Intel BX80570E8200 Mechanical Design Guidelines

Intel BX80570E8200 - Core 2 Duo 2.66 GHz Processor Manual

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  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 1
    Intel® Core™2 Duo Processor E8000 and E7000 Series, and Intel® Pentium® Dual-Core Processor E6000 and E5000 Series, and Intel® Celeron® Processor E3x00 Series Thermal and Mechanical Design Guidelines August 2009 Document Number: 318734-011
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 2
    intel.com . The Intel® Core™2 Duo processor E8000, E7000 series and Intel® Pentium® Dual-Core Processor E6000, E5000 series and Intel® Celeron® processor E3x00 series components may contain design defects or errors known as errata, which may cause the product to deviate from published specifications
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 3
    12 1.2 References 13 1.3 Definition of Terms 13 2 Processor Thermal/Mechanical Information 15 2.1 Mechanical Requirements 15 2.1.1 Processor Package 15 2.1.2 Heatsink Attach 17 2.1.2.1 General Guidelines 17 2.1.2.2 Heatsink Clip Load Requirement 17 2.1.2.3 Additional Guidelines 18
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 4
    5.1.1 5.1.2 5.1.3 5.1.4 5.1.5 5.1.6 Target Heatsink Performance 41 Acoustics 42 Effective Fan Curve 43 Voltage Regulator Thermal Management 44 BIOS/CPU/Memory Test Procedures 48 5.3 Material and Recycling Requirements 48 5.4 Safety Requirements 49 5.5 Geometric Envelope for Intel Reference
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 5
    Appendix E 7.2 Board and System Implementation of Intel® QST 68 7.3 Intel® QST Configuration & Tuning 70 7.4 Fan Hub Thermistor and Intel® QST 70 LGA775 Socket Heatsink Loading 71 A.1 LGA775 Socket Heatsink Considerations 71 A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 6
    Figure 6-5. Upward Board Deflection During Shock 62 Figure 6-6. Reference Clip/Heatsink Assembly 63 Figure 6-7. Critical Parameters for Interfacing to Reference Clip 64 Figure 6-8. Critical Core Dimension 64 Figure 7-1. Intel® QST Overview 66 Figure 7-2. PID Controller Fundamentals 67 Figure
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 7
    Thermal sensor Location Illustration 107 Figure 7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components 7-53. Reference Fastener - Sheet 4 125 Figure 7-54. Intel® E18764-001 Reference Solution Assembly 126 Thermal and Mechanical Design Guidelines
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 8
    Tables Table 2-1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions ...........24 Table 2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions ..24 Table 5-1. Balanced Technology Extended (BTX) Type II Reference TMA Performance 41 Table 5-2. Acoustic Targets 42
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 9
    Core™2 Duo processor E8600 and E7300  Added Intel® Pentium dual-core processor E5200  Added Intel® Core™2 Duo processor E7400  Added Intel® Pentium dual-core processor E5300  Added Intel® Pentium dual-core processor E5400  Added Intel® Core™2 Duo processor E7500  Added Intel® Pentium dual-core
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 10
    10 Thermal and Mechanical Design Guidelines
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 11
    processor systems using the Intel® Core™2 Duo processor E8000, E7000 series, Intel® Pentium® dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3x00 series. The concepts given in this document are applicable to any system form factor. Specific examples used will be the Intel
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 12
    design guide supports the following processors:  Intel® Core™2 Duo processor E8000 series with 6 MB cache applies to Intel® Core™2 Duo processors E8600, E8500, E8400, E8300, E8200, and E8190  Intel® Core™2 Duo processor E7000 series with 3 MB cache applies to Intel® Core™2 Duo processors E7600
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 13
    this document. Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3x00 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for 4-wire PWM
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 14
    . Any standalone or integrated component that is capable of reading the processor temperature and providing the PWM signal to the 4-pin fan header. Balanced Technology Extended. Thermal Module Assembly. The heatsink, fan and duct assembly for the BTX thermal solution § 14 Thermal and Mechanical
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 15
    in the document are packaged in a 775-Land LGA package that interfaces with the motherboard using a LGA775 socket. Refer to the datasheet for detailed mechanical specifications. The processor connects to the motherboard through a land grid array (LGA) surface mount socket. The socket contains 775
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 16
    for contacting a heatsink. The IHS also features a step that interfaces with the LGA775 socket load plate, as described in LGA775 Socket Mechanical Design Guide. The load between the heatsink base and the IHS, it should not exceed the corresponding specification given in the processor datasheet. 
