Intel E2180 Design Guide

Intel E2180 - Pentium Dual-Core 2.00GHz 800MHz 1MB Socket 775 CPU Manual

Get Intel E2180 - Pentium Dual-Core 2.00GHz 800MHz 1MB Socket 775 CPU PDF manuals and user guides
UPC - 683728169121
View all Intel E2180 manuals
Add to My Manuals
Save this manual to your list of manuals

Intel E2180 manual content summary:

  • Intel E2180 | Design Guide - Page 1
    Intel® Core™2 Duo Processor, Intel® Pentium® Dual Core Processor, and Intel® Celeron® Dual-Core Processor Thermal and Mechanical Design Guidelines Supporting the: - Intel® Core™2 Duo Processor E6000 Δ and E4000 Δ Series - Intel® Pentium® Dual Core Processor E2000 Δ Series - Intel® Celeron® Dual-Core
  • Intel E2180 | Design Guide - Page 2
    , or by visiting http://www.intel.com . The Intel® Core™2 Duo processor, Intel® Pentium® Dual Core processor and Intel® Pentium® 4 processor may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are
  • Intel E2180 | Design Guide - Page 3
    Case Temperature Measurement Guidelines 32 4 Thermal Management Logic and Thermal Monitor Feature 33 4.1 Processor Power Dissipation 33 4.2 Thermal Monitor Implementation 33 4.2.1 4.2.2 4.2.3 4.2.4 4.2.5 4.2.6 4.2.7 4.2.8 4.2.9 PROCHOT# Signal 34 Thermal Control Circuit 34 Thermal
  • Intel E2180 | Design Guide - Page 4
    6.3.3 Structural Reliability Testing 61 Power Cycling 63 Recommended BIOS/CPU/Memory Test Procedures 63 6.4 Material and Recycling Requirements 63 6.5 Safety Requirements 64 6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ......64 6.7 Reference Attach Mechanism 65
  • Intel E2180 | Design Guide - Page 5
    75 A.2.2 Motherboard Deflection Metric Objective and Scope 89 D.2 Supporting Test Equipment 89 D.3 Thermal Set Points 109 Minimum Fan Speed Set Point 110 E.2 Board and System Implementation 111 E.2.1 Choosing Fan Speed Control Settings 128 Appendix I Intel Enabled Reference Solution
  • Intel E2180 | Design Guide - Page 6
    Intel Type II TMA 65W Reference Design 50 Figure 5-5. Upward Board Deflection During Shock 51 Figure 5-6. Minimum Required Processor Bottom View of Copper Core Applied by TC-1996 Grease 775-LAND LGA Package 94 Figure 7-15. IHS Groove at 6 o'clock Exit Orientation Relative to the LGA775 Socket 94
  • Intel E2180 | Design Guide - Page 7
    Figure 7-38. Thermistor Set Points 110 Figure 113 Figure 7-42. Temperature Range = 10 °C 114 Figure 7-43. On- 7-47. ATX/µATX Motherboard Keep-out Footprint Definition Intel® D60188-001 Reference Solution Assembly 143 Figure 7-62. Intel® D60188-001 Reference Solution Heatsink 144 Figure 7-63. Intel
  • Intel E2180 | Design Guide - Page 8
    Tables Table 2-1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions............24 Table 2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions...24 Table 5-1. Balanced Technology Extended (BTX) Type II Reference TMA Performance 42 Table 5-2. Acoustic Targets 43
  • Intel E2180 | Design Guide - Page 9
    Revision Date • Initial release. • Added Intel® Core™2 Duo Desktop processor E4400 at Tc-max of 73.3 °C. • Added Intel® Pentium® Dual Core processor E2180 specifications • Added Intel® Pentium® Dual Core processor E2160 and E2140 at Tcmax of 73.3 °C • Added Intel® Core™2 Duo Desktop processor E4600
  • Intel E2180 | Design Guide - Page 10
    10 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 11
    on single processor systems using the Intel® Core™2 Duo processor E6000 and E4000 series, Intel® Pentium® Dual Core processor E2000 series, and Intel® Celeron® DualCore processor E1000Δ series. The concepts given in this document are applicable to any system form factor. Specific examples used
  • Intel E2180 | Design Guide - Page 12
    E4300 • Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C applies to the Intel® Pentium® Dual Core processors E2220, E2200, E2180, E2160, and E2140 • Intel® Celeron® dual-core processor E1000 Series of Tc-max of 73.3 °C applies to the Intel® Celeron ® dual-core processor E1200
  • Intel E2180 | Design Guide - Page 13
    Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Series Datasheet Intel® Pentium® Dual-Core Desktop Processor E2000 Series Datasheet Intel® Celeron ® Dual-Core Processor E1000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification
  • Intel E2180 | Design Guide - Page 14
    surface mount socket designed to accept the processors in the 775-Land LGA package. ACPI Bypass Advanced Configuration and Power Interface. a reference to change the duty cycle of the PWM signal. TCONTROL is the specification limit for use with the on-die thermal diode. Pulse width modulation is a
  • Intel E2180 | Design Guide - Page 15
    packaged in a 775-Land LGA package that interfaces with the motherboard via a LGA775 socket. Refer to the datasheet for detailed mechanical specifications. The processor connects to the motherboard through a land grid array (LGA) surface mount socket. The socket contains 775 contacts arrayed about
  • Intel E2180 | Design Guide - Page 16
    Socket Mechanical Design Guide for further information about the LGA775 socket. The processor package has mechanical load limits that are specified in the processor the IHS, it should not exceed the corresponding specification given in the processor datasheet. • When a compressive static load is
  • Intel E2180 | Design Guide - Page 17
    the system must support. The overall structural design of the motherboard and the system socket load plate (refer to the LGA775 Socket Mechanical Design Guide for further information). 2.1.2.2 Heatsink Clip Load Requirement The attach mechanism for the heatsink developed to support the processor
  • Intel E2180 | Design Guide - Page 18
