HP DL740 hot plug RAID memory technology for fault tolerance and scalability
HP DL740 - ProLiant - 4 GB RAM Manual
UPC - 808736765770
View all HP DL740 manuals
Add to My Manuals
Save this manual to your list of manuals |
HP DL740 manual content summary:
- HP DL740 | hot plug RAID memory technology for fault tolerance and scalability - Page 1
hp industry standard servers april 2003 technology brief TC030412TB hot plug RAID memory technology for fault tolerance and scalability table of contents abstract ...2 introduction ...2 memory reliability...2 error detection and correction 3 parity checking...3 error checking and correcting 3 - HP DL740 | hot plug RAID memory technology for fault tolerance and scalability - Page 2
more than 4 gigabytes (GB) of memory and availability of low-cost, high-capacity memory modules have driven requirements to support unprecedented memory capacity in today's industrystandard servers. Recent ProLiant servers support up to 64 GB of memory, and memory capacities will continue to grow in - HP DL740 | hot plug RAID memory technology for fault tolerance and scalability - Page 3
will halt operation. ECC memory is now standard in all ProLiant servers and significantly reduces the probability of fatal memory failures. The ECC commonly used in industry-standard servers is superior to parity checking because this ECC not only detects both single-bit and multibit errors, but - HP DL740 | hot plug RAID memory technology for fault tolerance and scalability - Page 4
per year 1 64 MB 1 GB 16 GB Memory Capacity To help meet the availability and scalability demands of today's eBusiness world, HP developed a solution that allows customers to take advantage of industry-standard memory technology, increase server fault-tolerance, increase memory capacity, and - HP DL740 | hot plug RAID memory technology for fault tolerance and scalability - Page 5
A4 A parity B4 B parity C4 C parity D4 D parity Hot Plug RAID Memory technology is implemented in ProLiant servers as part of a nextgeneration chipset designed by HP that includes four application-specific integrated circuits (ASICs). The ASICs enable the chipset to provide exceptional - HP DL740 | hot plug RAID memory technology for fault tolerance and scalability - Page 6
3). Eight data words combine to form one cache line of data. figure 3: DIMM-level memory organization DRAM Devices DIMM Bits = 4 + 4 + 4 + 4 + 4 + 4 + 4 + 4 + 4 x 2 sides 72-bit data word In a memory write transaction, parity is generated from the cache line of data. Simultaneously, the cache - HP DL740 | hot plug RAID memory technology for fault tolerance and scalability - Page 7
using the data words from the other three memory controllers and the parity controller. For example, as shown in figure 5, the RAID memory logic uses the data words from memory controllers 2, 3, 4, and P to regenerate the data word for memory controller 1 (MC1). Each regenerated data word from the - HP DL740 | hot plug RAID memory technology for fault tolerance and scalability - Page 8
eliminated the need for HP engineers to develop driver software for every OS and removed the maintenance associated with those drivers. When an administrator initiates a hot-replace operation, the memory controller tells the server to ignore the cartridge of memory where the hot-replace operation - HP DL740 | hot plug RAID memory technology for fault tolerance and scalability - Page 9
ease-of-use capabilities conclusion feedback Hot-add capability allows a user to scale up a computer system as needed by adding extra DIMMs. Hot-add capability requires support from the operating system to recognize the additional memory. HP worked with operating system vendors to ensure that this
hot plug RAID memory technology for fault tolerance and
scalability
table of contents
april 2003
hp industry
standard servers
technology brief
TC030412TB
abstract
....................................................................................................................
2
introduction
..............................................................................................................
2
memory reliability
.....................................................................................................
2
error detection and correction
...................................................................................
3
parity checking
..................................................................................................................
3
error checking and correcting
............................................................................................
3
potential for system failures
...............................................................................................
3
hot plug RAID memory
..............................................................................................
4
performance
......................................................................................................................
5
basic operation
.................................................................................................................
6
hot-plug capabilities
..........................................................................................................
8
ease-of-use capabilities
.....................................................................................................
9
conclusion
................................................................................................................
9
feedback
..................................................................................................................
9