ASRock H55M-GE R2.0 User Manual - Page 22

TPM Header (17-pin TPMS1) (see p.11 No. 27) 1 PCICLK FRAME PCIRST# LAD3 +3V LAD0 +3VSB GND GND SMB_CLK_MAIN SMB_DATA_MAIN LAD2 LAD1 GND S_PWRDWN# SERIRQ# GND This connector supports a Trusted Platform Module (TPM) system, which can securely store keys, digital certificates, passwords, and data. A TPM system also helps enhance network security, protects digital identities, and ensures platform integrity. Print Port Header (25-pin LPT1) (see p.11 No. 29) AFD# ERROR# PINIT# SLIN# GND 1 SPD7 SPD6 ACK# SPD5 BUSY SPD4 PE SPD3 SLCT SPD2 SPD1 SPD0 STB# This is an interface for print port cable that allows convenient connection of printer devices. Infrared Module Header (5-pin IR1) (see p.11 No. 28) Chassis Intrusion Header (2-pin CI1) (see p.11 No. 30) IRTX +5VSB DUMMY 1 GND IRRX 1 GND Signal This header supports an optional wireless transmitting and receiving infrared module. This motherboard supports CASE OPEN detection feature that detects if the chassis cover has been removed. This feature requires a chassis with chassis intrusion detection design. Front Panel Audio Header (9-pin HD_AUDIO1) (see p.11 No. 36) GND PRESENCE# MIC_RET OUT_RET 1 OUT2_L J_SENSE OUT2_R MIC2_R MIC2_L This is an interface for front panel audio cable that allows convenient connection and control of audio devices. 1. High Definition Audio supports Jack Sensing, but the panel wire on the chassis must support HDA to function correctly. Please follow the instruction in our manual and chassis manual to install your system. 2. If you use AC'97 audio panel, please install it to the front panel audio header as below: A. Connect Mic_IN (MIC) to MIC2_L. B. Connect Audio_R (RIN) to OUT2_R and Audio_L (LIN) to OUT2_L. 22