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 17
    shock and vibration is constrained by the LGA775 socket load plate (refer to the LGA775 Socket Mechanical Design Guide for further information). 2.1.2.2 Heatsink Clip Load Requirement The attach mechanism for the heatsink developed to support the processor should create a static preload on the
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 18
    heatsink attach mechanism must comply with the package specifications described in the processor datasheet. One of the key design parameters is the height of the top surface of the processor IHS above the motherboard motherboard after reflow, given in the LGA775 Socket Mechanical Design Guide
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 19
    an example of Intel Core™2 Duo Processor E8000 series with 6 MB in ATX platform, its improvement is about 15% over the Intel reference design (E18764-001). This performance is expressed as the slope on the thermal profile and can be thought of as the thermal resistance of the heatsink attached to
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 20
    Information The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium® dual-core processor E6000 and E5000 series with 2 MB cache, and Intel® Celeron® processor E3x00 series with 1 MB cache are
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 21
    a fan speed control component. See the appropriate processor datasheet for further details on reading the register and calculating TCONTROL. See Chapter 7, Intel® Quiet System Technology (Intel® QST), for details on implementing a design using TCONTROL and the Thermal Profile. Heatsink Design
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 22
    components, defined for the platforms designed with the LGA775 socket in Appendix G of this design guide.  The motherboard primary side height constraints defined in the ATX Specification V2.1 and the microATX Motherboard Interface Specification V1.1 found at http://www.formfactors.org/. The
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 23
    heatsinks that use Intel reference design structural ingredients is 900 grams. The BTX structural reference component strategy and design is reviewed in depth in the latest version of the Balanced Technology Extended (BTX) System Design Guide are affected by processor heatsink mass. Exceeding these
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 24
    of Intel Boxed Processor Thermal Solutions Topic Boxed Processor for Intel® Core™2 Duo Processor E8000, E7000 Series, Intel® Pentium® Dual-Core Processor E6000, E5000 Series, and Intel® Celeron® Processor E3x00 Series Heatsink Inlet Temperature 40° C NOTE: 1. Boxed Processor thermal
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 25
    Methods for all aspects LGA775 socket based platforms and systems manufacturing. Of particular interest for package and heatsink installation and removal is the System Assembly module. A video covering system integration is also available. Contact your Intel field sales representative for further
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 26
    Processor Thermal/Mechanical Information 26 Thermal and Mechanical Design Guidelines
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 27
    of the thermal performance of the overall thermal solution that is attached to the processor package. It is defined by the following equation, and measured in units of material (°C/W) SA = Thermal characterization parameter from heatsink-to-local ambient (°C/W) Thermal and Mechanical Design
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 28
    parameters. Figure 3-1. Processor Thermal Characterization Parameter Relationships TA Heatsink TIM IHS Processor CA TS TC LGA775 Socket System Board numbers used here are not related to any specific Intel processor thermal specifications, and are for illustrative purposes only. 28 Thermal
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 29
    from actual processors varies significantly, even when running the maximum power application provided by Intel, due processor. For a passive heatsink, TA is defined as the heatsink approach air temperature; for an actively cooled heatsink, it is the temperature of inlet air to the active cooling fan
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 30
    motherboard, add-in cards, and other system components, it is likely that the TA measurements will reveal a highly non-uniform temperature distribution across the inlet fan section. For passive heatsinks, thermocouples should be placed approximately 13 mm to 25 mm [0.5 to 1.0 in] away from processor
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 31
    Thermal Metrology Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink Note: Drawing Not to Scale Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink Note: Drawing Not to Scale Thermal and Mechanical Design Guidelines 31
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 32
