Intel BOXDQ965GFEKR Product Specification

Intel BOXDQ965GFEKR Manual

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  • Intel BOXDQ965GFEKR | Product Specification - Page 1
    Product Specification September 2006 Order Number: D56021-001US The Intel® Desktop Board DQ965GF may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DQ965GF
  • Intel BOXDQ965GFEKR | Product Specification - Page 2
    Intel® Desktop Board DQ965GF Technical Product Specification. Date September 2006 This product specification applies to only the standard Intel® Desktop Board DQ965GF with BIOS identifier CO96510J.86A. Changes to this specification will be published in the Intel Desktop Board DQ965GF Specification
  • Intel BOXDQ965GFEKR | Product Specification - Page 3
    this level of information. It is specifically not intended for general audiences. What This Document Contains Chapter 1 2 3 4 5 Description A description of the hardware used on the board A map of the resources of the board The features supported by the BIOS Setup program A description of the
  • Intel BOXDQ965GFEKR | Product Specification - Page 4
    Intel Desktop Board DQ965GF Technical Product Specification Other Common Notation # GB GB/sec Gbit KB Kbit kbits/sec MB MB/sec Mbit Mbit/sec xxh x.x V * Used after a signal name to identify an
  • Intel BOXDQ965GFEKR | Product Specification - Page 5
    13 1.1.3 Board Layout 14 1.1.4 Block Diagram 16 1.2 Online Support 17 1.3 Processor 17 1.4 System Memory 18 1.4.1 Memory Configurations 20 1.5 Intel® Virtualization Technology (Intel® VT 26 1.6 Intel® vPro™ Technology Support 27 1.7 Intel® Q965 Express Chipset 28 1.7.1 Intel Q965 Graphics
  • Intel BOXDQ965GFEKR | Product Specification - Page 6
    Intel Desktop Board DQ965GF Technical Product Specification 2 Technical Reference 2.1 Memory Map 49 2.1.1 Addressable Memory 49 2.2 DMA Channels 51 2.3 Fixed I/O Map 52 2.4 PCI Configuration Space Map 53 2.5 Interrupts 54 2.6 PCI Interrupt Routing Map 55 2.7 Connectors and Headers 56 2.7.1
  • Intel BOXDQ965GFEKR | Product Specification - Page 7
    Contents 4 Error Messages and Beep Codes 4.1 Speaker 87 4.2 BIOS Beep Codes 87 4.3 BIOS Error Messages 87 4.4 Port 80h POST Codes 88 5 Markings (Board Level 100 5.2 Battery Disposal Information 101 Figures 1. Major Board Components 14 2. Block Diagram 16 3. Memory Channel Configuration
  • Intel BOXDQ965GFEKR | Product Specification - Page 8
    Intel Desktop Board DQ965GF Technical Product Specification Tables 1. Feature Summary 12 2. Manufacturing Options 13 3. Board Components Shown in Figure 1 15 4. Supported Memory Configurations 18 5. Memory Operating Frequencies 19 6. Audio Jack Retasking Support 34 7. LAN Connector LED States
  • Intel BOXDQ965GFEKR | Product Specification - Page 9
    Contents 47. Safety Regulations 93 48. Lead-Free Board Markings 98 49. EMC Regulations 99 50. Product Certification Markings 100 ix
  • Intel BOXDQ965GFEKR | Product Specification - Page 10
    Intel Desktop Board DQ965GF Technical Product Specification x
  • Intel BOXDQ965GFEKR | Product Specification - Page 11
    1 Product Description What This Chapter Contains 1.1 Overview 12 1.2 Online Support 17 1.3 Processor 17 1.4 System Memory 18 1.5 Intel® Virtualization Technology (Intel® VT 26 1.6 Intel® vPro™ Technology Support 27 1.7 Intel® Q965 Express Chipset 28 1.8 Legacy I/O Controller 33 1.9 Audio
  • Intel BOXDQ965GFEKR | Product Specification - Page 12
    Summary Form Factor Processor Memory Chipset Video microATX Form Factor (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]) Support for the following: • Intel® Core™2 Duo processor in an LGA775 socket with a 1066 or 800 MHz system bus • Intel® Pentium® D processor in an LGA775
  • Intel BOXDQ965GFEKR | Product Specification - Page 13
    Hardware Monitor Subsystem Intel® vPro™ Technology support • Support for PCI Local Bus Specification Revision 2.3 • Support for PCI Express* Revision 1.0a • Suspend to RAM support • Wake For information about Available configurations for the Desktop Board DQ965GF Refer to Section 1.2, page 17 13
  • Intel BOXDQ965GFEKR | Product Specification - Page 14
    Intel Desktop Board DQ965GF Technical Product Specification 1.1.3 Board Layout Figure 1 shows the location of the major components. A BC D E F G H DD CC I BB AA J K Z Y L M N X W V UTSR Q P O Figure 1. Major Board Components Table 3 lists the components identified in Figure 1.