    socket seating plane above the motherboard after reflow, given in the LGA775 Socket Mechanical Design Guide motherboard. 2.2 Thermal Requirements Refer to the datasheet for the processor thermal specifications. The majority of processor power in x 1.474 in] 775-Land LGA processor package with a 28.7
  • Intel E2180 | Design Guide - Page 19
    temperature as a function of processor power dissipation. The TDP and Maximum equivalent to Intel BTX TMA Type II reference design (see the Chapter 5) should be designed to manage the processor TDP at the reference design. For an example of Intel® Core™2 Duo processor with 4 MB cache at Tc-max
  • Intel E2180 | Design Guide - Page 20
    compliance to the thermal profile, a measurement of the actual processor power dissipation is required. The measured power is plotted on the Thermal Profile to determine the maximum case temperature. Using the example in Figure 2-3 for the Intel® Core™2 Duo processor with 4 MB cache at Tc-max of 60
  • Intel E2180 | Design Guide - Page 21
    Processor Thermal/Mechanical Information 2.3 TCONTROL will dissipate more power than a part with lower value (farther from 0, e.g., more negative number) of TCONTROL when running the same application. This is achieved in part by using the ΨCA vs. RPM and RPM vs. Acoustics (dBA) performance curves
  • Intel E2180 | Design Guide - Page 22
    components, defined for the platforms designed with the LGA775 socket in Appendix H of this design guide. • The motherboard primary side height constraints defined in the ATX Specification V2.1 and the microATX Motherboard Interface Specification V1.1 found at http://www.formfactors.org/. The
  • Intel E2180 | Design Guide - Page 23
    strategy and design is reviewed in depth in the latest version of the Balanced Technology Extended (BTX) System Design Guide. Note: The 550g Note: The chipset components on the board are affected by processor heatsink mass. Exceeding these limits may require the evaluation of the chipset for shock
  • Intel E2180 | Design Guide - Page 24
    is 5 °C. Table 2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions Boxed Processor for Intel® Core™2 Duo Processor E6000 and E4000 Series, Intel® Pentium® Dual Core Processor E2000 Series, and Intel® Celeron® Dual- Core Processor E1000 Series Heatsink Inlet Temperature 40
  • Intel E2180 | Design Guide - Page 25
    limit the size, number, placement, and types of fans that can be used in a design. • The thermal design power (TDP) of the processor, and the corresponding maximum TC Intel® Components using 775-Land LGA Package and LGA775 Socket documentation provides Best Known Methods for all aspects LGA775 socket
  • Intel E2180 | Design Guide - Page 26
    Processor Thermal/Mechanical Information § 26 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 27
    ΨCA = TC = TA = PD = Case-to-local ambient thermal characterization parameter (°C/W) Processor case temperature (°C) Local ambient temperature in chassis at processor (°C) Processor total power dissipation (W) (assumes all power dissipates through the IHS) The case-to-local ambient thermal
  • Intel E2180 | Design Guide - Page 28
    . Figure 3-1. Processor Thermal Characterization Parameter Relationships TA Heatsink TIM IHS Processor ΨCA TS TC LGA775 Socket System Board 3.1.1 targets. The example power and temperature numbers used here are not related to any specific Intel processor thermal specifications, and are for
  • Intel E2180 | Design Guide - Page 29
    of the thermal solution on real processors and on fully integrated systems. The Intel maximum power application enables steady power dissipation on a processor to assist in this testing. This maximum power application is provided by Intel. Local Ambient Temperature Measurement Guidelines The
  • Intel E2180 | Design Guide - Page 30
    , the motherboard should be populated with significant elements like memory cards, graphic card, and chipset heatsink. check its speed setting against air temperature. When measuring TA in a chassis with a live motherboard, add-in fan regulation and power the fan directly, based on guidance
  • Intel E2180 | Design Guide - Page 31
    Thermal Metrology Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink Note: Drawing Not to Scale Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink Note: Drawing Not to Scale Thermal and Mechanical Design Guidelines 31
  • Intel E2180 | Design Guide - Page 32
    D defines a reference procedure for attaching a thermocouple to the IHS of a 775-Land LGA processor package for TC measurement. This procedure takes into account the specific features of the 775-Land LGA package and of the LGA775 socket for which it is intended. § 32 Thermal and Mechanical Design
  • Intel E2180 | Design Guide - Page 33
    to reduce the power consumption of a processor, and Intel is aggressively pursuing low power design techniques. For example, decreasing the operating voltage, reducing unnecessary transistor activity, and using more power efficient circuits can significantly reduce processor power consumption. An on
  • Intel E2180 | Design Guide - Page 34
    settings within the processor. It is asserted any time the processor the processor temperature of either core reaches the TCC processor to operate within specifications. The Thermal Monitor's TCC, when active, will attempt to lower the processor temperature by reducing the processor power consumption
  • Intel E2180 | Design Guide - Page 35
    bus-to-core multiplier to its minimum available value) and input voltage identification (VID) value. This combination of reduced frequency and VID results in a reduction in processor power consumption. A processor enabled for TM2 includes two operating points, each consisting of a specific operating
