Acer Aspire E700 Aspire E700 Service Guide - Page 31

LAN Interface Item Chip Feature Description Intel 82566 • 81-pin, 1.0 mm pitch, 10 mm x 10 mm FCMMAP (BGA) package • IEEE 802.3ab compliant • Robust end to end connections over various cable length • Full duplex at 10/100/1000Mbps and half duplex at 10 or 100Mbps • IEEE 802.3ab auto-negotiation with next page support • 10/100 downshift: automatic link speed adjustment with poor quality cable • Automatic MDI crossover • Advanced cable diagnostics • Footprint compatible with 82562V devices for a single-board dual design (Gigabit and 10/100) • LCI interface for a very low power 10/100 link • Gigabit LAN connect interface: low pin count, high speed interface with special low power idle modes and allows PHY placement proximity to I/O back panel • Three LED outputs • Clock supplied to MAC • Full chip power down: lowest power state support • Power consumption less than 1.16W Hardware Monitor Function Item Description Feature • Smart fan control system, Thermal Cruise and Speed Cruise support • Six VID input pins for CPU Vcore identification • Two thermal inputs from optionally remote thermistors or 2N3904 transistors or Pentium 4 thermal diode output • Four external voltage detect inputs • Three intrinsic voltage monitoring (typical for Vbat, +5VSB, +5CC) • Two fan speed monitoring inputs • Two fan speed control (DC analog output) • WATCHDOG comparison of all monitored items • Overheat indication output • Issue SMI#, IRQ, OVT# to activate system protection Chapter 1 23