  • Intel BOXDQ965GFEKR | Product Specification - Page 15
    D PCI Express x1 connector E PCI Express x16 connector F Back panel connectors G Processor core power connector H Rear chassis fan header I LGA775 processor socket J Intel 82Q965 GMCH K Processor fan header L DIMM Channel A sockets M Serial port header N DIMM Channel B sockets
  • Intel BOXDQ965GFEKR | Product Specification - Page 16
    Intel Desktop Board DQ965GF Technical Product Specification 1.1.4 Block Diagram Figure 2 is a block diagram of the major functional areas. PCI Express x1 Interface PCI Express x1 Slot 1 Parallel ATA IDE Connector LGA775 Processor Socket Parallel ATA IDE Controller System Bus (1066/800/533 MHz)
  • Intel BOXDQ965GFEKR | Product Specification - Page 17
    1.3 Processor The board is designed to support the following processors: • Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz system bus • Intel Pentium D processor in an LGA775 processor socket with an 800 or 533 MHz system bus • Intel Pentium 4 processor in an LGA775 processor
  • Intel BOXDQ965GFEKR | Product Specification - Page 18
    Intel Desktop Board DQ965GF Technical Product Specification 1.4 System Memory The board has four DIMM sockets and supports the following memory features memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This enables the BIOS
  • Intel BOXDQ965GFEKR | Product Specification - Page 19
    used with a 533 MHz system bus frequency processor, the memory will operate at 533 MHz. Table 5 lists the resulting operating memory frequencies based on the combination of DIMMs and processors. Table 5. Memory Operating Frequencies DIMM Type Processor system bus frequency DDR2 533 533 MHz DDR2
  • Intel BOXDQ965GFEKR | Product Specification - Page 20
    Intel Desktop Board DQ965GF Technical Product Specification 1.4.1 Memory Configurations The Intel 82Q965 GMCH supports the following types of memory organization: • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when
  • Intel BOXDQ965GFEKR | Product Specification - Page 21
    Product Description Figure 3. Memory Channel Configuration and DIMM Configuration # INTEGRATOR'S NOTE Regardless of the memory configuration used (dual channel, single channel, or flex mode), DIMM 0 of Channel A must always be populated. This is a requirement of the ICH8 Manageability Engine feature
  • Intel BOXDQ965GFEKR | Product Specification - Page 22
    Intel Desktop Board DQ965GF Technical Product Specification 1.4.1.1 Dual Channel (Interleaved) Mode Configurations Figure 4 shows a dual channel configuration using two DIMMs. In this example, the DIMM0 (blue) sockets of both channels are populated
  • Intel BOXDQ965GFEKR | Product Specification - Page 23
    Product Description Figure 6 shows a dual channel configuration using four DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels. 512 MB 1 GB 512 MB
  • Intel BOXDQ965GFEKR | Product Specification - Page 24
    Intel Desktop Board DQ965GF Technical Product Specification 1.4.1.2 Single Channel (Asymmetric) Mode Configurations NOTE Dual channel (Interleaved) mode configurations provide the highest memory throughput. Figure 7 shows a single channel configuration using one DIMM. In this example, only the DIMM0
  • Intel BOXDQ965GFEKR | Product Specification - Page 25
    Product Description 1.4.1.3 Flex Mode Configuration NOTE The use of flex mode requires DIMMs to be installed in both channels. Figure 9 shows a flex mode configuration using two DIMMs. The operation is as follows: • The 512 MB DIMM in the Channel A, DIMM 0 socket and the lower 512 MB of the DIMM in