    thermocouple cement and the heatsink base. Appendix D defines a reference procedure for attaching a thermocouple to the IHS of a 775-Land LGA processor package for TC measurement. This procedure takes into account the specific features of the 775-Land LGA package and of the LGA775 socket for which
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 33
    there are numerous ways to reduce the power consumption of a processor, and Intel is aggressively pursuing low power design techniques. For example, cost, by allowing thermal designs to target TDP. The processor also supports an additional power reduction capability known as Thermal Monitor 2
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 34
    As an output, PROCHOT# will go active when the processor temperature of either core reaches the TCC activation temperature. As an input, assertion the processor clocks off and then back on with a predetermined duty cycle. The duty cycle is processor specific, and is fixed for a particular processor. The
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 35
    must support VID transitions in order to support TM2. During the voltage change, it will be necessary to transition through multiple VID codes to reach the target operating voltage. Each step will be one VID table entry (i.e., 12.5 mV steps). The processor continues to execute instructions during
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 36
    (model specific register). Enabling the Thermal Control Circuit allows the processor to attempt to maintain a safe operating temperature without the need for special software drivers or which would initiate an OEM supplied interrupt service routine. 36 Thermal and Mechanical Design Guidelines
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 37
    processor. The power reduction mechanism of thermal monitor can also be activated manually operating system or custom driver control thus forcing the duty cycle is configurable in steps of 12.5%, from 12 Intel requires the Thermal Monitor and Thermal Control Circuit to be enabled for all processors
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 38
    Thermal Management Logic and Thermal Monitor Feature A system designed to meet the thermal profile specification published in the processor datasheet greatly reduces the probability of real applications causing the thermal control circuit to activate under normal operating conditions. Systems that
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 39
    TOFFSET MSR and provide this value to the fan speed control device. Figure 4-3. TCONTROL for Digital Thermal Sensor Note: The processor has only DTS and no thermal diode. is available on pin G5 of the LGA 775 socket. Intel chipsets beginning with the ICH8 have included PECI host controller. The PECI
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 40
    Thermal Management Logic and Thermal Monitor Feature QST), see Chapter 7 and the Intel® Quiet System Technology Configuration and Tuning Manual. Intel has worked with many vendors that provide fan speed control devices to provide PECI host controllers. Consult the local representative for your
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 41
    for the Intel reference thermal solution at the processor fan heatsink inlet Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium® dual-core processor E6000, E5000 series with 2 MB cache, and Intel® Celeron® processor
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 42
    inlet temperatures. Using the example in Table 5-2 for the Intel Core™2 Duo processor with 4 MB cache at Tc-max of 60.1° C the required fan speed necessary to meet thermal specifications can be controlled by the fan inlet temperature and should comply with requirements in the following table. Table
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 43
    effective fan curve. This effective fan curve represents the performance of the fan component AND the impedance of the stator, heatsink, duct points the fans speed will be driven by the system airflow requirements and not the processor thermal limits. Figure 5-1 shows the effective fan curve for
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 44
    Design Information Figure 5-1. Effective TMA Fan Curves with Reference Extrusion dP ( motherboard. The Thermal Module is required to have features that allow for airflow to bypass the heatsink is at a maximum in order to support the 775_VR_CONFIG_06 processors at TDP power dissipation and the chassis
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 45
    thermal design to make sure that the TC requirement for the processor is met at the targeted altitude. Reference Heatsink Thermal Validation The Intel reference heatsink will be validated within the specific boundary conditions based on the methodology described Section 5.2 , and using a thermal
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 46
    Balanced Technology Extended (BTX) Thermal/Mechanical Design Information g2/Hz Figure 5-2. Random Vibration PSD 0.1 0.01 0.001 0.0001 1 Vibration System Level + 3 dB Control Limit - 3 dB Control Limit 10 100 Hz 1000 5.2.1.2 Shock Test Procedure Recommended performance requirement for a
