HP ML330 Optimizing facility operation in high density data center environment
HP ML330 - ProLiant - G3 Manual
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- HP ML330 | Optimizing facility operation in high density data center environment - Page 1
...7 High-line power efficiency ...7 Power management and reporting of individual servers 8 Server virtualization using virtual machine technology 9 Efficient practices at the rack level...9 Rack configuration tools ...9 Methods for calculating power supply requirements 10 Power protection and - HP ML330 | Optimizing facility operation in high density data center environment - Page 2
Computer room air conditioners...19 Capacity of CRAC units ...19 Placement of CRAC units ...20 Discharge velocity ...21 Advanced thermal management techniques 22 Thermal Assessment Services ...22 Dynamic Smart Cooling ...24 Summary ...25 For more information...26 Call to action ...26 - HP ML330 | Optimizing facility operation in high density data center environment - Page 3
://h20000.www2.hp.com/bc/docs/support/SupportManual/c01153741/c01153741.pdf. Introduction Existing data centers have had three major operational and fiscal constraints - power, cooling and space. As existing data centers are required to support increasingly dense configurations, power and cooling - HP ML330 | Optimizing facility operation in high density data center environment - Page 4
planners to more accurately estimate the power needs of HP ProLiant systems. The calculator provides meaningful estimates of power requirements for sizing an infrastructure. It is important to note, however, that actual power consumption of an installed system running certain applications may vary - HP ML330 | Optimizing facility operation in high density data center environment - Page 5
infrastructure, and server configurations is necessary to determine existing power and cooling requirements, and to project future requirements. IT administrators and data center managers should have access to methodologies and services designed to assess existing conditions, identify problems, and - HP ML330 | Optimizing facility operation in high density data center environment - Page 6
and driver installation on any server where Pstate management is desired. A ROM-based solution, however, provides P-state control at power-up, requires no software loading or upgrade, and can operate on systems running an OS that does not support P-state management. HP Power Regulator for ProLiant - HP ML330 | Optimizing facility operation in high density data center environment - Page 7
than single-phase power. Measuring the power consumption of a ProLiant DL380 G4 server demonstrates the higher efficiencies of high-line power. A test using the same system configuration, running a typical application, but using different AC supply voltages returned the power consumption data in - HP ML330 | Optimizing facility operation in high density data center environment - Page 8
Power consumption of ProLiant DL380 G4 server at different AC supply levels 625 622 620 615 610 605 600 601 600 599 599 599 595 Watts AC 590 585 100 115 200 208 220 230 240 Volts AC Therefore, a 1000-server datacenter would save approximately $25,000 per year3 in direct and indirect power - HP ML330 | Optimizing facility operation in high density data center environment - Page 9
allows the user to build virtual server solutions online. With it, the user can choose servers, memory, operating system, storage, backup solution; configure power and cooling options; select appropriate software; and assign necessary services and support. This HP tool is available at: http://h30099 - HP ML330 | Optimizing facility operation in high density data center environment - Page 10
HP examples of both UPS and PDU hardware and management tools, see the technology brief titled "Critical factors in intra-rack power distribution planning for high-density systems" in the "For more information" section at the end of this document. High-efficiency power supplies All ProLiant servers - HP ML330 | Optimizing facility operation in high density data center environment - Page 11
panels must be installed in any open spaces in the front of the rack to support the front-to-back servers in given rack configurations can be calculated by using the HP BladeSystem Power Sizer found at: www.hp.com/go/bladesystem/powercalculator. Proper cable management practices: • Segregate power - HP ML330 | Optimizing facility operation in high density data center environment - Page 12
Cooling System An HP 10000 Series G2 rack with an attached MCS requires approximately 1½ times the width and 1¼ times the depth of a standard server rack (to allow for the fan and heat exchanger modules and front and rear airflow). However, one MCS enclosure has enough cooling capacity to support - HP ML330 | Optimizing facility operation in high density data center environment - Page 13
's idle and maximum measured power consumption. The latest iLO 2 firmware may be found at http://www/hp.com/go/ilo. Updated System ROM/BIOS may be found on the Software and Drivers download page for each server model at www.hp.com/go/proliant. The latest Insight Power Manager software may be found - HP ML330 | Optimizing facility operation in high density data center environment - Page 14
air conditioning (CRAC) unit draws in warm air from the top, cools the air, and discharges it into the supply plenum beneath the floor. Figure 7. Airflow pattern for raised floor configuration with hot aisles and cold aisles To achieve an optimum downdraft airflow pattern, warm exhaust air must be - HP ML330 | Optimizing facility operation in high density data center environment - Page 15
which are supported by a grounded grid structure. The static pressure in the supply plenum pushes supply air plenum (36 inches) will provide additional air flow for high density configurations. Air supply plenum The air supply , and cables that bring power and network connections to the racks. In - HP ML330 | Optimizing facility operation in high density data center environment - Page 16
issues.7 Figure 10. Self-sealing cable cutout in raised floor 7 For more information about cable management, see the technology brief titled "Cable management for rackmounted systems," http://h20000.www2.hp.com/bc/docs/support/SupportManual/c01085208/c01085208.pdf 16 - HP ML330 | Optimizing facility operation in high density data center environment - Page 17
As power and heat densities climb, a single supply air plenum under the raised floor may be insufficient to remove the heat that will be generated. High-density solutions may require dual supply air plenums, one above and one below (see Figure 12). In this configuration, additional supply air - HP ML330 | Optimizing facility operation in high density data center environment - Page 18
