Intel BLKDX58OG Product Specification - Page 57

Thermal Considerations

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Technical Reference 2.5.2 Fan Header Current Capability CAUTION The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 27 lists the current capability of the fan headers. Table 27. Fan Header Current Capability Fan Header Maximum Available Current Processor fan Front chassis fan Rear chassis fan Auxiliary chassis fan 2.0 A 1.5 A 1.5 A 2.0 A 2.5.3 Add-in Board Considerations The board is designed to provide 2 A (average) of current for each add-in board from the +5 V rail. The total +5 V current draw for add-in boards for a fully loaded board (all six expansion slots filled) must not exceed the system's power supply +5 V maximum current or 14 A in total. 2.6 Thermal Considerations CAUTION A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a requirement. Use a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area. CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. 57

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Technical Reference
57
2.5.2
Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan
header.
Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 27 lists the current capability of the fan headers.
Table 27.
Fan Header Current Capability
Fan Header
Maximum Available Current
Processor fan
2.0 A
Front chassis fan
1.5 A
Rear chassis fan
1.5 A
Auxiliary chassis fan
2.0 A
2.5.3
Add-in Board Considerations
The board is designed to provide 2 A (average) of current for each add-in board from
the +5 V rail.
The total +5 V current draw for add-in boards for a fully loaded board
(all six expansion slots filled) must not exceed the system’s power supply +5 V
maximum current or 14 A in total.
2.6
Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38
o
C at the processor fan
inlet is a requirement.
Use a processor heat sink that provides omni-directional
airflow to maintain required airflow across the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board.
For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader.
Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.