  • Intel E2180 | Design Guide - Page 36
    (model specific register). Enabling the Thermal Control Circuit allows the processor to attempt to maintain a safe operating temperature without the need for special software drivers or interrupt handling routines. When the Thermal Control Circuit has been enabled, processor power consumption will
  • Intel E2180 | Design Guide - Page 37
    status of the processor. The power reduction mechanism of thermal monitor can also be activated manually using an "on-demand" mode. Refer to Section 4.2.5 for details on this feature. 4.2.5 On-Demand Mode For testing purposes, the thermal control circuit may also be activated by setting bits in the
  • Intel E2180 | Design Guide - Page 38
    system designed to meet the thermal profile specification published in the processor datasheet greatly reduces the probability of real of the processor than the thermal diode. This is achieved due to a smaller foot print and decreased sensitivity to noise. Since the DTS is factory set on a per
  • Intel E2180 | Design Guide - Page 39
    Tcontrol= -10 70 0 60 20 50 Temperature 30 40 Power 40 30 50 20 Fan Speed 60 10 70 Time Note: The processor has both Feature Set Overview. For additional information on the PECI, see the datasheet. The PECI bus is available on pin G5 of the LGA 775 socket. Intel chipsets
  • Intel E2180 | Design Guide - Page 40
    Thermal Management Logic and Thermal Monitor Feature QST), see Chapter 7 and the Intel® Quiet System Technology Configuration and Tuning Manual. Intel has worked with many vendors that provide fan speed control devices to provide PECI host controllers. Please consult the local representative for
  • Intel E2180 | Design Guide - Page 41
    thermal module assembly is a Type II BTX compliant design and is compliant with the reference BTX motherboard keep-out and height recommendations a TA assumption of 35.5 °C for the Intel reference thermal solution at the processor fan heatsink inlet discussed Section 3.3. The analysis assumes
  • Intel E2180 | Design Guide - Page 42
    in the die size. 3. BTX Type II reference TMA is the higher thermal solution performance of the Intel® Core™2 Duo processor with 4 MB / 2 MB cache at Tc-max of 72.0 °C, Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 73.3 °C, Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73
  • Intel E2180 | Design Guide - Page 43
    Fan Speed RPM Thermistor Set Point Acoustic Thermal is predicting that the power supply fan will be support the processor thermal profile, additional acoustic improvements can be achieved at lower processor workload by using the TCONTROL specifications described in Section 2.2.3. Intel
  • Intel E2180 | Design Guide - Page 44
    fans speed will be driven by the system airflow requirements and not the processor thermal limits. Figure 5-1 shows the effective fan curve for the reference the reference TMA with the flow portioning device, extrusion and an AVC Type II fan geometry. When selecting a fan for use in the TMA care
  • Intel E2180 | Design Guide - Page 45
    10.0 15.0 20.0 25.0 30.0 35.0 Airflow (cfm ) 5.1.4 Voltage Regulator Thermal Management The BTX TMA is integral to the cooling of the processor voltage provide effective cooling for the voltage regulator (VR) chipset and system memory components on the motherboard. The Thermal Module is
  • Intel E2180 | Design Guide - Page 46
    the VR when the VR power is at a maximum in order to support the 775_VR_CONFIG_06 processors at TDP power dissipation and the chassis external processor C is met at the targeted altitude. 5.1.6 Reference Heatsink Thermal Validation The Intel reference heatsink will be validated within the specific
  • Intel E2180 | Design Guide - Page 47
    /Hz (slope up) 20 Hz to 500 Hz @ 0.01 g2/Hz (flat) • Power Spectral Density (PSD) Profile: 2.2 G RMS Figure 5-2. Random Vibration PSD 0.1 0.01 0.001 Vibration System Control Limit - 3 dB Control Limit g2/Hz 0.0001 1 10 100 Hz 1000 5.2.1.2 Shock Test Procedure Recommended performance requirement for
  • Intel E2180 | Design Guide - Page 48
    then BIOS/CPU/Memory motherboard surface due to impact of heatsink or heatsink attach mechanism. 5. No visible physical damage to the processor package. 6. Successful BIOS/Processor/memory test of post-test samples. 7. Thermal compliance testing to demonstrate that the case temperature specification
  • Intel E2180 | Design Guide - Page 49
    setup should include the following components, properly assembled and/or connected: • Appropriate system motherboard • Processor • All enabling components, including socket and thermal solution parts • Power supply • Disk drive • Video card • DIMM • Keyboard • Monitor The pass criterion is that
  • Intel E2180 | Design Guide - Page 50
    inches], for compliance with the motherboard primary side height constraints defined in the BTX Interface Specification for Zone A, found at http://www.formfactors.org. Figure 5-4. Intel Type II TMA 65 W Reference Design Development vendor information for the Intel Type II TMA Reference Solution is
  • Intel E2180 | Design Guide - Page 51
    strategy for the Intel Type II TMA is to minimize upward board deflection during shock to help protect the LGA775 socket. BTX thermal solutions against fatigue failure of socket solder joint. The allowable preload range for BTX platforms is provided in Table 5-4, but the specific target value is a
  • Intel E2180 | Design Guide - Page 52