  • Intel BOXDQ965GFEKR | Product Specification - Page 26
    processors, memory, storage, and network adapters can be allocated and prioritized for the different partitions to meet specific business and application requirements. Intel® Virtualization Technology (Intel® VT) offers silicon-level support for core Intel® network adapter and compatible driver
  • Intel BOXDQ965GFEKR | Product Specification - Page 27
    applications. # INTEGRATOR'S NOTE In addition to the hardware support on the board (the Intel 82801HO ICH8DO and the Intel 82566DM Gigabit Ethernet Controller), Intel vPro technology requires the use of an Intel Core 2 Duo processor and compatible third-party applications. For information about
  • Intel BOXDQ965GFEKR | Product Specification - Page 28
    Intel Desktop Board DQ965GF Technical Product Specification 1.7 Intel® Q965 Express Chipset The Intel Q965 Express chipset consists of the following devices: • Intel 82Q965 Graphics and Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect • Intel 82801HO I/O Controller Hub (
  • Intel BOXDQ965GFEKR | Product Specification - Page 29
    clocks using an ADD2/MEC card • Dynamic Video Memory Technology (DVMT) support up to 256 MB • Intel® Zoom Utility 1.7.1.2 Dynamic Video Memory Technology (DVMT) DVMT enables enhanced graphics and memory performance through highly efficient memory utilization. DVMT ensures the most efficient use of
  • Intel BOXDQ965GFEKR | Product Specification - Page 30
    Intel Desktop Board DQ965GF Technical Product Specification and graphics drivers allocate additional system memory to the graphics buffer as needed for performing graphics functions. NOTE The use of DVMT requires operating system driver support. 1.7.1.3 Configuration Modes A list of supported
  • Intel BOXDQ965GFEKR | Product Specification - Page 31
    Refer to Figure 15, page 57 Figure 16, page 58 1.7.3 Serial ATA Interfaces The board provides six Serial ATA (SATA) connectors, which support one device per connector. 1.7.3.1 Serial ATA Support The ICH8DO's Serial ATA controller offers six independent Serial ATA ports with a theoretical maximum
  • Intel BOXDQ965GFEKR | Product Specification - Page 32
    Intel Desktop Board DQ965GF Technical Product Specification 1.7.4 Parallel IDE Interface The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes: • Programmed I/O (PIO): processor controls data transfer. • 8237-
  • Intel BOXDQ965GFEKR | Product Specification - Page 33
    the I/O controller. 1.8.1 Serial Port Interface The serial port header is located on the component side of the board. The serial port supports data transfers at speeds up to 115.2 kbits/sec with BIOS support. For information about The location of the serial port header Refer to Figure 16, page 58
  • Intel BOXDQ965GFEKR | Product Specification - Page 34
    Yes Back panel - Green No Yes Back panel - Pink Yes Yes Supports Microphone? No Yes No No Yes Supports Headphones? Yes No No Yes No 1.9.1 Audio Subsystem Software Audio software and drivers are available from Intel's World Wide Web site. For information about Obtaining audio software and
  • Intel BOXDQ965GFEKR | Product Specification - Page 35
    of the board. The front panel audio header provides mic in and line out signals for the front panel. Microphone bias is supported for both the front and back panel microphone connectors. The front/back panel audio connectors are configurable through the audio device drivers.