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 47
    damage on motherboard surface due to impact of heatsink or heatsink attach mechanism. 5. No visible physical damage to the processor package. 6. Successful BIOS/Processor/memory test of post-test samples. 7. Thermal compliance testing to demonstrate that the case temperature specification can be
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 48
    CPU/Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational motherboard Appropriate system motherboard  Processor  All
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 49
     All components (in particular the heatsink fins) must meet the test requirements motherboard is 60.60 mm [2.386 inches], for compliance with the motherboard primary side height constraints defined in the BTX Interface Specification for Zone A, found at http://www.formfactors.org. Figure 5-4. Intel
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 50
    design strategy for the Intel Type II TMA is to minimize upward board deflection during shock to help protect the LGA775 socket. BTX thermal solutions preload range for BTX platforms is provided in Table 5-4, but the specific target value is a function of the Thermal Module effective stiffness. The
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 51
    to Thermal Module Assembly Stiffness NOTES: 1. The shaded region shown is the acceptable domain for Thermal Module assembly effective stiffness and processor preload combinations. The Thermal Module design should have a design preload and stiffness that lies within this region. The design tolerance
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 52
    to the TMA mounting scheme that meets the BTX Interface Specification and Support Retention Mechanism (SRM) Design Guide. For TMA mounting schemes that use only the motherboard mounting hole position for TMA attach, the required preload is approximately 10-15N greater than the values stipulated
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 53
    air-cooled design, with a fan installed at the top of the heatsink. The thermal technology required for the processor. The Intel Core™2 Duo processor E8000, E7000 series, Intel Pentium dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3x00 series require a thermal solution
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 54
    Core Applied by TC-1996 Grease The ATX motherboard keep-out and the height recommendations defined Section 6.6 remain the same for a thermal solution for the processor in the 775-Land LGA package. Note: If this fan with the energized fan by the user during user servicing. Note: Development vendor
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 55
    provides the E18764-001 heatsink performance for the processors of Intel Core™2 Duo Processor E8000 series with 6 MB cache, Intel Core™2 Duo Processor E7000 series with 3 MB cache, Intel Pentium dual-core processor E6000, E5000 series with 2 MB cache, and Intel® Celeron® processor E3x00 series with
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 56
    and Intel® Celeron® processor E3x00 series with 1 MB)  0.65 C/W (Core™2 Duo processor E8000 series with 6 MB)  0.68 C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and Intel® Celeron® processor E3x00 series with 1 MB) Thermal Design Power, Fan
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 57
    ATX Thermal/Mechanical Design Information 6.2.4 Heatsink Thermal Validation Intel recommends evaluation of the heatsink within the specific boundary conditions based on the methodology described Section 6.3 , and using a thermal test vehicle. Testing is done on bench top test boards at ambient
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 58
    02) PSD (g^2/Hz) 0.001 1 5 Hz 10 100 Frequency (Hz) 500 Hz 1000 6.3.1.2 Shock Test Procedure Recommended performance requirement for a motherboard:  Quantity: 3 drops for + and - directions in each of 3 perpendicular axes (i.e., total 18 drops).  Profile: 50 G trapezoidal waveform, 170 in
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 59
    damage on motherboard surface due to impact of heatsink or heatsink attach mechanism. 5. No visible physical damage to the processor package. 6. Successful BIOS/Processor/memory test of post-test samples. 7. Thermal compliance testing to demonstrate that the case temperature specification can be
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 60
    CPU/Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational motherboard Appropriate system motherboard  Processor  All
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 61
    All components (in particular the heatsink fins) must meet the test fan inlet airflow to ensure fan performance, and therefore overall cooling solution performance. This is compliant with the recommendations found in both ATX Specification V2.1 and microATX Motherboard Interface Specification
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 62