    65W Type II TMA reference design is 484 N/mm (2764 lb / in). Note: These preload and stiffness recommendations are specific to the TMA mounting scheme that meets the BTX Interface Specification and Support Retention Mechanism (SRM) Design Guide. For TMA mounting schemes that use only the motherboard
  • Intel E2180 | Design Guide - Page 53
    required preload is approximately 10-15N greater than the values stipulated in Figure 5-6; however, Intel has not conducted any 6x32 screws in the thermal module pass through the rear holes in the motherboard designated in the socket keep-in Figure 7-50 through Figure 7-54 in Appendix H and screw
  • Intel E2180 | Design Guide - Page 54
    Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 54 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 55
    of the heatsink. The thermal technology required for the processor. The processors of Intel® Core™2 Duo processor with 4 MB cache at Tc-max of 60.1 °C, Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 61.4 °C and Intel® Pentium® Dual Core processor E2000 series at Tc-max of 61.4 °C require
  • Intel E2180 | Design Guide - Page 56
    - Exploded View The processors of Intel® Core™2 Duo processor with 4 MB / 2 MB cache at Tc-max of 72.0 °C, Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 73.3 °C, Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C, and Intel® Celeron® Dual-Core processor E1000 series at
  • Intel E2180 | Design Guide - Page 57
    Core Applied by TC-1996 Grease The ATX motherboard keep-out and the height recommendations defined Section 6.6 remain the same for a thermal solution for the processor in the 775-Land LGA the energized fan by the user during user servicing. Note: Development vendor information for the reference
  • Intel E2180 | Design Guide - Page 58
    Reference Heatsink Performance Processor Intel® Core™2 Duo processor with 4 MB / 2 MB cache at Tc-max of 72.0 °C Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 73.3 °C Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C Intel® Celeron® Dual-Core processor E1000 series at
  • Intel E2180 | Design Guide - Page 59
    Heatsink (E18764-001) Fan Speed RPM Thermistor Set Point Acoustic Thermal Requirements, Ψca Notes 3900 High TA = 40 °C 2000 Low TA = 30 °C 5.0 BA 3.5 BA • 0.49 °C/W (Intel Core™2 Duo processor, 4 MB / 2 MB at Tc-max of 72.0 °C) • 0.51 °C/W (Intel Core™2 Duo processor, 2 MB at Tc-max of 73
  • Intel E2180 | Design Guide - Page 60
    the processor is met at the targeted altitude. C 6.2.4 Heatsink Thermal Validation Intel recommends evaluation of the heatsink within the specific in strict compliance with the ATX specification which allows an obstruction as low as 76.2 mm above the motherboard surface in Area A. 60 Thermal and
  • Intel E2180 | Design Guide - Page 61
    10 min/axis, 3 axes Frequency Range: 5 Hz to 500 Hz Power Spectral Density (PSD) Profile: 3.13 G RMS Figure 6-4. Random Vibration PSD 0.1 3.13GRMS (10 001 1 5 Hz 10 100 Frequency (Hz) 500 Hz 1000 6.3.1.2 Shock Test Procedure Recommended performance requirement for a motherboard: • Quantity: 3
  • Intel E2180 | Design Guide - Page 62
    then BIOS/CPU/Memory motherboard surface due to impact of heatsink or heatsink attach mechanism. 5. No visible physical damage to the processor package. 6. Successful BIOS/Processor/memory test of post-test samples. 7. Thermal compliance testing to demonstrate that the case temperature specification
  • Intel E2180 | Design Guide - Page 63
    setup should include the following components, properly assembled and/or connected: • Appropriate system motherboard • Processor • All enabling components, including socket and thermal solution parts • Power supply • Disk drive • Video card • DIMM • Keyboard • Monitor The pass criterion is that
  • Intel E2180 | Design Guide - Page 64
    for Intel Reference ATX Thermal Mechanical Design Figure 7-47, Figure 7-48 and Figure 7-49 in Appendix H gives detailed reference ATX/μATX motherboard keep- found in both ATX Specification V2.1 and microATX Motherboard Interface Specification V1.1 documents. 64 Thermal and Mechanical Design
  • Intel E2180 | Design Guide - Page 65
    minimize upward board deflection during shock to help protect the LGA775 socket. The reference design uses a high clip stiffness that resists by the reference design is 191.3 N ± 44.5 N [43 lb ± 10 lb]. Note: Intel reserves the right to make changes and modifications to the design as necessary to the
  • Intel E2180 | Design Guide - Page 66
    can be used by other 3rd party cooling solutions. The attach mechanism consists of: • A metal attach clip that interfaces with the heatsink core, see Appendix H, Figure 7-55 and Figure 7-56 for the component drawings. • Four plastic fasteners, see Appendix H, Figure 7-57, Figure 7-58, Figure 7-59
  • Intel E2180 | Design Guide - Page 67
    Interfacing to Reference Clip Fan Fin Array Core See Detail A Clip Fin Array Clip 1.6 mm Core Detail A Figure 6-9. Critical Core Dimension 1.00 +/- 0.10 mm 1.00 mm min Φ38.68 +/- 0.30 mm Φ36.14 +/- 0.10 mm Gap required to avoid core surface blemish during clip assembly. Recommend 0.3 mm
  • Intel E2180 | Design Guide - Page 68
    ATX Thermal/Mechanical Design Information 68 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 69
    be met before evaluating or configuring a system with Intel QST. 7.1 Intel® QST Algorithm The objective of Intel QST is to minimize the system acoustics by more closely controlling the thermal sensors to the corresponding processor or chipset device TCONTROL value. This is achieved by the use
  • Intel E2180 | Design Guide - Page 70
    processor heatsink fan and a 2nd fan in the system. By placing a factor in this matrix additional the Intel QST could command the processor temperature readings and specific temperature targets. a fixed temperature vs. PWM output relationship temperature, the algorithm will instruct the fan to speed
