Intel E2160 Design Guide
Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray Manual
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- Intel E2160 | Design Guide - Page 1
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Thermal Design Guide October 2007 Order Number: 315279 - 003US - Intel E2160 | Design Guide - Page 2
specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications © 2007, Intel Corporation. All rights reserved. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 2 - Intel E2160 | Design Guide - Page 3
Control Interface (PECI 32 5.0 Intel® Reference Thermal Solution 33 5.1 Thermal Solution Requirements 33 5.2 PICMG 1.3 Form Factor 34 5.3 ATX/BTX form factors 36 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 3 - Intel E2160 | Design Guide - Page 4
Interface Material Performance 50 C Case Temperature Reference Metrology 51 C.1 Objective and Scope 51 D Mechanical Drawings 53 E Intel® Enabled Reference Solution Information 56 Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 4 October 2007 Order Number - Intel E2160 | Design Guide - Page 5
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 Processor , Primary Side 54 21 PICMG 1.3 Motherboard Keep-out, Secondary Side 55 Tables - Intel E2160 | Design Guide - Page 6
History Date October 2007 March 2007 September 2006 Revision 003 002 001 Description Updated to include the Intel® Pentium® Dual-Core E2160 processor Updated to include the Intel® E4300 processor Initial release Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG - Intel E2160 | Design Guide - Page 7
the processor", it is intended that this includes all the processors described and supported in this document. If needed for clarity, the specific processor will be listed. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG - Intel E2160 | Design Guide - Page 8
, E4300, and Intel® Pentium® Dual-Core E2160 Processor- Introduction This design guide supports the following processors: • Intel® CoreTM 2 Duo E6400 Processor for Embedded Applications • Intel® CoreTM 2 Duo E4300 Processor for Embedded Applications • Intel® Pentium® Dual-Core E2160 Processor for - Intel E2160 | Design Guide - Page 9
Design Guidelines LGA775 Socket Mechanical Design Guide Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet Intel® Core™2 Processor and Intel® Pentium® Dual Core Processor Thermal and - Intel E2160 | Design Guide - Page 10
of reading the processor temperature and providing the PWM signal to the 4 pin fan header. TMA Thermal Module Assembly. The heatsink, fan and duct assembly for the BTX thermal solution. § § Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 10 October 2007 - Intel E2160 | Design Guide - Page 11
-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.0 Processor Thermal/Mechanical Information 2.1 2.1.1 Figure 1. Mechanical Requirements Processor Package The processor is packaged in a 775-Land LGA package that interfaces with the motherboard via a LGA775 socket - Intel E2160 | Design Guide - Page 12
directly to the motherboard. In addition to holding the heatsink in place on top of the IHS, this mechanism plays a significant role in the robustness of the system in which it is implemented, in particular: Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 - Intel E2160 | Design Guide - Page 13
be derived from: - The height of the socket seating plane above the motherboard after reflow, given in the LGA775 Socket Mechanical Design Guide with its tolerances. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 13 - Intel E2160 | Design Guide - Page 14
for measuring the case temperature are detailed in Section 3.4. In case of conflict, the package dimensions in the processor datasheet supersedes dimensions provided in this document. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order - Intel E2160 | Design Guide - Page 15
Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 2. Processor Case Temperature Measurement Location Measure TC at this point (geometric center of the package) 37.5 mm 2.2.2 37.5 mm Thermal Profile The Thermal Profile defines - Intel E2160 | Design Guide - Page 16
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information Figure 3. Example Thermal Profile 2.2.3 Note: Case Temperature (C) 75 70 Heatsink 65 Design Point 60 55 Thermal Profile 50 TDP 45 40 35 30 30 40 50 60 70 80 90 - Intel E2160 | Design Guide - Page 17
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.3 2.3.1 Refer to Chapter 6.0, Intel® Quiet System Technology (Intel ambient temperature of the motherboard and other considerations for component height and placement in the area potentially impacted by the processor - Intel E2160 | Design Guide - Page 18
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.3.2 2.3.3 2.3.4 For the PICMG 1.3 server form factor, it is recommended to use: • The PICMG 1.3 motherboard keep-out footprint definition and height restrictions for enabling - Intel E2160 | Design Guide - Page 19
Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.4 2.4.1 2.4.2 2.4.3 System Thermal Solution Considerations Chassis Thermal Design Capabilities The Intel reference thermal solution for PICMG 1.3 chassis assumes that the chassis - Intel E2160 | Design Guide - Page 20