    protect the LGA775 socket. The reference design uses a high clip stiffness that resists local board curvature under the heatsink, and minimizes design is 191.3 N ± 44.5 N [43 lb ± 10 lb]. Note: Intel reserves the right to make changes and modifications to the design as necessary to the reference
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 63
    attach mechanism consists of:  A metal attach clip that interfaces with the heatsink core, see Appendix G, Figure 7-48 and Figure 7-49 for the component drawings. the reference attach mechanism (clip and fasteners) include:  Heatsink/fan mass ≤ 550 g (i.e., total assembly mass, including clip
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 64
    Fan Fin Array Core See Detail A Clip Fin Array Clip 1.6 mm Core Figure 6-8. Critical Core core surface blemish during clip assembly. Recommend 0.3 mm min. Core R 0.40 mm max R 0.40 mm max 2.596 +/- 0.10 mm NOTE: Dimension from the bottom of the clip to the bottom of the heatsink core
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 65
    QST in the ME Consult the Intel® Quiet System Technology (Intel® QST) Configuration and Tuning Manual. Note: Fan speed control algorithms and Intel QST in particular rely on a thermal solution being compliant to the processor thermal profile. It is unlikely that any fan speed control algorithm can
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 66
    processor heatsink fan and a 2nd fan in the system. By placing a factor in this matrix additional the Intel QST could command the processor thermal solution fan and this 2nd fan , the algorithm will instruct the fan to speed up gradually, but will not abruptly increase the fan speed to respond to
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 67
    Fan Speed RPM For a PID algorithm to work limit temperatures are assigned for each temperature sensor. For Intel QST the TCONTROL for the processor gain  Kd = derivative gain The Intel® Quiet System Technology (Intel® QST) Configuration and Tuning Manual provides initial values for the each of
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 68
    QST Firmware  SST-based thermal sensors to provide board thermal data for Intel QST algorithms  Intel QST firmware Figure 7-3. Intel® QST Platform Requirements Processor Intel® (G)MCH MMEE DRAM DRAM Intel® ICH8 Controller Link FSC Control SPI SPI Flash SST Sensor Note: Simple Serial
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 69
    implementation that can support processors with Digital thermal sensor or a thermal diode. In this configuration a SST Thermal Sensor has been added to read the on-die thermal diode that is in all of the processors in the 775-land LGA packages shipped before the Intel Core™2 Duo processor. With the
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 70
    meet the thermal profile of the processor. Intel QST, by measuring the processor Digital thermal sensor will command the fan to reduce speed below the VSF curve in response to processor workload. Conversely if the processor workload increases the FSC will command the fan using the PWM duty cycle to
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 71
    : Mechanical shock and vibration and TIM performance AND LGA775 socket protection against fatigue failure. Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference Design Heatsink Preload Requirement Limitations Heatsink preload by itself is not an appropriate metric
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 72
    . Therefore, the heatsink preload for LGA775 socket solder joint ATX form factor. A.3.1 Motherboard Deflection Metric Definition Motherboard deflection is measured along either Processor + Socket load plate d_ref yes d_BOL yes d_EOL yes NOTES: BOL: Beginning of Life EOL: End of Life Heatsink
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 73
    LGA775 Socket Heatsink Loading Figure 7-6. Board Deflection Definition d1 d'1 d2 d'2 A.3.2 1. The heatsink preload must remain within the static load limits defined in the processor datasheet at all times. 2. Board deflection should not exceed motherboard manufacturer specifications. Thermal
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 74
    LGA775 Socket Heatsink Loading A.3.3 Board Deflection Metric Implementation Example This section is for and board manufacturing process. Check with your motherboard vendor.  Clip stiffness assumed constant - No creep. Using Figure 7-7, the heatsink preload at beginning of life is defined to
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 75
    fixture on the back of the board. NOTES: 1. The heatsink preload must remain below the maximum load limit of the package at all times (Refer to processor datasheet). 2. Board deflection should not exceed motherboard manufacturer specifications. Thermal and Mechanical Design Guidelines 75
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 76
    heatsink preload, for example:  The Boxed Processor  The reference design (E18764-001) Intel will collaborate with vendors participating in its third party test house program to evaluate third party solutions. Vendor information now is available in Intel Core™2 Duo Processor Support Components