  • Intel E2180 | Design Guide - Page 71
    sensor. For Intel QST, the TCONTROL for the processor and chipset are to be Temp / ΔTime Three gain values are used to control response of algorithm. • Kp = proportional gain • Ki = Integral gain • Kd = derivative gain The Intel® Quiet System Technology (Intel® QST) Configuration and Tuning Manual
  • Intel E2180 | Design Guide - Page 72
    Figure 7-3 and listed below: • ME system (S0-S1) with Controller Link connected and powered • DRAM with Channel A DIMM 0 installed and 2MB reserved for Intel® QST FW execution • SPI Flash with sufficient space for the Intel® QST Firmware • SST-based thermal sensors to provide board thermal data for
  • Intel E2180 | Design Guide - Page 73
    -die thermal diode that is in all of the processors in the 775-land LGA packages shipped before the Intel® Core™2 Duo processor. With the proper configuration information the ME can be accommodate inputs from PECI or SST for the processor socket. Additional SST sensors can be added to monitor system
  • Intel E2180 | Design Guide - Page 74
    The SPI flash should be programmed with the hardware configuration of the motherboard and initial settings for fan control, fan monitoring, voltage and thermal monitoring. This initial data is generated using the Intel provided Configuration Tool. At the system integrator the Configuration Tool can
  • Intel E2180 | Design Guide - Page 75
    tensile stress is originally created when, after inserting a processor into the socket, the LGA775 socket load plate is actuated. In addition, solder joint shear AND LGA775 socket protection against fatigue failure. Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference
  • Intel E2180 | Design Guide - Page 76
    reference design for ATX//µATX form factor. A.2.2 Motherboard Deflection Metric Definition Motherboard deflection is measured along either diagonal (refer to 7-1. Board Deflection Configuration Definitions Configuration Parameter Processor + Socket load plate d_ref yes d_BOL yes d_EOL yes
  • Intel E2180 | Design Guide - Page 77
    LGA775 Socket Heatsink Loading Figure 7-6. Board Deflection Definition d1 d'1 d2 d'2 remain within the static load limits defined in the processor datasheet at all times. 2. Board deflection should not exceed motherboard manufacturer specifications. Thermal and Mechanical Design Guidelines 77
  • Intel E2180 | Design Guide - Page 78
    LGA775 Socket Heatsink Loading A.2.4 Board Deflection Metric Implementation Example This section is for is a result of the creep phenomenon. The example accounts for the creep expected to occur in the motherboard. It assumes no creep to occur in the clip. However, there is a small amount of creep
  • Intel E2180 | Design Guide - Page 79
    LGA775 Socket Heatsink Loading Figure 7-7. Example: Defining Heatsink Preload Meeting Board Deflection Limit A.2.5 Additional Considerations Intel recommends (Refer to processor datasheet) 2. Board deflection should not exceed motherboard manufacturer specifications. Thermal and Mechanical Design
  • Intel E2180 | Design Guide - Page 80
    will collaborate with vendors participating in its third party test house program to evaluate third party solutions. Vendor information now is available in Intel® Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 80 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 81
    socket • Quantify preload degradation under bake conditions. Note: This document reflects the current metrology used by Intel. Intel the heatsink installation on the processor and motherboard (Refer to Figure 7-9). load of 15 N [3.3 lb]. Figure 7-10 shows an example using the reference design. Note
  • Intel E2180 | Design Guide - Page 82
    Heatsink Clip Load Metrology Remarks: Alternate Heatsink Sample Preparation As mentioned above, making sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful results. An alternate method to make sure that the test setup will measure loads representative
  • Intel E2180 | Design Guide - Page 83
    to maintain load cell in position during heatsink installation Load cell protrusion (Note: to be optimized depending on assembly stiffness) Figure 7-10. Preload Test Configuration Preload Fixture (copper core with milled out pocket) Load Cells (3x) Thermal and Mechanical Design Guidelines 83
  • Intel E2180 | Design Guide - Page 84
    plate, attach to chassis, etc.). Prior to any test, make sure that the load cell has been calibrated against known loads, following load cell vendor's instructions. 84 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 85
    processor) in the socket 3. Assemble the heatsink reworked with the load cells to motherboard as shown for the reference design example in Figure 7-10 of the bake test 5. Remove assembly from thermal chamber and set into room temperature conditions 6. Record continuous load cell data for next
  • Intel E2180 | Design Guide - Page 86
    Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 87
    To optimize a heatsink design, it is important to understand the impact of factors related to the interface between the processor and the heatsink base. Specifically, the bond line thickness, interface material area and interface material thermal conductivity should be managed to realize the most
  • Intel E2180 | Design Guide - Page 88
    Thermal Interface Management 88 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 89