  • Intel BOXDQ965GFEKR | Product Specification - Page 36
    packet filtering • Full device driver compatibility • PCI Express Power Management Support The Intel 82566DM also provides support for: • Alert Standard Format (ASF) 2.0 • Intel® Active Management Technology (Intel® AMT) • Virtual LAN driver support for Intel VT partitions 1.10.2 LAN Subsystem
  • Intel BOXDQ965GFEKR | Product Specification - Page 37
    Table 7 describes the LED states when the board is powered up and the LAN subsystem is Intel® Active Management Technology (Intel® AMT) with System Defense Feature Intel Active Management Technology offers IT organizations tamper-resistant and persistent management capabilities. Specifically, Intel
  • Intel BOXDQ965GFEKR | Product Specification - Page 38
    Format (ASF) 2.0 Support The board provides the following ASF support for PCI Express x1 bus add-in LAN cards and PCI Conventional bus add-in LAN cards: • Monitoring of system firmware progress events, including: ⎯ BIOS present ⎯ Primary processor initialization ⎯ Memory initialization ⎯ Video
  • Intel BOXDQ965GFEKR | Product Specification - Page 39
    specification. The board has several hardware management features, including the following: • Fan monitoring and control • Thermal and voltage monitoring • Chassis intrusion detection 1.11.1 Hardware Monitoring and Fan Control The features of the hardware monitoring and fan control include: • Intel
  • Intel BOXDQ965GFEKR | Product Specification - Page 40
    Intel Desktop Board DQ965GF Technical Product Specification 1.11.4 Thermal Monitoring Figure 12 shows the locations of the thermal sensors and fan headers. G A B E CF D Item A B C D E F G Description Thermal diode, located on processor die Thermal diode, located on the GMCH die Thermal diode,
  • Intel BOXDQ965GFEKR | Product Specification - Page 41
    an operating system that provides full ACPI support. ACPI features include: • Plug and Play (including bus and device enumeration) • Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives • Methods
  • Intel BOXDQ965GFEKR | Product Specification - Page 42
    9 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the system. Service can be performed safely. Notes: 1. Total system power is dependent on the system configuration, including add-in boards and
  • Intel BOXDQ965GFEKR | Product Specification - Page 43
    personal computers. This board meets that requirement specific events that can wake the computer from specific is disabled by default in the BIOS Setup program. Setting this option support. In addition, software, drivers, and peripherals must fully support ACPI wake events. 1.12.2 Hardware Support
  • Intel BOXDQ965GFEKR | Product Specification - Page 44
    Intel Desktop Board DQ965GF Technical Product Specification • LAN wake capabilities • Instantly Available PC technology • Resume on Ring • Wake from USB • Wake from PS/2 keyboard • PME# signal wake-up support • WAKE# signal wake-up support Power State feature in the BIOS Setup program's Boot menu.
  • Intel BOXDQ965GFEKR | Product Specification - Page 45
    Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer. The use of Instantly Available PC technology requires operating system support and PCI 2.3 compliant add-in cards and drivers. 1.12
  • Intel BOXDQ965GFEKR | Product Specification - Page 46
    Intel Desktop Board DQ965GF Technical Product Specification 1.12.2.6 Wake from USB USB bus activity wakes the computer from ACPI S3 state. NOTE Wake from USB requires the use of a USB peripheral that supports Wake on PME enabled in BIOS). 1.12.2.9 WAKE# Signal Wake-up Support When the WAKE# signal on
  • Intel BOXDQ965GFEKR | Product Specification - Page 47
    lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices. CAUTION When connected to AC power, the memory slots on the board will be powered on and in use. A red LED (shown in Figure 13), located
  • Intel BOXDQ965GFEKR | Product Specification - Page 48
    Intel Desktop Board DQ965GF Technical Product Specification 1.13 Trusted Platform Module (TPM) The TPM 1.2 component is specifically designed to enhance platform security aboveand-beyond the capabilities of today's software by providing a protected space for key operations and other security
  • Intel BOXDQ965GFEKR | Product Specification - Page 49
    Map 2.1.1 Addressable Memory The board utilizes 8 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total system memory). On
  • Intel BOXDQ965GFEKR | Product Specification - Page 50
    Intel Desktop Board DQ965GF Technical Product Specification The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 14 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.