be at least one full tile, 24 inches minimum. This spacing is required for equipment installation and removal and for access beneath the configuration Keep equipment rows as long as safety requirements will allow and avoid row gaps to prevent mixing of the hot and cold air. Where possible, locate - HP ML330 | Optimizing facility operation in high density data center environment - Page 19
pronounced, such as a rack populated with blade servers, rather than the heterogeneously-populated open space of the data center room. Close-coupling can result in shorter air paths that are more effective at heat extraction and require less fan power. Close-coupled heat removal minimizes the mixing - HP ML330 | Optimizing facility operation in high density data center environment - Page 20
HP values. Customers should review the manufacturer's specifications and then divide the sensible cooling capacity air required is related to the moisture content of the air and the temperature difference between the supply air supply plenum in the same direction (Figure 16). This configuration - HP ML330 | Optimizing facility operation in high density data center environment - Page 21
the perforated tiles.10 Another option is to use a fan-assisted perforated tile to increase the supply air circulation to a particular rack or hot spot. Fan-assisted tiles can provide 200 to 1500 cfm of supply air. 10 From Changing Cooling Requirements Leave Many Data Centers at Risk. W. Pitt Turner - HP ML330 | Optimizing facility operation in high density data center environment - Page 22
cooling resources within a data center or a global network of data centers. Thermal Assessment Services HP Thermal Assessment Services use CFD modeling to determine the best layout and information, please go to http://h20219.www2.hp.com/services/cache/114078-0-0-225121.html?jumpid=reg_R1002_USEN. 22 - HP ML330 | Optimizing facility operation in high density data center environment - Page 23
load. For example, Figure 18 shows the row-wise distribution of heat loads (41 kW to 182 kW) for a combination of compute, storage, and networking equipment in a typical raised floor data center with four CRAC units. The CFD model shows that the provisioning of the CRAC units is completely out - HP ML330 | Optimizing facility operation in high density data center environment - Page 24
installation growth of the IT load and maintain sufficient levels of redundancy. Likewise, inadequate control leads to providing server inlet air at a temperature far below the required DSC is not a replacement for best practices in www2.hp.com/bc/docs/support/SupportManual/c01153741/c01153741.pdf. - HP ML330 | Optimizing facility operation in high density data center environment - Page 25
happen in a room when certain equipment fails. As long as the data center has the power and cooling resources to support the expected loads, Thermal Assessment Services can rectify cooling problems as well as enhance the overall efficiency of air conditioning resources. In most cases, the energy - HP ML330 | Optimizing facility operation in high density data center environment - Page 26
rack power distribution planning for high-density systems http://h20000.www2.hp.com/bc/docs/support/SupportMa nual/c00600082/c00600082.pdf http://h20000.www2.hp.com/bc/docs/support/SupportMa nual/c01034757/c01034757.pdf Server virtualization technologies for x86based HP BladeSystem and HP ProLiant
Optimizing facility operation in high density
data center environments
technology brief
Abstract
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3
Introduction
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3
Assessing facility requirements
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3
Using sizing tools to understand server and facility requirements
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4
Data center assessment
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5
Component power and cooling
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5
Processor power and cooling
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5
Processor P-state
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5
P-state management
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6
Efficient practices for servers and enclosures
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6
Understanding server power utilization and heat generation
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6
Greater density with multi-core processors
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7
Blade enclosures with integrated cooling hardware
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7
Onboard thermal sensors and temperature management
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7
Pooled power
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7
High-line power efficiency
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7
Power management and reporting of individual servers
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8
Server virtualization using virtual machine technology
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9
Efficient practices at the rack level
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9
Rack configuration tools
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9
Methods for calculating power supply requirements
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10
Power protection and management
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10
Rack based power distribution
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10
High-efficiency power supplies
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10
Understanding Internal airflow
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10
Liquid cooled racks
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11
Efficient practices for facility-level power and cooling
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12
Power management and reporting
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13
Comprehensive management applications
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13
Power Capping
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13
Airflow distribution for high-density data centers
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13
Raised floors
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15
Air supply plenum
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15
Ceiling return air plenum
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17
Dual supply air plenums
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17
Perforated tiles
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17
Rack geometry
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18
Cooling footprint
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18
Hot and cold aisle spacing
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18
Row configuration
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18