    775-land LGA package for TC measurement. This procedure takes into account the specific features of the 775-land LGA package and of the LGA775 socket following table as a convenience to Intel's general customers and the list Whipple Road, Hayward, Ca 94544 Supporting Test Equipment To apply the
  • Intel E2180 | Design Guide - Page 90
    of America Super glue w/thermal characteristics Loctite* 7452 for fast glue curing For holding thermocouple in place Omega *,36 gauge, "T" Type (see note 2 for ordering information) Calibration and Control Omega*, stable 0 ºC temperature source for calibration and offset Omega *, temperature source
  • Intel E2180 | Design Guide - Page 91
    attempting to perform temperature case measurement. Intel recommends checking the meter probe set against known standards. This should be done the IHS notch to allow the thermocouple wire to be routed under the socket lid. This will protect the thermocouple from getting damaged or pinched when
  • Intel E2180 | Design Guide - Page 92
    Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 o'clock Exit Case Temperature Reference Metrology 92 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 93
    Case Temperature Reference Metrology Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 o'clock Exit (Old Drawing) Thermal and Mechanical Design Guidelines 93
  • Intel E2180 | Design Guide - Page 94
    package) is shown in Figure 7-14 for the 775-Land LGA package IHS. Figure 7-14. IHS Groove at 6 o'clock Exit on the 775-LAND LGA Package IHS Groove Pin1 indicator When the processor is installed in the LGA775 socket, the groove is parallel to the socket load lever, and is toward the IHS notch as
  • Intel E2180 | Design Guide - Page 95
    target temperature of 153 - 155 °C. Note: To avoid damage to the processor ensure the IHS temperature does not exceed 155 °C. As a complement to the probe of the DMM (measurement should be about~3.0 ohms for 36-gauge type T thermocouple). 10. Straighten the wire for about 38 mm [1 ½ inch] from the
  • Intel E2180 | Design Guide - Page 96
    Case Temperature Reference Metrology Figure 7-17. Bending the Tip of the Thermocouple D.5.2 Thermocouple Attachment to the IHS 12. Clean groove and IHS with Isopropyl Alcohol (IPA) and a lint free cloth removing all residues prior to thermocouple attachment. 13. Place the thermocouple wire inside
  • Intel E2180 | Design Guide - Page 97
    7-19. Thermocouple Bead Placement (A) (B) 16. Place the package under the microscope to continue with process. It is also recommended to use a fixture (like processor tray or a plate) to help holding the unit in place for the rest of the attach process. 17. While still at the microscope, press the
  • Intel E2180 | Design Guide - Page 98
    Case Temperature Reference Metrology Figure 7-20. Position Bead on the Groove Step Kapton* tape Wire section into the groove to prepare for final bead placement Figure 7-21. Detailed Thermocouple Bead Placement TC Wire with Insulation IHS with Groove Figure 7-22. Third Tape Installation TC Bead
  • Intel E2180 | Design Guide - Page 99
    Case Temperature Reference Metrology 18. Place a 3rd piece of tape at the end of the step in the groove as shown in Figure 7-22. This tape will create a solder dam to prevent solder from flowing into the larger IHS groove section during the melting process. 19. Measure resistance from thermocouple
  • Intel E2180 | Design Guide - Page 100
    Case Temperature Reference Metrology Figure 7-24. Applying Flux to the Thermocouple Bead 21. Cut two small pieces of solder 1/16 inch (0.065 inch / 1.5 mm) from the roll using tweezers to hold the solder while cutting with a fine blade(see Figure 7-25) Figure 7-25. Cutting Solder 22. Place the two
  • Intel E2180 | Design Guide - Page 101
    Case Temperature Reference Metrology Figure 7-26. Positioning Solder on IHS D.5.3 23. Measure the resistance from the thermocouple end wires again using the DMM (refer to Section D.5.1.step 2) to ensure the bead is still properly contacting the IHS. Solder Process 24. Make sure the thermocouple
  • Intel E2180 | Design Guide - Page 102
    Figure 7-27. Solder Station Setup Case Temperature Reference Metrology 27. Remove the land side protective cover and place the device to be soldered in the solder station. Make sure the thermocouple wire for the device being soldered is exiting the heater toward you. Note: Do not touch the copper
  • Intel E2180 | Design Guide - Page 103
    Case Temperature Reference Metrology Figure 7-28. View Through Lens at Solder Station Figure 7-29. Moving Solder back onto Thermocouple Bead Thermal and Mechanical Design Guidelines 103
  • Intel E2180 | Design Guide - Page 104
    Case Temperature Reference Metrology 31. Lift the heater block and magnified lens, using tweezers quickly rotate the device 90 degrees clockwise. Using the back of the tweezers press down on the solder this will force out the excess solder Figure 7-30. Removing Excess Solder 32. Allow the device to
  • Intel E2180 | Design Guide - Page 105
    Case Temperature Reference Metrology D.5.4 Cleaning and Completion of Thermocouple Installation 33. Remove the device from the solder station and continue to monitor IHS Temperature with a handheld meter. Place the device under the microscope and remove the three pieces of Kapton* tape with
  • Intel E2180 | Design Guide - Page 106
    7-33). Figure 7-33. Filling Groove with Adhesive 38. To speed up the curing process apply Loctite* Accelerator on top of the Adhesive and let it set for a couple of minutes (see Figure 7-34). Figure 7-34. Application of Accelerant 106 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 107