  • Intel BOXDQ965GFEKR | Product Specification - Page 51
    (open to the PCI bus). Dependent on video adapter used. Video memory and BIOS Extended BIOS data (movable by memory manager software) Extended conventional memory Conventional memory System Resource Open Parallel port Diskette drive Parallel port (for ECP or EPP) DMA controller Open Open Open
  • Intel BOXDQ965GFEKR | Product Specification - Page 52
    Intel Desktop Board DQ965GF Technical Product Specification 2.3 Fixed I/O Map Table 13. I/O Map Address (hex) 0000 - 00FF Size 256 bytes Parallel ATE IDE channel command block LPT3 LPT2 COM4 COM2 LPT1 Intel 82Q965 GMCH Intel 82Q965 GMCH COM3 Diskette channel Primary Parallel ATA IDE channel
  • Intel BOXDQ965GFEKR | Product Specification - Page 53
    hex) Number (hex) Number (hex) Description 00 00 00 Memory controller of Intel 82Q965 component 00 01 00 PCI Express x16 graphics port ( Note 1) 00 02 00 Integrated graphics controller 00 1B 00 Intel High Definition Audio Controller 00 1C 00 PCI Express port 1 00 1C
  • Intel BOXDQ965GFEKR | Product Specification - Page 54
    Intel Desktop Board DQ965GF Technical Product Specification 2.5 Interrupts The interrupts can be routed through either the Programmable Interrupt Controller (PIC) or the Advanced Programmable Interrupt Controller (APIC) portion of the ICH8DO component. The PIC is supported in Windows 98 SE and
  • Intel BOXDQ965GFEKR | Product Specification - Page 55
    the PCI bus connectors and onboard PCI devices. The PCI specification specifies how interrupts can be shared between devices attached to the PIRQ signals. Some PCI interrupt sources are electrically tied together on the board and therefore share the same interrupt. Table 16 shows an example of
  • Intel BOXDQ965GFEKR | Product Specification - Page 56
    Intel Desktop Board DQ965GF Technical Product Specification 2.7 Connectors and Headers CAUTION Only the following computer, the power cable, and the external devices themselves. This section describes the board's connectors and headers. The connectors and headers can be divided into these groups:
  • Intel BOXDQ965GFEKR | Product Specification - Page 57
    Technical Reference 2.7.1 Back Panel Connectors Figure 15 shows the locations of the back panel connectors. A C F G I B D E H JK Item A B C D E F G H I J K Description PS/2 mouse port (optional) PS/2 keyboard port (optional) Parallel port VGA port IEEE-1394a (optional) USB ports [4] LAN
  • Intel BOXDQ965GFEKR | Product Specification - Page 58
    Intel Desktop Board DQ965GF Technical Product Specification 2.7.2 Component-side Connectors and Headers Figure 16 shows the locations of the component-side connectors and headers. A BC D E 16 U 1 2 T 12 9 10 1 2 4 F 1 G S 10 21 1 2 R 10 12 Q
  • Intel BOXDQ965GFEKR | Product Specification - Page 59
    C PCI Conventional bus add-in card connector 1 D PCI Express x1 connector E PCI Express x16 connector F Processor core power connector G Rear chassis fan header H Processor fan header I Serial port header J Diskette drive connector K Main Power connector L Front chassis fan header
  • Intel BOXDQ965GFEKR | Product Specification - Page 60
    Intel Desktop Board DQ965GF Technical Product Specification Table 18. High Definition Audio Link Header Pin Signal Name Pin 1 BCLK 2 3 RST 4 5 SYNC 6 7 SDO 8 9 SDI 10 11 No connect 12 13 No connect 14
  • Intel BOXDQ965GFEKR | Product Specification - Page 61
    Technical Reference Table 23. Processor Fan Header Pin Signal Name 1 Ground 2 +12 V 3 FAN_TACH 4 FAN_CONTROL Table 24. Front Panel Audio Header Pin Signal Name Pin 1 [Port 1] Left channel 2 3 [Port 1] Right channel 4 5 [
  • Intel BOXDQ965GFEKR | Product Specification - Page 62
    Intel Desktop Board DQ965GF Technical Product Specification 2.7.2.1 Add-in Card Connectors The board has the following add-in card connectors: • PCI Express x16: one connector supporting simultaneous transfer speeds up to 4 GBytes/sec of peak bandwidth per direction and up to 8 GBytes/sec concurrent
  • Intel BOXDQ965GFEKR | Product Specification - Page 63
    boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, attach that cable on the rightmost pins of the main power connector, leaving pins 11, 12, 23, and 24 unconnected. • Processor core
