HP ProLiant DL160se HP ProLiant Intel-based 100-series G6 server technology

HP ProLiant DL160se - G6 Server Manual

HP ProLiant DL160se manual content summary:

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HP ProLiant 100-series Intel-based G6 server
technology
Technology brief, 3
rd
edition
Abstract
..............................................................................................................................................
3
Introduction
.........................................................................................................................................
3
Intel Xeon 5500 Series processor technology
..........................................................................................
3
Multi-level caches
.............................................................................................................................
4
QuickPath Interconnect controller
.......................................................................................................
4
Hyper Threading
..............................................................................................................................
5
Turbo Boost technology
.....................................................................................................................
5
Intel Xeon 3400 Series processor technology
..........................................................................................
6
Memory
..............................................................................................................................................
8
DDR-3
.............................................................................................................................................
8
DIMM Choices
.............................................................................................................................
8
Memory Mirroring with DDR-3
.....................................................................................................
10
Memory channel interleaving
.......................................................................................................
10
Lockstep memory mode
...............................................................................................................
10
I/O technologies
...............................................................................................................................
11
PCI Express technology
...................................................................................................................
11
HP Smart Array and SAS/SATA technology
......................................................................................
11
SAS-2 standard
..........................................................................................................................
12
New generation HP Smart Array controllers
..................................................................................
12
Battery backed write cache
.........................................................................................................
13
Zero Memory RAID
.....................................................................................................................
13
Software RAID
...........................................................................................................................
13
Smart Array Advanced Pack
........................................................................................................
13
Networking technologies
................................................................................................................
14
Power and thermal technologies
..........................................................................................................
14
Efficient power delivery
...................................................................................................................
14
Common Slot power supplies
.......................................................................................................
15
Redundant power operation
........................................................................................................
16
Voltage regulation
......................................................................................................................
16
Improved thermal sensors and fan control
.........................................................................................
16
Phase shedding
.............................................................................................................................
16
Memory phase shedding
.............................................................................................................
16
Dynamic CPU phase shedding
.....................................................................................................
17
Managing processor technologies
....................................................................................................
17
QuickPath Interconnect power
......................................................................................................
17
Disabling processor cores
............................................................................................................
17
C-state package limit setting
........................................................................................................
17
Managing memory technologies
......................................................................................................
17
Memory channel interleaving
.......................................................................................................
17
Maximum memory data rates
.......................................................................................................
17
Managing I/O technologies
............................................................................................................
18