    are voids in the adhesive, refill the voids with adhesive and shave a second time. 40. Clean IHS surface with IPA and a wipe. 41. Clean the LGA pads with IPA and a wipe. 42. Replace the land side cover on the device. 43. Perform a final continuity test. 44. Wind the thermocouple wire into
  • Intel E2180 | Design Guide - Page 108
    or bag until it is ready to be used for thermal testing use. D.6 Thermocouple Wire Management When installing the processor into the socket, the thermocouple wire should route under the socket lid, as shown in Figure 7-37. This will keep the wire from getting damaged or pinched when removing and
  • Intel E2180 | Design Guide - Page 109
    processors in the 775-land LGA package • A motherboard with a 4 pin fan header for the processor heatsink fan. • Processor inlet temperature to the processor fan heatsink. Determine Thermistor Set Points A thermistor implemented TC-MAX is not exceeded for TDP power at a given ambient temperature. The
  • Intel E2180 | Design Guide - Page 110
    Set processor voltage regulator, or by functional limits of the fan design. Per the Fan Specification for 4 wire PWM Controlled Fans; there are three possible options to consider • Type Type C: The fan will stop running when the current provided to the motor windings is insufficient to support
  • Intel E2180 | Design Guide - Page 111
    Contact your Intel Field Sales settings that need to be considered are: • The temperature when the fan will begin to accelerate in response to the on-die thermal sensor temperature (TLOW). • The temperature where the fan is operating at full speed (100% PWM duty cycle). By specification
  • Intel E2180 | Design Guide - Page 112
    There may be vendor specific options that offer enhanced device needs a minimum temperature to set as the threshold to begin increasing THERMTRIP# activates and shuts down the processor The first two cases can create as the thermal control circuit reduces the power. Figure 7-41 is an example of this
  • Intel E2180 | Design Guide - Page 113
    be to consider a slightly larger value such as TRANGE = 10 °C. In this case the design is trading off the acoustic speed is lower The rate of change of ΨCA vs. RPM is an exponential curve with a larger solution can keep up with rate of change in processor power. The rate of change in acoustics (dBA)
  • Intel E2180 | Design Guide - Page 114
    a motherboard design intending to use the Boxed Processor or the enabled reference thermal solution the recommended minimum PWM duty cycle is 20%. Note: Set minimum PWM Duty Cycle only as low as required to meet acoustic requirements. The FSC design needs to accommodate transition from a low power
  • Intel E2180 | Design Guide - Page 115
    TCONTROL The processor thermal specification is comprised of Intel requires monitoring the on-die thermal sensor to implement acoustic fan speed control. The value of the on-die thermal sensor temperature determines which specification power dissipation. Thermal and Mechanical Design Guidelines 115
  • Intel E2180 | Design Guide - Page 116
    Fan Speed Control To use all of the features in the Intel reference heatsink design or the Boxed Processor, system integrators should verify the following functionality is present in the board design. Please refer to the Fan Specification for 4 wire PWM Controlled Fans and Chapter 6 for complete
  • Intel E2180 | Design Guide - Page 117
    output programmable to 21-28 kHz (required). PWM output set to 25 kHz (Suggested) as this value is the design target for the reference and for the Boxed Processor. • External/remote thermal sensor measurement capability (required). Must support PECI and thermal diode using a SST device • External
  • Intel E2180 | Design Guide - Page 118
    the reference and for the Intel® Boxed Processor and the reference design. 2. Use the lowest time available in this range for the device selected. 3. To ensure compliance with the thermal specification, thermal profile and usage of the TSENSOR for fan speed control these setting should not be user
  • Intel E2180 | Design Guide - Page 119
    frequency of 25 kHz is the design target for the reference and for the Intel® Boxed Processor and BTX reference design. 2. Use the lowest time available in this range compliance with the thermal specification, thermal profile and usage of the TSENSOR for fan speed control these setting should not be
  • Intel E2180 | Design Guide - Page 120
    Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 121
    processor power may be low but other system component powers may the component temperature specifications at all operating chipset heatsink and its temperature will rise as the memory controller chipset power increases. Since chipset power 45 and Figure 7-46).The Intel Boxed Boards in BTX form
  • Intel E2180 | Design Guide - Page 122
    . Lisle, IL 60532 1-800-78MOLEX phone 1-630-969-1352 fax [email protected] Figure 7-45. System Airflow Illustration with System Monitor Point Area Identified Power Supply Unit Graphics Add-In Card Memory Monitor Point MCH Thermal Module OM16791 122 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 123
    Balanced Technology Extended (BTX) System Thermal Considerations Figure 7-46. Thermal sensor Location Illustration Thermal Sensor TMA Airflow MCH Heatsink § Thermal and Mechanical Design Guidelines 123
  • Intel E2180 | Design Guide - Page 124
    Balanced Technology Extended (BTX) System Thermal Considerations 124 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 125
    power requirements for proper operation are given Table 7-6. Table 7-6. Fan Electrical Performance Requirements Requirement Maximum Average fan current draw Fan start-up current draw Fan start-up current draw maximum duration Fan header voltage V RPM must be within spec for specified duty cycle In
