HP ProLiant ML330e Fully-Buffered DIMM technology in HP ProLiant servers
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- HP ProLiant ML330e | Fully-Buffered DIMM technology in HP ProLiant servers - Page 1
Fully-Buffered DIMM technology in HP ProLiant servers technology brief Abstract...2 Introduction...2 Performance barriers for traditional DIMM 2 Fully-Buffered DIMM architecture ...4 Benefits...6 Simplified board design ...6 Higher memory capacity ...6 Higher performance...7 Improved reliability - HP ProLiant ML330e | Fully-Buffered DIMM technology in HP ProLiant servers - Page 2
memory module (FB-DIMM) technology. It also provides rules for populating FB-DIMM slots to achieve maximum performance in HP ProLiant servers. Introduction HP ProLiant servers on the motherboard between the memory controller and memory slots. . 1 Error correcting code 2 Typical SDRAM DIMMs have a total - HP ProLiant ML330e | Fully-Buffered DIMM technology in HP ProLiant servers - Page 3
channel that can be supported as the bus speed increases. For example, Figure 2 shows the number of loads supported per channel at data servers require an improved memory architecture to achieve higher memory bandwidth and capacity. Consequently, JEDEC3 developed the Fully-Buffered DIMM specification - HP ProLiant ML330e | Fully-Buffered DIMM technology in HP ProLiant servers - Page 4
10 outbound links and 14 inbound links, also known as southbound and northbound links, respectively. These serial links connect the memory controller to an advanced memory buffer (AMB) chip that resides on each FB-DIMM, creating a point-to-point architecture. The outbound links transmit commands and - HP ProLiant ML330e | Fully-Buffered DIMM technology in HP ProLiant servers - Page 5
devices through a parallel interface. In the case of a read operation, the AMB serializes data from the DRAM devices and transmits it to the memory controller through the inbound links. Inbound and outbound serial information is transmitted in packets, or frames. Each inbound frame is 18 bytes long - HP ProLiant ML330e | Fully-Buffered DIMM technology in HP ProLiant servers - Page 6
traces do not add to overall routing complexity. In addition, the memory controller and AMB can compensate for signal traces of unequal length, thus to Memory technology evolution: an overview of system memory technologies technology brief at http://h18004.www1.hp.com/products/servers/technology/ - HP ProLiant ML330e | Fully-Buffered DIMM technology in HP ProLiant servers - Page 7
The asynchronous serial links between the memory controller and AMB enable higher performance by the memory subsystem. The two devices operate This feature can help reduce instances where the soft error could disrupt server performance and reliability. A second data protection mechanism called "bit - HP ProLiant ML330e | Fully-Buffered DIMM technology in HP ProLiant servers - Page 8
from the time a read request is initiated to the time the memory controller receives the first frame of read data. Because the FB-DIMM server's internal fans. To estimate the power consumption for all current HP ProLiant servers that support FB-DIMMs, use the power calculators at http://www.hp - HP ProLiant ML330e | Fully-Buffered DIMM technology in HP ProLiant servers - Page 9
in a specific server, single- HP supports the FB-DIMM standard because it increases reliability, bandwidth, and capacity while using cost optimized, industry-standard DRAM components. The balanced system architecture of ProLiant servers with dual-core processors and FB-DIMMs delivers increased memory - HP ProLiant ML330e | Fully-Buffered DIMM technology in HP ProLiant servers - Page 10
Hyperlink JEDEC Web site http://www.jedec.org HP Advanced Memory Protection Memory technology evolution http://h18004.www1.hp.com/products/servers/technology/whitepapers/advtechnology.html http://h18004.www1.hp.com/products/servers/technology/whitepapers/advtechnology.html Call to action Send
Fully-Buffered DIMM technology in HP ProLiant servers
technology brief
Abstract
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2
Introduction
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2
Performance barriers for traditional DIMM
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2
Fully-Buffered DIMM architecture
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4
Benefits
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6
Simplified board design
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6
Higher memory capacity
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6
Higher performance
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7
Improved reliability
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7
Challenges
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8
Latency
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8
Power and thermal loads
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8
Performance tuning, achieving maximum performance
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Conclusion
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For more information
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Call to action
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10