ASRock B75M-DGS User Manual - Page 6

1.2 Specifications Platform CPU Chipset Memory Expansion Slot Graphics - Micro ATX Form Factor: 8.9-in x 7.2-in, 22.6 cm x 18.3 cm - All Solid Capacitor design - Supports 3rd and 2nd Generation Intel® CoreTM i7 / i5 / i3 in LGA1155 Package - 3 + 1 Power Phase Design - Supports Intel® Turbo Boost 2.0 Technology - Supports Hyper-Threading Technology (see CAUTION 1) - Intel® B75 - Supports Intel® Small Business Advantage (see CAUTION 2) - Supports Intel® Rapid Start Technology and Smart Connect Technology - Dual Channel DDR3 Memory Technology (see CAUTION 3) - 2 x DDR3 DIMM slots - Supports DDR3 1600/1333/1066 non-ECC, un-buffered memory (DDR3 1600 with Intel® Ivy Bridge CPU, DDR3 1333 with Intel® Sandy Bridge CPU) - Max. capacity of system memory: 16GB (see CAUTION 4) - Supports Intel® Extreme Memory Profile (XMP)1.3/1.2 - 1 x PCI Express 3.0 x16 slot (PCIE1: x16 mode) (see CAUTION 5) * PCIE 3.0 is only supported with Intel® Ivy Bridge CPU. With Intel® Sandy Bridge CPU, it only supports PCIE 2.0. - 1 x PCI Express 2.0 x1 slot * Intel® HD Graphics Built-in Visuals and the VGA outputs can be supported only with processors which are GPU integrated. - Supports Intel® HD Graphics Built-in Visuals: Intel® Quick Sync Video 2.0, Intel® InTruTM 3D, Intel® Clear Video HD Technology, Intel® InsiderTM, Intel® HD Graphics 2500/4000 - Pixel Shader 5.0, DirectX 11 with Intel® Ivy Bridge CPU. Pixel Shader 4.1, DirectX 10.1 with Intel® Sandy Bridge CPU - Max. shared memory 1760MB (see CAUTION 6) - Dual VGA Output: support DVI and D-Sub ports by independent display controllers - Supports DVI with max. resolution up to 1920x1200 @ 60Hz - Supports D-Sub with max. resolution up to 2048x1536 @ 75Hz - Supports HDCP function with DVI port 6