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 77
    Heatsink preload for the LGA775 socket • Quantify preload degradation under bake conditions. Note: This document reflects the current metrology used by Intel. Intel maintain the load cells in place during the heatsink installation on the processor and motherboard (Refer to Figure 7-9). The depth of
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 78
    sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful results. An alternate method to the load cells are just flush with the heat sink base  Then machine back the heatsink base by around 0.25 mm [0.01"], so that the load cell tips protrude beyond the
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 79
    to maintain load cell in position during heatsink installation Height of pocket ~ height of selected load cell Load cell protrusion (Note: to be optimized depending on assembly stiffness) Figure 7-10. Preload Test Configuration Preload Fixture (copper core with milled out pocket) Load Cells (3x
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 80
    Load Metrology B.2.2 Typical Test Equipment For the heatsink clip load measurement, use equivalent test equipment to be used in mechanical shock and vibration testing. Any mechanical device used along with the heatsink attach mechanism will need to be included in the test setup (i.e., back plate,
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 81
    as the goal of the test is to measure the load provided by the actual heatsink mechanism. 2. Install relevant test vehicle (TTV, processor) in the socket 3. Assemble the heatsink reworked with the load cells to motherboard as shown for the reference design example in Figure 7-10, and actuate attach
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 82
    Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 83
    of factors related to the interface between the processor and the heatsink base. Specifically, the bond line thickness, interface material area drop is across the interface and the more efficient the thermal solution (heatsink, fan) must be to achieve the desired cooling. The wetting or filling
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 84
    Thermal Interface Management § 84 Thermal and Mechanical Design Guidelines
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 85
    into account the specific features of the 775-land LGA package and of the LGA775 socket for which listed the table below as a convenience to Intel's general customers and the list may be subject 1837 Whipple Road, Hayward, Ca 94544 D.2 Supporting Test Equipment To apply the reference thermocouple
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 86
    Case Temperature Reference Metrology Item Description Part Number Miscellaneous Hardware Solder Flux Loctite* 498 Adhesive Adhesive Accelerator Kapton* Tape Thermocouple Indium Corp. of America Alloy 57BI / 42SN / 1AG 0.010 Diameter Indium Corp. of America Super glue w/thermal characteristics
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 87
    glasses for cutting the IHS and gloves for chemical handling. 2. Ask your Intel field sales representative if you need assistance to groove and/or install a thermocouple according to pinched when removing and installing the heatsink (see Figure 7-37). Thermal and Mechanical Design Guidelines 87
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 88
    Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 o'clock Exit Case Temperature Reference Metrology 88 Thermal and Mechanical Design Guidelines
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 89
    Case Temperature Reference Metrology Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 o'clock Exit (Old Drawing) Thermal and Mechanical Design Guidelines 89
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 90
    o'clock Exit on the 775-LAND LGA Package IHS Groove Pin1 indicator When the processor is installed in the LGA775 socket, the groove is parallel to the socket load lever, and is toward compliance to specifications before accepting from machine shop. 90 Thermal and Mechanical Design Guidelines
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 91
    block heater, as it can take up to 30 minutes to reach the target temperature of 153 - 155° C. Note: To avoid damage to the processor ensure the IHS temperature does not exceed 155° C. As a complement to the written procedure a video Thermocouple Attach Using Solder - Video CD-ROM is available
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 92
    Case Temperature Reference Metrology Figure 7-17. Bending the Tip of the Thermocouple D.5.2 Thermocouple Attachment to the IHS 6. Clean groove and IHS with Isopropyl Alcohol (IPA) and a lint free cloth removing all residues prior to thermocouple attachment. 7. Place the thermocouple wire inside
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 93
    7-19. Thermocouple Bead Placement (A) (B) 10. Place the package under the microscope to continue with process. It is also recommended to use a fixture (like processor tray or a plate) to help holding the unit in place for the rest of the attach process. 11. While still at the microscope, press the
