ASRock H55M-LE Quick Installation Guide - Page 6

1.2 Specifications Platform CPU Chipset Memory Expansion Slot Graphics * Audio LAN - Micro ATX Form Factor: 9.6-in x 8.0-in, 24.4 cm x 20.3 cm - Solid Capacitor for CPU power - Supports Intel® CoreTM i7 / i5 / i3 and Pentium® G6950 Processors in LGA1156 Package - Supports Intel® Turbo Boost Technology (see CAUTION 1) - Supports Hyper-Threading Technology (see CAUTION 2) - Supports Untied Overclocking Technology (see CAUTION 3) - Supports EM64T CPU - Intel® H55 - Dual Channel DDR3 Memory Technology (see CAUTION 4) - 2 x DDR3 DIMM slots - Supports DDR3 2600+(OC)/2133(OC)/1866(OC)/1600/ 1333/1066 non-ECC, un-buffered memory - Max. capacity of system memory: 8GB (see CAUTION 5) - Supports Intel® Extreme Memory Profile (XMP) (see CAUTION 6) - 1 x PCI Express 2.0 x16 slot (5GT/s at x16 mode) - 1 x PCI Express 2.0 x1 slot (2.5GT/s) - 2 x PCI slots * Requires a Processor with Intel® Graphics Technology - Intel® HD Graphics - Pixel Shader 4.0, DirectX 10 - Max. shared memory 1759MB (see CAUTION 7) - Dual VGA Output options: support DVI-D and D-Sub ports by independent display controllers - Supports DVI with max. resolution up to 1920x1200 @ 60Hz - Supports D-Sub with max. resolution up to 2048x1536 @ 75Hz - Supports HDCP function with DVI port - Supports Full HD 1080p Blu-ray (BD) / HD-DVD playback with DVI port - DVI port can be transferred to a HDMI 1.3 port to support Deep Color, xvYCC and HBR audio (High Bit Rate Audio) (Compliant HDMI monitor is required) - 7.1 CH HD Audio (VIA® VT1718S Audio Codec) - PCIE x1 Gigabit LAN 10/100/1000 Mb/s - Realtek RTL8111DL - Supports Wake-On-LAN English 6 ASRock H55M-LE Motherboard