HP HDX18-1020US HP HDX 18 Entertainment PC - Maintenance and Service Guide - Page 88

that services it., and the heat sink

Page 88 highlights

Remove the fan/heat sink assembly: 1. Disconnect the fan cable 1 from the system board. 2. Loosen the four Phillips PM2.0×10.0 captive screws 2 and the two Phillips PM2.5×5.0 captive screws 3 that secure the fan/heat sink assembly to the system board. ✎ Due to the adhesive quality of the thermal material located between the fan/heat sink assembly and system board components, it may be necessary to move the fan/heat sink assembly from side to side to detach the assembly. 3. Remove the fan/heat sink assembly 4. ✎ The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board each time the fan/heat sink assembly is removed: ■ Thermal paste is used on the processor 1 and the heat sink section 2 that services it. ■ Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it. ■ Thermal pads are used on various other system board components 5 and 7, and sections of the heat sink 6 and 8. Replacement thermal material is included with all fan/heat sink assembly, system board, and processor spare part kits. Reverse this procedure to install the fan/heat sink assembly. Removal and replacement procedures 4-55

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Removal and replacement procedures
4–55
Remove the fan/heat sink assembly:
1. Disconnect the fan cable
1
from the system board.
2. Loosen the four Phillips PM2.0×10.0 captive screws
2
and the two Phillips PM2.5×5.0 captive screws
3
that
secure the fan/heat sink assembly to the system board.
Due to the adhesive quality of the thermal material located between the fan/heat sink assembly and system board
components, it may be necessary to move the fan/heat sink assembly from side to side to detach the assembly.
3. Remove the fan/heat sink assembly
4
.
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system
board each time the fan/heat sink assembly is removed:
Thermal paste is used on the processor
1
and the heat sink section
2
that services it.
Thermal pads are used on the Northbridge chip
3
and the heat sink section
4
that services it.
Thermal pads are used on various other system board components
5
and
7
, and sections of the heat sink
6
and
8
.
Replacement thermal material is included with all fan/heat sink assembly, system board, and processor spare part kits.
Reverse this procedure to install the fan/heat sink assembly.