  • Intel E2180 | Design Guide - Page 126
    Fan Performance for Reference Design § 126 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 127
    Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127
  • Intel E2180 | Design Guide - Page 128
    refer to the reference thermal mechanical enabling components for the processor. Note: Intel reserves the right to make changes and modifications to the design as necessary. Drawing Description ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components
  • Intel E2180 | Design Guide - Page 129
    7-47. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 1 ( 95.00 ) ( 72.00 ) ( 37.50 ) BOARD PRIMARY SIDE SOCKET BALL 1 ( 1.93 ) ( 16.965 ) ZONE REV REVISION HISTORY DESCRIPTION DATE APPROVED ( 1.09 ) SOCKET BALLS D ( 1.17 ) 47
  • Intel E2180 | Design Guide - Page 130
    Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 2 8 7 6 5 4 THIS DRAWING CONTAINS INTEL CONSENT OF INTEL CORPORAT ION. BOARD SECONDARY SIDE D 4X 6.00 4X 10.00 COMPONENT VOLUMETRIC KEEP-INS SOCKET BALL 1 SOCKET & PROCESSOR VOLUMETRIC KEEP-IN
  • Intel E2180 | Design Guide - Page 131
    .00 24.50 19.25 3.00 A 6 5 4 DISCLOSED IN CONFIDENCE AND ITS CONT ENTS OR WRITTEN CONSENT OF INTEL CORPORAT ION. 2X SOCKET & PROCESSOR VOLUMETRIC KEEP-IN 45 X 3.00 29.00 R49.44 R33.29 ( 37.60 ) 14.10 6.60 2.75 C 2.50 45 X 3.50 27.25 37.00 32.85 A 3.00 3.00 120.0 1.00 30
  • Intel E2180 | Design Guide - Page 132
    Figure 7-50. BTX Thermal Module Keep Out Volumetric - Sheet 1 Mechanical Drawings 132 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 133
    Mechanical Drawings Figure 7-51. BTX Thermal Module Keep Out Volumetric - Sheet 2 Thermal and Mechanical Design Guidelines 133
  • Intel E2180 | Design Guide - Page 134
    Figure 7-52. BTX Thermal Module Keep Out Volumetric - Sheet 3 Mechanical Drawings 134 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 135
    Mechanical Drawings Figure 7-53. BTX Thermal Module Keep Out Volumetric - Sheet 4 Thermal and Mechanical Design Guidelines 135
  • Intel E2180 | Design Guide - Page 136
    Figure 7-54. BTX Thermal Module Keep Out Volumetric - Sheet 5 Mechanical Drawings 136 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 137
    SHARPNESS OF EDGES SUBJECT TO HANDLING ARE REQUIRED TO MEET THE UL1439 TEST. G 4X 10 0.2 [ .394 .007 ] 0.5 [.019] AB F 36.44 0.2 7 MATERIAL: D A) TYPE: AISI 1065 COLD DRAWN 58119 SANTA CLARA, CA 95052-8119 RCFH4 HS CLIP, 35mm core SIZE DRAWING NUMBER A1 C85609 REV A B SCALE: NONE
  • Intel E2180 | Design Guide - Page 138
    ZONE A7 W R3.1 [ .122 ] 8 7 6 5 X R1.4 [ .055 ] 133.59 DETAIL B SCALE 20 2.97 [ .117 ] 45 X 0.25 0.05 8 [ .010 .001 ] DETAIL C C SCALE 10 TYP 4 PLACES B DEPARTMENT TMD 4 SIZE DRAWING NUMBER REV A R 2200 MISSION COLLEGE BLVD. CORP. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 A1
  • Intel E2180 | Design Guide - Page 139
    Mechanical Drawings Figure 7-57. Reference Fastener - Sheet 1 Thermal and Mechanical Design Guidelines 139
  • Intel E2180 | Design Guide - Page 140
    Figure 7-58. Reference Fastener - Sheet 2 Mechanical Drawings 140 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 141
    Mechanical Drawings Figure 7-59. Reference Fastener - Sheet 3 Thermal and Mechanical Design Guidelines 141
  • Intel E2180 | Design Guide - Page 142
    Figure 7-60. Reference Fastener - Sheet 4 Mechanical Drawings 142 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 143
    Mechanical Drawings Figure 7-61. Intel® D60188-001 Reference Solution Assembly Thermal and Mechanical Design Guidelines 143
  • Intel E2180 | Design Guide - Page 144
    Figure 7-62. Intel® D60188-001 Reference Solution Heatsink Mechanical Drawings 144 Thermal and Mechanical Design Guidelines
  • Intel E2180 | Design Guide - Page 145
    CONSENT OF INTEL CORPORATION. D 90.0 3.54 2 ZONE REV. REVISION HISTORY DESCRIPTION 1 DATE APPROVED D C B A 4 Thermal and Mechanical Design Guidelines C 46.0 1.81 THERMAL INTERFACE MATERIAL DOW TC-1996 (PRE-APPLIED) FAN TYPE MASS SOUND LEVEL LINEARLY VARIABLE DC 250 GRAMS HIGH SET POINT
  • Intel E2180 | Design Guide - Page 146
    in the tables identify these reference components. End-users are responsible for the verification of the Intel enabled component offerings with the supplier. OEMs and System Integrators are responsible for thermal, mechanical, and environmental validation of these solutions. Table 7-8. D60188
  • Intel E2180 | Design Guide - Page 147
    .c om Wanchi.Chen@Foxcon n.com [email protected] m Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these
  • Intel E2180 | Design Guide - Page 148
    Support and Retention Module _ Michael Tsai 886-3-328-9000 1 Ext.6545 AVC* Type Part numbers were not available at the time of release of this document. Contact the company for part number The user should note that for the 2004 Type I Intel reference Thermal Module Assembly: also meets 2005
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
  • 113
  • 114
  • 115
  • 116
  • 117
  • 118
  • 119
  • 120
  • 121
  • 122
  • 123
  • 124
  • 125
  • 126
  • 127
  • 128
  • 129
  • 130
  • 131
  • 132
  • 133
  • 134
  • 135
  • 136
  • 137
  • 138
  • 139
  • 140
  • 141
  • 142
  • 143
  • 144
  • 145
  • 146
  • 147
  • 148
Document Number:
317804-010
Intel
®
Core
™
2 Duo Processor,
Intel
®
Pentium
®
Dual Core
Processor, and Intel
®
Celeron
®
Dual-Core Processor
Thermal and Mechanical Design Guidelines
Supporting the:
- Intel
®
Core™2 Duo Processor E6000
Δ
and E4000
Δ
Series
- Intel
®
Pentium
®
Dual Core Processor E2000
Δ
Series
- Intel
®
Celeron
®
Dual-Core Processor E1000
Δ
Series
December 2008