -4x 1x - 4x 4 support either network-semantic protocols (such as Ethernet, Fibre Channel, and InfiniBand) or memory avoids the problems of having to replicate traces to support each
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    and 2. Figure 9 gives an example of how c-Class half-height server blades connect to the interconnect bays in the c3000 enclosure. Customers should review the appropriate user guide for each enclosure. The guides are available at http://h71028.www7.hp.com/enterprise/cache/316682-0-0-0-121.html. 12
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    in the c7000 to the interconnect bays Figure 9. Connection of c-Class half-height server blades in the c3000 enclosure to the interconnect bays. To provide such inherent flexibility of the NonStop signal midplane, the architecture must provide a mechanism to properly
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    in previous generations of blade systems. New types of components can be implemented in the blade form factor and connected across the NonStop signal midplane - front-to-back or side-to-side. The front-to-back modularity is supported by installing mezzanine cards in the server blades at the
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    For detailed information about the c-Class server blades, see the technology brief titled "HP ProLiant c-Class server blades," available at http://h20000.www2.hp.com/bc/docs/support/SupportManual/c01136096/c01136096.pdf. NonStop signal midplane scalability The NonStop signal midplane is capable of
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    interface controllers (NICs). As shown in Figure 11, the topology for Device 1 on server blade 1 (a-b-c) is completely different than the topology for device 1 on server blade 4 (a-d-e). Therefore, an electronic keying mechanism in the Onboard Administrator identifies the channel topology for
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    Server blade-1 a DEV-1 Midplane b PCB Switch-1 PCB c Switch e Device Server blade an Electrically Erasable Programmable Read-Only Memory (EEPROM), which the Onboard HP NonStop S-series, core networking switches from Cisco, Juniper Networks and core SAN switches from Cisco and Brocade. HP
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    power backplane showing the power delivery pins Power delivery pins for the server blades Power delivery pins for the fan modules Power delivery pins for the these goals, HP consolidated power and cooling resources, while efficiently sharing and managing them within the enclosure. HP uses the term
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    c-Class BladeSystem. Using a 12V infrastructure eliminates several power-related components and improves power efficiency on the server blades and infrastructure. 5 For additional information about Power Regulator for ProLiant and which servers support it, see www.hp.com/servers/power-regulator. 19
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    in a standby mode. When power demand generate fairly low flow (in cubic feet per minute, or CFM) at medium back pressure, a single server often requires multiple fans to ensure adequate cooling. Therefore, when many server blades solutions in mind, HP solved these problems by designing the Active
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    and complexity. However, early generations of blade environments created the challenge of managing many additional small switches. HP solved this in an available on the HP technology website: www.hp.com/servers/technology. Integrated Lights-out technology Each ProLiant server blade designed for the
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    feature instructs the for each server blade and interconnect supporting Dynamic HP BladeSystem c-Class enclosure (Figure 13) provides quick, on-site access to all the setup, management, and troubleshooting mode (similar to instant messaging) between the Insight Display user (such as a service
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    provides the Onboard Administrator CLI, Insight Display, and KVM console connections to all the server blades in the enclosure. Virtualized network infrastructure with Virtual Connect technology HP BladeSystem c-Class is designed from the ground up integrating Virtual Connect technology. The OnBoard
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    Connect technology is available in the technology brief titled "HP Virtual Connect technology implementation for the HP BladeSystem c-Class" available at www.hp.com/servers/technology. HP Virtual Connect Enterprise Manager is a software application that simplifies the management of large BladeSystem
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    page 10. And the c7000 enclosure is capable of supporting either one or two Onboard Administrator modules in an server blades are designed with ample room for intake air and heat sinks (both on the processor and memory modules). Rather than use the traditional heat sink design for the processors, HP
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    scale the enclosure from the minimum of one server blade to the maximum by adding more fans and power supplies. By designing a unique NonStop signal midplane that can adapt to customer needs and technology directions over multiple generations, HP has ensured flexibility and a long life for the
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    for ProLiant HP Technology Briefs: ƒ HP BladeSystem c-Class c7000 enclosure technologies ƒ HP BladeSystem c3000 Enclosure technologies ƒ HP Virtual Connect technology implementation for the HP BladeSystem c-Class ƒ Managing the HP BladeSystem c-Class ƒ HP ProLiant c-Class Server Blades ƒ HP
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    to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors
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HP BladeSystem c-Class architecture
technology brief, 2nd edition
Abstract
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3
Evaluating requirements for next-generation server and storage blades
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4
HP BladeSystem c-Class architecture overview
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4
Component overview
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5
General-purpose compute solution
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7
Physically scalable form factors
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7
Blade form factors
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7
Interconnect form factors
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9
Star topology
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9
NonStop signal midplane provides flexibility
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10
Physical layer similarities among I/O fabrics
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10
Connectivity between blades and interconnect modules
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12
NonStop signal midplane enables modularity
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14
BladeSystem c-Class architecture provides high bandwidth and compute performance
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14
Server-class components
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14
NonStop signal midplane scalability
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15
Best practices
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15
Separate power backplane
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16
Channel topology and emphasis settings
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16
Signal midplane provides reliability
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17
Power backplane scalability and reliability
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18
Power and cooling architecture with HP Thermal Logic
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18
Server blades and processors
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19
Enclosure
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19
Meeting data center configurations
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19
High-efficiency voltage conversions
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19
Dynamic Power Saver Mode
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20
Active Cool fans
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20
PARSEC architecture
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20
Configuration and management technologies
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21
Integrated Lights-out technology
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21
Onboard Administrator
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21
Virtualized network infrastructure with Virtual Connect technology
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23
Availability technologies
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25
Redundant configurations
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25
Reliable components
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25