Intel® Components using 775-Land LGA Package and LGA775 Socket documentation provides Best Known Methods for all aspects of LGA775 socket Contact your Intel field sales representative for more information. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 20 - Intel E2160 | Design Guide - Page 21
-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 3.0 Thermal Metrology This section discusses guidelines for testing thermal solutions, including measuring processor temperatures. In all cases, the thermal engineer must measure power dissipation and temperature - Intel E2160 | Design Guide - Page 22
been designed such that the local ambient temperature is 38° C. Then the following could be calculated using Equation 1 from above: ΨCA = (TC,- TA) / TDP = (67 - 38) / 100 = 0.29 °C/W Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 22 October 2007 Order Number - Intel E2160 | Design Guide - Page 23
and a chipset heatsink. If a barrier is used, the thermocouple can be taped directly to the barrier with clear tape at the horizontal location as previously described, October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 23 - Intel E2160 | Design Guide - Page 24
disable the fan regulation and power the fan directly, based on guidance from the fan supplier. Locations for Measuring Local Ambient Temperature, Active Heatsink Note: Drawing Not to Scale Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 24 October 2007 Order - Intel E2160 | Design Guide - Page 25
LGA processor package for TC measurement. This procedure takes into account the specific features of the 775-Land LGA package and of the LGA775 socket for which it is intended. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor - Intel E2160 | Design Guide - Page 26
processor temperature by rapidly reducing power consumption when the on-die temperature sensor indicates that it has exceeded the maximum operating point. • Registers to determine the processor thermal status. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG - Intel E2160 | Design Guide - Page 27
#. Performance counter registers, status bits in model specific registers (MSRs), and the PROCHOT# output pin are available to monitor the Thermal Monitor behavior. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 27 - Intel E2160 | Design Guide - Page 28
mV steps). The processor continues to execute instructions during the voltage transition. Operation at the lower voltage reduces the power consumption of the processor, providing a temperature reduction. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 28 October - Intel E2160 | Design Guide - Page 29
monitor PROCHOT# and generate an interrupt whenever there is a transition from active-toinactive or inactive-to-active. PROCHOT# can also be configured to generate an October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 29 - Intel E2160 | Design Guide - Page 30
Systems that do not meet these specifications could be subject to more frequent activation of the thermal control circuit depending upon the ambient air temperature and the application Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 30 October 2007 Order Number - Intel E2160 | Design Guide - Page 31
2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 4.2.7 4.2.8 4.2.9 4.2.10 power profile. Moreover, if a system is significantly under designed, there is a risk that the Thermal Monitor feature will not be capable of maintaining a safe operating temperature and the processor could - Intel E2160 | Design Guide - Page 32
Manual. Intel has worked with many vendors that provide fan speed control devices to provide PECI host controllers. Consult the local representative for your preferred vendor for his/ her product plans and availability. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor - Intel E2160 | Design Guide - Page 33
in case of conflict, the specifications in the processor datasheet supersede the TC-MAX and TDP specifications in this document. Thermal Characterization Parameter at various TLA's Intel® Core™2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processors for Embedded Applications in the 775 - Intel E2160 | Design Guide - Page 34
heatsink bypass. It is a copper base and copper fin heatsink that is attached to the motherboard with the use of a backplate. This solution is shown in Figure 11. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 34 October 2007 Order Number: 315279 - 003US - Intel E2160 | Design Guide - Page 35
and meet the processors Thermal Profile specification as described in the processor datasheet. The estimated performance for additional airflows is shown in Figure 12. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 35 - Intel E2160 | Design Guide - Page 36
processor, need to ensure that it meets the processor thermal specifications as stated in the processor datasheet and follow the recommended motherboard level, with lower fan performance Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 36 October 2007 Order Number - Intel E2160 | Design Guide - Page 37
Thermal Solution-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 5.5 and higher surface temperatures. The system designer needs to account for altitude effects in the overall system thermal design to make sure that the TC requirement for the processor is met - Intel E2160 | Design Guide - Page 38
