ASRock P75 Pro3 User Manual - Page 6

1.2 Specifications Platform CPU Chipset Memory Expansion Slot Audio LAN Rear Panel I/O - ATX Form Factor: 12.0-in x 7.0-in, 30.5 cm x 17.8 cm - All Solid Capacitor design - Supports 3rd and 2nd Generation Intel® CoreTM i7 / i5 / i3 in LGA1155 Package - Supports Intel® Turbo Boost 2.0 Technology - Intel® B75 - Supports Intel® Small Business Advantage (see CAUTION 1) - Supports Intel® Rapid Start Technology and Smart Connect Technology - Dual Channel DDR3 Memory Technology - 2 x DDR3 DIMM slots - Supports DDR3 2200(OC)*/1600/1333/1066 non-ECC, un-buffered memory (DDR3 1600 with Intel® Ivy Bridge CPU, DDR3 1333 with Intel® Sandy Bridge CPU) * DDR3 2200(OC) is only supported with Intel® CoreTM i7 3770K - Max. capacity of system memory: 16GB (see CAUTION 2) - Supports Intel® Extreme Memory Profile (XMP)1.3/1.2 - 1 x PCI Express 3.0 x16 slot (PCIE1: x16 mode) * PCIE 3.0 is only supported with Intel® Ivy Bridge CPU. With Intel® Sandy Bridge CPU, it only supports PCIE 2.0. - 1 x PCI Express 2.0 x16 slot (PCIE3: x4 mode) - 2 x PCI Express 2.0 x1 slots - 2 x PCI slots - Supports AMD Quad CrossFireXTM and CrossFireXTM - 7.1 CH HD Audio (Realtek ALC887 Audio Codec) * To configure 7.1 CH audio, please use an HD front panel audio module and enable the multi-channel audio feature through the audio driver. - PCIE x1 Gigabit LAN 10/100/1000 Mb/s - Realtek RTL8111E - Supports Wake-On-LAN - Supports LAN Cable Detection - Supports Energy Efficient Ethernet 802.3az - Supports PXE I/O Panel - 1 x PS/2 Mouse/Keyboard Port - 1 x Parallel Port (ECP/EPP Support) - 1 x Serial Port: COM1 6