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 94
    Case Temperature Reference Metrology Figure 7-20. Position Bead on the Groove Step Kapton* tape Wire section into the groove to prepare for final bead placement Figure 7-21. Detailed Thermocouple Bead Placement TC Wire with Insulation IHS with
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 95
    (hold both wires to a DMM probe) to the IHS surface. This should be the same value as measured during the thermocouple conditioning Section D.5.1.step 3 (Figure 7-23). Figure 7-23. Measuring Resistance between Thermocouple and IHS 14. Using a fine point device, place a small amount of flux on the
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 96
    Case Temperature Reference Metrology Figure 7-24. Applying Flux to the Thermocouple Bead 15. Cut two small pieces of solder 1/16 inch (0.065 inch / 1.5 mm) from the roll using tweezers to hold the solder while cutting with a fine blade (Figure 7-25). Figure 7-25. Cutting Solder 16. Place the two
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 97
    Metrology Figure 7-26. Positioning Solder on IHS 17. Measure the resistance from the thermocouple end wires again using the DMM (refer to Section D.5.1.step 2) to ensure the bead is still properly contacting the IHS. D.5.3 Solder Process 18. Make sure the thermocouple that monitors the Solder Block
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 98
    to get a better view when the solder begins to melt. 23. Lower the Heater block onto the IHS. Monitor the device IHS temperature during this step to ensure the maximum IHS temperature is not exceeded. Note: The target IHS temperature during reflow is 150° C ±3° C. At no time should the IHS
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 99
    Case Temperature Reference Metrology Figure 7-28. View Through Lens at Solder Station Figure 7-29. Moving Solder back onto Thermocouple Bead Thermal and Mechanical Design Guidelines 99
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 100
    Monitor the device IHS temperature with a handheld meter until it drops below 50° C before moving it to the microscope for the final steps. D.5.4 Cleaning & Completion of Thermocouple Installation 27. Remove the device from the solder station and continue to monitor IHS Temperature with a handheld
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    Case Temperature Reference Metrology Figure 7-31. Thermocouple placed into groove 29. Using a blade carefully shave the excess solder above the IHS surface. Only shave in one direction until solder is flush with the groove surface (Figure 7-32). Figure 7-32. Removing Excess Solder Note: Take usual
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    Figure 7-33. Filling Groove with Adhesive Case Temperature Reference Metrology 32. To speed up the curing process apply Loctite* Accelerator on top of the Adhesive and let it set for a couple of minutes (Figure 7-34). Figure 7-34. Application of Accelerant 102 Thermal and Mechanical Design
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 103
    above the IHS surface (Figure 7-35). The preferred method is to shave from the edge to the center of the IHS. Note: The adhesive shaving step should be performed while the adhesive is partially cured, but still soft. This will help to keep the adhesive surface flat and smooth with no
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 104
    D.6 Thermocouple Wire Management When installing the processor into the socket, the thermocouple wire should route under the socket lid, as Figure 7-37. This will keep the wire from getting damaged or pinched when removing and installing the heatsink. Note: When thermocouple wires are damaged
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 105
    Fan Speed Control (FSC) circuit input for the Thermal Module Assembly (TMA) fan is from the processor sensor then the fan with the component temperature specifications at all operating conditions and located in the exhaust airflow from the chipset heatsink is a reasonable location. It is likely
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 106
    illustration and pictures (see Figure 7-38 and Figure 7-39).The Intel Boxed Boards in BTX form factor have implemented a System Monitor thermal Fremont, CA 94538 USA (510)252-0786 phone (510)252-1178 fax [email protected] Part Number: 68801-0170 Molex Incorporated 2222 Wellington Ct. Lisle,
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 107
    Balanced Technology Extended (BTX) System Thermal Considerations Figure 7-39. Thermal sensor Location Illustration Thermal Sensor TMA Airflow MCH Heatsink § Thermal and Mechanical Design Guidelines 107
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 108
    Balanced Technology Extended (BTX) System Thermal Considerations 108 Thermal and Mechanical Design Guidelines
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 109
