Intel DG33TL Product Specification - Page 26
Audio Subsystem Software, Audio Connectors and Headers
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Intel Desktop Board DG33TL Technical Product Specification 1.10.1 Audio Subsystem Software Audio software and drivers are available from Intel's World Wide Web site. For information about Obtaining audio software and drivers Refer to Section 1.2, page 15 1.10.2 Audio Connectors and Headers The board contains audio connectors on the back panel and audio headers on the component side of the board. The front panel audio header provides mic in and line out signals for the front panel. Microphone bias is supported for both the front and back panel microphone connectors. The front/back panel audio connectors are configurable through the audio device drivers. The available configurable audio ports are shown in Figure 4. Item A B C D E F Description Surround left/right channel audio out/Retasking Jack Center channel and LFE (subwoofer) audio out Line in Line out Mic in S/PDIF Digital Audio Out (Optical) Figure 4. Back Panel Audio Connector Options For information about The location of the front panel audio header The signal names of the front panel audio header The location of the HD Audio Link header The signal names of the HD Audio Link header The back panel audio connectors Refer to Figure 10, page 44 Table 13, page 46 Figure 10, page 44 Table 12, page 46 Section 2.2.1, page 43 26