Compaq DL360 Fully-Buffered DIMM technology in HP ProLiant servers
Compaq DL360 - ProLiant - Photon Manual
UPC - 720591252670
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- Compaq DL360 | Fully-Buffered DIMM technology in HP ProLiant servers - Page 1
ProLiant servers technology brief Abstract...2 Introduction...2 Performance barriers for traditional DIMM 2 Fully-Buffered DIMM architecture ...4 Benefits...6 Simplified board design ...6 Higher memory capacity ...6 Higher performance...7 Improved reliability...7 Challenges ...8 Latency ...8 Power - Compaq DL360 | Fully-Buffered DIMM technology in HP ProLiant servers - Page 2
performance in HP ProLiant servers. Introduction HP ProLiant servers provide balanced system architectures that deliver peak performance per watt of power. A balanced system architecture is one in which the three main server subsystems-processing, memory Error correcting code 2 Typical SDRAM DIMMs have - Compaq DL360 | Fully-Buffered DIMM technology in HP ProLiant servers - Page 3
. For future generations of high-performance servers, neither option was acceptable. Future generations of servers require an improved memory architecture to achieve higher memory bandwidth and capacity. Consequently, JEDEC3 developed the Fully-Buffered DIMM specification, a serial interface that - Compaq DL360 | Fully-Buffered DIMM technology in HP ProLiant servers - Page 4
Fully-Buffered DIMM architecture The FB-DIMM architecture has serial links between the memory controller and the FB-DIMMs, which are connected in a daisy chain configuration (Figure 3). Relative to the memory controller, there are 10 outbound links and 14 inbound links, also known as southbound and - Compaq DL360 | Fully-Buffered DIMM technology in HP ProLiant servers - Page 5
are targeted for a different DIMM. The targeted AMB performs a read or write operation to local DRAM devices the DRAM devices and transmits it to the memory controller through the inbound links. Inbound and data rate of the inbound link. For example, when using DDR2 533 DRAM on the FB-DIMM, the peak - Compaq DL360 | Fully-Buffered DIMM technology in HP ProLiant servers - Page 6
memory capacity • Higher performance • Improved reliability Simplified board design FB-DIMMs use a 240-pin socket similar to that used refer to Memory technology evolution: an overview of system memory technologies technology brief at http://h18004.www1.hp.com/products/servers/technology/whitepapers - Compaq DL360 | Fully-Buffered DIMM technology in HP ProLiant servers - Page 7
serial links between the memory controller and AMB enable higher performance by the memory subsystem. The two devices use of ECC to protect commands and address information in the event of a soft error. This feature can help reduce instances where the soft error could disrupt server performance - Compaq DL360 | Fully-Buffered DIMM technology in HP ProLiant servers - Page 8
. Transmission latency is measured from the time a read request is initiated to the time the memory controller server's internal fans. To estimate the power consumption for all current HP ProLiant servers that support FB-DIMMs, use the power calculators at http://www.hp.com/configurator/calc/Power - Compaq DL360 | Fully-Buffered DIMM technology in HP ProLiant servers - Page 9
DIMMs instead of single-rank DIMMs if possible. For example, using eight 1-GB DIMMs instead of sixteen 512MB DIMMs will improve performance. This has the added benefit of using less power per GB of memory. Also, when configuring memory, keep the channels balanced to minimize the latency per channel - Compaq DL360 | Fully-Buffered DIMM technology in HP ProLiant servers - Page 10
Hyperlink JEDEC Web site http://www.jedec.org HP Advanced Memory Protection Memory technology evolution http://h18004.www1.hp.com/products/servers/technology/whitepapers/advtechnology.html http://h18004.www1.hp.com/products/servers/technology/whitepapers/advtechnology.html Call to action Send
Fully-Buffered DIMM technology in HP ProLiant servers
technology brief
Abstract
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2
Introduction
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2
Performance barriers for traditional DIMM
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2
Fully-Buffered DIMM architecture
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4
Benefits
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6
Simplified board design
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6
Higher memory capacity
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6
Higher performance
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7
Improved reliability
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7
Challenges
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8
Latency
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8
Power and thermal loads
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8
Performance tuning, achieving maximum performance
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9
Conclusion
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9
For more information
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10
Call to action
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10