    5 mA (short circuit current) VIL = 0.8 V RPM must be within spec for specified duty cycle In addition to comply with overall thermal requirements (Sections 70° C. See the Fan Specification for 4-wire PWM Controlled Fans for additional details on the fan specification. § Thermal and Mechanical
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 110
    Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 111
    refer to the reference thermal mechanical enabling components for the processor. Note: Intel reserves the right to make changes and modifications to the design as necessary. Drawing Description ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 112
    Figure 7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height 1. DIMENSIONS ARE IN MILLIMETERS. 2 GEOMETRIC CENTER OF CPU PACKAGE / SOCKET HOUSING CAVITY. 3. BOARD COMPONENET KEEP- BLVD. CORP. P.O. BOX 58119 A SANTA CLARA, CA 95052-8119 TITLE LGA775 microATX COMPONENT KEEP-INS
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 113
    Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 2 8 7 6 5 4 THIS DRAWING CONTAINS INTEL CONSENT OF INTEL CORPORAT ION. BOARD SECONDARY SIDE D 4X 6.00 4X 10.00 COMPONENT VOLUMETRIC KEEP-INS SOCKET BALL 1 SOCKET & PROCESSOR VOLUMETRIC KEEP-IN
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 114
    Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 3 8 THIS DRAWING CONTAINS INTEL ENTS OR WRITTEN CONSENT OF INTEL CORPORAT ION. 2X SOCKET & PROCESSOR VOLUMETRIC KEEP-IN 45 X CAVITY FOR CPU PACKAGE ( BLVD. CORP. P.O. BOX 58119 SANTA CLARA, CA
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 115
    Mechanical Drawings Figure 7-43. BTX Thermal Module Keep Out Volumetric - Sheet 1 Thermal and Mechanical Design Guidelines 115
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 116
    Figure 7-44. BTX Thermal Module Keep Out Volumetric - Sheet 2 Mechanical Drawings 116 Thermal and Mechanical Design Guidelines
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 117
    Mechanical Drawings Figure 7-45. BTX Thermal Module Keep Out Volumetric - Sheet 3 Thermal and Mechanical Design Guidelines 117
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 118
    Figure 7-46. BTX Thermal Module Keep Out Volumetric - Sheet 4 Mechanical Drawings 118 Thermal and Mechanical Design Guidelines
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 119
    Mechanical Drawings Figure 7-47. BTX Thermal Module Keep Out Volumetric - Sheet 5 Thermal and Mechanical Design Guidelines 119
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 120
    ALL UNTOLERANCED LINEAR DIMENSIONS ± 0.1 ANGLES ± 0.5 THIRD ANGLE PROJECTION DEPARTMENT TMD TITLE R 2200 MISSION COLLEGE BLVD. CORP. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 RCFH4 HS CLIP, 35mm core SIZE DRAWING NUMBER A1 C85609 REV A B SCALE: NONE DO NOT SCALE DRAWING SHEET 1 OF
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 121
    0.05 8 [ .010 .001 ] DETAIL C C SCALE 10 TYP 4 PLACES B DEPARTMENT TMD 4 SIZE DRAWING NUMBER REV A R 2200 MISSION COLLEGE BLVD. CORP. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 A1 SCALE: 1 C85609 DO NOT SCALE DRAWING 0 SHEET 2 OF 2 3 2 1 Thermal and Mechanical Design Guidelines
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 122
    Figure 7-50. Reference Fastener - Sheet 1 Mechanical Drawings 122 Thermal and Mechanical Design Guidelines
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 123
    Mechanical Drawings Figure 7-51. Reference Fastener - Sheet 2 Thermal and Mechanical Design Guidelines 123
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 124
    Figure 7-52. Reference Fastener - Sheet 3 Mechanical Drawings 124 Thermal and Mechanical Design Guidelines
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 125
    Mechanical Drawings Figure 7-53. Reference Fastener - Sheet 4 Thermal and Mechanical Design Guidelines 125
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 126
    REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. D 90.0 3.54 Mechanical Drawings 2 ZONE REV. REVISION HISTORY CHANDLER, ARIZONA 85226 DATE TITLE DATE E18764-00X A BOXED PROCESSOR FAN HEATSINK DATE FINISH: 3 THIRD ANGLE PROJECTION 2 SIZE CAGE
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 127
    and heatsink integrators pending completion of appropriate licensing contracts. For more information on licensing, contact the Intel representative mentioned in Table 7-4. Table 7-4. Intel® Representative Contact for Licensing Information of BTX Reference Design Company Intel Corporation Contact
  • Intel BX80570E8200 | Mechanical Design Guidelines - Page 128
    Mitac International Corp Part Description Support and Retention Module Part Number 131 AVC (ASIA Vital Components Co., Ltd) Fan and Duct TBD David Chao +886-222996930 Extension: user should note that for the 2004 Type I Intel reference Thermal Module Assembly: also meets 2005 Performance (
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Document Number:
318734-011
Intel
®
Core™2 Duo Processor
E8000
and E7000
Series, and
Intel
®
Pentium
®
Dual-Core
Processor E6000
and E5000
Series, and Intel
®
Celeron
®
Processor E3x00
Series
Thermal and Mechanical Design Guidelines
August 2009