HP X1800sb HP BladeSystem c-Class architecture

HP X1800sb Manual

HP X1800sb manual content summary:

  • HP X1800sb | HP BladeSystem c-Class architecture - Page 1
    11 NonStop signal midplane scalability 11 Power backplane scalability and reliability 13 Power and cooling architecture with HP Thermal Logic 13 Server blades and processors ...14 Enclosure ...14 Configuration and management technologies 16 Integrated Lights-Out...16 Onboard Administrator...17
  • HP X1800sb | HP BladeSystem c-Class architecture - Page 2
    /servers/technology/whitepapers/proliant-servers.html#bl. Enclosures and hardware components An HP BladeSystem c-Class enclosure holds ProLiant and Integrity server blades, storage blades, I/O option blades, interconnect modules (switches, pass-thru modules, and Virtual Connect modules), a NonStop
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    the HP BladeSystem c7000 Enclosure" shows images of the other enclosure types: http://h20000.www2.hp.com/bc/docs/support/SupportManual/ HP offers the c3000 in tower or rack versions (shown in Figure 2). A single c3000 enclosure is 6U high and can hold up to eight server, storage, or I/O option blades
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    -purpose flexible design The BladeSystem c-Class supports many blade and interconnect device options. It can hold ProLiant server blades using AMD or Intel x86 processors, ProLiant workstation blades, Integrity server blades, StorageWorks storage blades, tape blades, and PCI-X or PCI Express (PCIe
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    and connects with other HP infrastructure pieces, including external storage components such as DAS (direct-attached storage), NAS (network attached storage), and SAN (storage area network) solutions (www.hp.com/go/blades/storage). The design supports flexibility:  Blade form factors that can
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    -height bays can be used in combination for a full-height double-wide blade form factor. Or, adjacent single-wide full-height blades can be used together. For example, HP Integrity server blades can combine multiple blades to create 2, 4, or 8 socket systems, as shown in Figure 4. Each base server
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    form factor provides similar advantages as the scalable device bays:  Supports the maximum number of interconnect modules  Allows enough space in -by-side (Figure 6a), the architecture is a dual-star topology: Each blade has redundant connections to the two interconnect modules. If you use a double
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    blades Interconnect Module A Interconnect Module B blades 6a blades 6b NonStop signal midplane provides flexibility The BladeSystem c-Class uses a high-speed, NonStop signal midplane that supports of network fabrics HP engineers avoided replicating traces on the NonStop signal midplane to support
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    be used for 1-, 2- , or 4-lane standard protocols. Connectivity between blades and interconnect modules The c-Class server blades use mezzanine cards to connect to various network fabrics. The mezzanine cards on the server blades connect to the interconnect modules through independent traces on the
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    review the enclosure quick start guides at http://h18004.www1.hp.com/products/blades problem, it gives a warning and information about how to correct the problem. Blade-to-blade supports front-to-back modularity by connecting mezzanine cards in the server blades storage or I/O devices to a server blade
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     StorageWorks SB40c Storage Blade consisting of a RAID controller and additional drives  StorageWorks Ultrium Tape Blades that hold LTO-2, LTO-3, or LTO-4 Ultrium tape cartridges  BladeSystem PCI Expansion Blade that can hold two off-the-shelf PCI-X or PCIe cards High bandwidth and performance HP
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    integrity considerations for HP BladeSystem" available at http://h20000.www2.hp.com/bc/docs/support/SupportManual/c01712559/c01712559. the topology for device 1 on server blade 1 (a-b-c) is completely different than the topology for device 1 on server blade 4 (a-d-e). Therefore, a link configuration
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    type of midplane used for decades in high-availability solutions such as the HP NonStop S-series, core networking switches from HP Networking, Cisco, and Juniper Networks, and core SAN switches from Brocade and Cisco. HP estimates that the mean time between failure (MTBF) for the signal midplane is
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    c-Class c3000 Enclosure" for more information about Thermal Logic technologies: http://h18004.www1.hp.com/products/servers/technology/whitepapers/proliant-servers.html#bl. Server blades and processors HP Power Regulator and Insight Control power management software let you measure the power
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    "Technologies in the HP BladeSystem c7000 Enclosure" paper for more details: http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00816246/c00816246. air does not interfere with the airflow path of the server blades or interconnect modules. Because the enclosures have separate physical cooling
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    helps you automate infrastructure management, and lets you manage network connections across an enclosure. To achieve this, BladeSystem c- http://h20000.www2.hp.com/bc/docs/support/SupportManual/c02049593/c02049593.pdf. Integrated Lights-Out Each ProLiant and Integrity server blade designed for the
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    informs technicians of problems within the enclosure setup process. As you add server blades networks (for components supporting installation wizard to guide you through the HP Insight Control software lets you manage and control HP server and storage resources through its central management console, HP
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    . HP Virtual Connect and Virtual Connect Flex-10 technology The BladeSystem c-Class architecture can reduce the complexities of switch management in a blade environment through Virtual Connect technology. Virtual Connect virtualizes the server connections to Ethernet or Fibre Channel networks so
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    10 GbE connection into multiple smaller connections and adjust the data speed of each partition. HP has extended the basic Flex-10 capabilities with FlexFabric adapters to support converged networking. Virtual Connect Virtual Connect technology is a set of interconnect modules and embedded software
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    blade server can have up to four times as many NIC connections without adding NIC cards or switches. Virtual Connect FlexFabric HP Virtual Connect FlexFabric interconnect modules and FlexFabric adapters extend Flex-10 technology to include data and storage , or a converged network adapter (CNA). To
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    blade-to-enclosure manager connectivity. Because all c-Class components are hot-pluggable, you can quickly re-establish a redundant configuration in the event of a failure. Reliable components HP Insight Display panel, you can configure and troubleshoot systems in minutes, rather than hours or days
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    their network setup every time a server blade configuration changes. It is quick and easy to migrate the network service from a failed server blade to a functional server blade. Finally, the fans, power supplies, interconnect modules, Onboard Administrator modules, server blades, and storage blades
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    to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors
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HP BladeSystem c-Class architecture
Technology brief, 3
rd
edition
Introduction
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2
Enclosures and hardware components
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2
General-purpose flexible design
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4
Scalable blade form factors
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5
Scalable interconnect form factors
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7
Star topology
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7
NonStop signal midplane provides flexibility
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8
High bandwidth and performance
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11
NonStop signal midplane scalability
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11
Power backplane scalability and reliability
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13
Power and cooling architecture with HP Thermal Logic
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13
Server blades and processors
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14
Enclosure
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14
Configuration and management technologies
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16
Integrated Lights-Out
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16
Onboard Administrator
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17
HP Insight Control and HP Insight Dynamics
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17
HP Virtual Connect and Virtual Connect Flex-10 technology
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18
Virtual Connect
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19
Virtual Connect Flex-10
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19
Virtual Connect FlexFabric
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20
Managing Virtual Connect
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20
Availability technologies
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21
Redundant configurations
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21
Reliable components
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21
Reducing configuration time
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21
For more information
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22
Call to action
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23