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Intel® Quiet System Technology (Intel® QST) 6.0 Note: 6.1 Intel® Quiet System Technology (Intel® QST) In the Intel® 965 Express Chipset family, a new control algorithm for fan speed control is being introduced. It is - Intel E2160 | Design Guide - Page 39
(Intel® QST)-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 13. Intel® QST Overview Intel® QST Temperature to be determined based upon the difference between current temperature readings and specific temperature targets. A major advantage of a PID Algorithm - Intel E2160 | Design Guide - Page 40
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Intel® Quiet System Technology (Intel® QST) Figure 14. PID Controller Fundamentals Integral (time averaged) Actual Temperature Proportional Error Limit Temperature Temperature Derivative (Slope) + dPWM - dPWM - Intel E2160 | Design Guide - Page 41
or SST for the processor socket. Additional SST sensors can be added to monitor system thermal conditions (refer to Appendix E for BTX recommendations for placement). October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 41 - Intel E2160 | Design Guide - Page 42
Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Intel® Quiet System Technology (Intel® QST) Figure 16. Example Acoustic Fan Speed Control Implementation LGA 775 Socket Intel® CoreTM 2 Duo Processor Thermal Sensor Intel (G)MCH Thermal Sensor ME Intel® Pentium® Dual-Core Processor - Intel E2160 | Design Guide - Page 43
)-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 6.3 Intel® QST Configuration and Tuning Initial configuration of the Intel QST is the responsibility of the board manufacturer. The SPI flash should be programmed with the hardware configuration of the motherboard - Intel E2160 | Design Guide - Page 44
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-LGA775 Socket Heatsink Loading Appendix A LGA775 Socket Heatsink Loading A.1 A.2 A.2.1 LGA775 Socket the socket diagonal. The matching of Faxial required to protect the LGA775 socket solder joint in temperature cycling - Intel E2160 | Design Guide - Page 45
LGA775 Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.2 Table 4. This board deflection metric provides guidance for mechanical designs that differ from the reference design for ATX//µATX form factor. Motherboard Deflection Metric - Intel E2160 | Design Guide - Page 46
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-LGA775 Socket Heatsink processor datasheet at all times. 2. Board deflection should not exceed motherboard manufacturer specifications. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor - Intel E2160 | Design Guide - Page 47
LGA775 Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.4 Note: Board Deflection Metric condition and tend to generate increasing amounts of board deflection as the motherboard creeps under exposure to time and temperature. • In contrast, - Intel E2160 | Design Guide - Page 48
much as 0.50mm total downward board deflection under the socket. In addition to board deflection, other elements need processor datasheet). 2. Board deflection should not exceed motherboard manufacturer specifications. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor - Intel E2160 | Design Guide - Page 49
Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.5.1 A.3 Motherboard Stiffening Considerations To protect LGA775 socket solder joint, designers need to drive their mechanical design to: • Allow downward board deflection to put the socket - Intel E2160 | Design Guide - Page 50
material area also becomes significant; the larger the desired thermal interface material area, the higher the force required to spread the thermal interface material. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 50 October 2007 Order Number: 315279 -003US - Intel E2160 | Design Guide - Page 51
Case Temperature Reference Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Appendix C Case Temperature Reference Metrology C.1 Objective and Scope This appendix defines a reference procedure for attaching a thermocouple to the IHS of a 775-land LGA - Intel E2160 | Design Guide - Page 52
and Height Restrictions for Enabling Components, Primary Side" on 54 page 54 Figure 21, "PICMG 1.3 Motherboard Keep-out, Secondary Side" on page 55 55 Page Number October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 53 - Intel E2160 | Design Guide - Page 53
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- Mechanical Drawings Figure 20. PICMG 1.3 Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components, Primary Side Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 - Intel E2160 | Design Guide - Page 54
Mechanical Drawings-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 21. PICMG 1.3 Motherboard Keep-out, Secondary Side October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 55 - Intel E2160 | Design Guide - Page 55
whatsoever regarding quality, reliability, functionality or compatibility of these devices. This list and/or these devices may be subject to change without notice. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 56 October 2007 Order Number: 315279 - 003US
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Order Number: 315279 - 003US
Intel
®
Core
TM
2 Duo E6400, E4300,
and Intel
®
Pentium
®
Dual-Core
E2160 Processor
Thermal Design Guide
October 2007