  • Intel BOXDQ965GFEKR | Product Specification - Page 64
    Intel Desktop Board DQ965GF Technical Product Specification 2.7.2.3 Front Panel Header This section describes the functions of the front panel header. Table 27 lists the signal names of the front panel header. Figure
  • Intel BOXDQ965GFEKR | Product Specification - Page 65
    are suggested colors only. Actual LED colors are product- or customer-specific. 2.7.2.3.4 Power Switch Header Pins 6 and 8 can be connected off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another
  • Intel BOXDQ965GFEKR | Product Specification - Page 66
    Intel Desktop Board DQ965GF Technical Product Specification 2.7.2.5 Front Panel USB Headers Figure front panel USB headers is fused. • Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices. One USB Port Power (+5 V DC) D- D+ Ground Key (no pin)
  • Intel BOXDQ965GFEKR | Product Specification - Page 67
    . Otherwise, the board could be damaged. Figure 20 shows the location of the jumper block. The jumper determines the BIOS Setup program's mode mode and the computer is powered-up, the BIOS compares the processor version and the microcode version in the BIOS and reports if the two match. 321 Figure
  • Intel BOXDQ965GFEKR | Product Specification - Page 68
    Intel Desktop Board DQ965GF Technical Product Specification 2.9 Mechanical Considerations 2.9.1 Form Factor The board is designed to fit into an ATX- or microATX-form-factor chassis. Figure 21 illustrates the mechanical form factor of the board. Dimensions are given in inches [millimeters]. The
  • Intel BOXDQ965GFEKR | Product Specification - Page 69
    The back panel I/O shield for the board must meet specific dimension and material requirements. Systems based on this board need the back panel I/O shield to shields relative to chassis requirements are described in the ATX specification. NOTE The I/O shield drawings are for reference only. I/O shields
  • Intel BOXDQ965GFEKR | Product Specification - Page 70
    Intel Desktop Board DQ965GF Technical Product Specification 0.061 REF [1.55] 0.039 [1] 0.884 [22.45] A 0.276 [7.01] 0.00 [0.00] 0.465 [11.81] 0.474 [12.04 [44.9 - 0.12] 1.890 [48] 0.591 - 0.010 [15 - 0.25] OM18446 Figure 22. I/O Shield Dimensions for Boards with IEEE-1394a and PS/2 Connectors 70
  • Intel BOXDQ965GFEKR | Product Specification - Page 71
    ] 3.822 [97.08] 4.573 [116.15] 5.783 [146.88] 1.768 - 0.005 [44.9 - 0.12] 1.890 [48] 0.591 - 0.010 [15 - 0.25] OM18447 Figure 23. I/O Shield Dimensions for Boards without PS/2 Connectors 71
  • Intel BOXDQ965GFEKR | Product Specification - Page 72
    Intel Desktop Board DQ965GF Technical Product Specification 0.061 REF [1.55] 0.039 [1] 0.884 [22.45] A 0.276 [7.01] 0.00 [0.00] 0.474 [12.04] 0.787 - 0. 44.9 - 0.12] 1.890 [48] 0.591 - 0.010 [15 - 0.25] OM18448 Figure 24. I/O Shield Dimensions for Boards without IEEE-1394a and PS/2 Connectors 72
  • Intel BOXDQ965GFEKR | Product Specification - Page 73
    mA current draw per USB port. These calculations are not based on specific processor values or memory configurations but are based on the minimum and maximum current draw possible from the board's power delivery subsystems to the processor, memory, and USB ports. Use the datasheets for add-in cards
  • Intel BOXDQ965GFEKR | Product Specification - Page 74
    Intel Desktop Board DQ965GF Technical Product Specification 2.10.3 Add-in Board Considerations The board is designed to provide 2 A (average) of +5 V current for each add-in board. The total +5 V current draw for add-in boards for a fully loaded board wake devices supported and manufacturing options
  • Intel BOXDQ965GFEKR | Product Specification - Page 75
    solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION Ensure that the ambient temperature does not exceed the board's maximum operating temperature
  • Intel BOXDQ965GFEKR | Product Specification - Page 76
    Intel Desktop Board DQ965GF Technical Product Specification Figure 25 shows the locations of the localized high temperature zones. A B D C Item A B C D Description Processor voltage regulator area Processor Intel 82Q965 GMCH Intel 82801HO ICH8DO Figure 25. Localized High Temperature Zones
  • Intel BOXDQ965GFEKR | Product Specification - Page 77
    when considering proper airflow to cool the board. Table 35. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel 82Q965 GMCH Intel 82801HO ICH8DO 97 oC (under bias
  • Intel BOXDQ965GFEKR | Product Specification - Page 78
    Intel Desktop Board DQ965GF Technical Product Specification 2.13 Environmental Table 36 lists the environmental specifications for the board. Table 36. Desktop Board DQ965GF Environmental Specifications Parameter Specification Temperature Non-Operating Operating -40 °C to +70 °C 0 °C to +55
  • Intel BOXDQ965GFEKR | Product Specification - Page 79
    (SMBIOS 81 3.5 Legacy USB Support 82 3.6 BIOS Updates 82 3.7 BIOS Recovery 83 3.8 Boot Options 84 3.9 Adjusting Boot Speed 85 3.10 BIOS Security Features 86 3.1 Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be
  • Intel BOXDQ965GFEKR | Product Specification - Page 80
    Intel Desktop Board DQ965GF Technical Product Specification Table 37 lists the BIOS Setup program menu features. Table 37. BIOS Setup Program Menu Bar Maintenance Main Advanced Security Clears passwords and displays processor information Displays processor and memory configuration Configures
  • Intel BOXDQ965GFEKR | Product Specification - Page 81
    specifying manual configuration in the BIOS Setup memory size, cache size, and processor speed • Dynamic data, such as event detection and error logging Non-Plug and Play operating systems, such as Windows NT*, require an additional interface for obtaining the SMBIOS information. The BIOS supports
  • Intel BOXDQ965GFEKR | Product Specification - Page 82
    Intel Desktop Board DQ965GF Technical Product Specification 3.5 Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system's USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system
  • Intel BOXDQ965GFEKR | Product Specification - Page 83
    diskette) No USB hard disk drive No Legacy diskette drive (with a 1.44 MB diskette) connected to the No legacy diskette drive interface For information about BIOS recovery Refer to http://support.intel.com/support/motherboards/desktop 83
  • Intel BOXDQ965GFEKR | Product Specification - Page 84
    Intel Desktop Board DQ965GF Technical Product Specification 3.8 Boot Options In the BIOS Setup program, the user can ROM Boot Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM format specification. Under the Boot menu in the BIOS Setup program, ATAPI CDROM is listed
  • Intel BOXDQ965GFEKR | Product Specification - Page 85
    with the BIOS more quickly, which enables the system to boot more quickly. 3.9.2 BIOS Boot Optimizations Use of the following BIOS Setup program the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors
  • Intel BOXDQ965GFEKR | Product Specification - Page 86
    Intel Desktop Board DQ965GF Technical Product Specification 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting
  • Intel BOXDQ965GFEKR | Product Specification - Page 87
    4.2 BIOS Beep Codes 87 4.3 BIOS Error Messages 87 4.4 Port 80h POST Codes 88 4.1 Speaker The board-mounted BIOS Beep Codes Whenever a recoverable error occurs during POST, the BIOS displays an error message describing the problem (see Table 42). Table 42. Beep Codes Type Pattern Memory
  • Intel BOXDQ965GFEKR | Product Specification - Page 88
    Intel Desktop Board DQ965GF Technical Product Specification 4.4 Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST-codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port
  • Intel BOXDQ965GFEKR | Product Specification - Page 89
    host processor (Boot Strap Processor) 11 Host processor Cache initialization (including APs) 12 Starting Application processor initialization 13 SMM initialization Chipset 21 Initializing a chipset component Memory 22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs
  • Intel BOXDQ965GFEKR | Product Specification - Page 90
    15) PEI Core E0 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN EFI_SW_PEI_PC_HANDOFF_TO_NEXT) E2 Permanent memory found E1, E3 Reserved for PEI/PEIMs DXE Core E4 Entered DXE phase E5 Started dispatching drivers E6 Started connecting drivers continued 90
  • Intel BOXDQ965GFEKR | Product Specification - Page 91
    Code Description of POST Operation DXE Drivers E7 Waiting for user input E8 Checking password E9 Entering BIOS setup EB Calling Legacy Option service ExitBootServices ( ) has been called F9 EFI runtime service SetVirtualAddressMap ( ) has been called FA EFI runtime service ResetSystem
  • Intel BOXDQ965GFEKR | Product Specification - Page 92
    Intel Desktop Board DQ965GF Technical Product Specification Table 46. Typical Port 80h POST Sequence POST Code Description 21 Initializing a chipset component 22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs 25 Configuring memory 28 Testing memory 34 Loading
  • Intel BOXDQ965GFEKR | Product Specification - Page 93
    of Conformity statement • Product Ecology statements • Electromagnetic Compatibility (EMC) regulations • Product certification markings 5.1.1 Safety Regulations Desktop Board DQ965GF complies with the safety regulations stated in Table 47 when correctly installed in a compatible host system. Table
  • Intel BOXDQ965GFEKR | Product Specification - Page 94
    Intel Desktop Board DQ965GF Technical Product Specification 5.1.2 European Union Declaration of Conformity Statement We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board DQ965GF is in conformity with all applicable essential requirements necessary for CE
  • Intel BOXDQ965GFEKR | Product Specification - Page 95
    Regulatory Compliance and Battery Disposal Information Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 89/336/EWG i 73/23/EWG. Portuguese Este produto cumpre com as normas da Diretiva Européia 89/336/EEC & 73/23/EEC. Español Este producto cumple con las normas del
  • Intel BOXDQ965GFEKR | Product Specification - Page 96
    Intel Desktop Board DQ965GF Technical Product Specification 5.1.3 Product Ecology Statements The following information is instructions, terms and conditions, etc Intel Product Recycling Program http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm Deutsch Als Teil von Intels
  • Intel BOXDQ965GFEKR | Product Specification - Page 97
    plus sur ce programme, à savoir les produits concernés, les adresses disponibles, les instructions d'expédition, les conditions générales, etc. 日本語 http://www.intel.com/intel /other/ehs/product_ecology/Recycling_Program.htm Malay Sebagai sebahagian daripada komitmennya terhadap tanggungjawab
  • Intel BOXDQ965GFEKR | Product Specification - Page 98
    Intel Desktop Board DQ965GF Technical Product Specification Türkçe Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm
  • Intel BOXDQ965GFEKR | Product Specification - Page 99
    Regulatory Compliance and Battery Disposal Information 5.1.4 EMC Regulations Desktop Board DQ965GF complies with the EMC regulations stated in Table 49 when correctly installed in a environment, it may cause radio interference. Install and use the equipment according to the instruction manual. 99
  • Intel BOXDQ965GFEKR | Product Specification - Page 100
    information about MIC certification, go to http://support.intel.com/support/motherboards/desktop/ Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark. Includes adjacent Intel company number, D33025. Printed wiring board manufacturer's recognition mark. Consists of a unique V-0 UL
  • Intel BOXDQ965GFEKR | Product Specification - Page 101
    Regulatory Compliance and Battery Disposal Information 5.2 Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.
  • Intel BOXDQ965GFEKR | Product Specification - Page 102
    Intel Desktop Board DQ965GF Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por
  • Intel BOXDQ965GFEKR | Product Specification - Page 103
    Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo
  • Intel BOXDQ965GFEKR | Product Specification - Page 104
    Intel Desktop Board DQ965GF Technical Product Specification 104
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September 2006
Order Number:
D56021-001US
The Intel
®
Desktop Board DQ965GF may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current
characterized errata are documented in the Intel Desktop Board DQ965GF Specification Update.
Intel® Desktop Board
DQ965GF
Technical Product Specification