Asus PR-DLS PR-DLS User Manual - Page 22

Core specifications

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1.4.2 Core specifications 1 DDR DIMM sockets. These six 184-pin DIMM sockets support up to 12GB system memory using registered ECC PC2100/1600 DDR DIMMs. 2 ServerWorks® 64-bit I/O Bridge (CIOB-X2). The Champion I/O Bridge (CIOB-X2) provides a high performance data flow path between the IMB and the I/O subsystem, which supports multiple PCI-X interfaces that allows large, efficient, and flexible I/O configurations. The CIOB-X2 supports dual 64-bit PCI-X I/O buses that comply with PCI 2.2 specification. There are two CIOB-X2 on the motherboard. 3 24/20-pin ATX power connector. This power connector is for an ATX power supply. 4 ServerWorks® Grand Champion LE north bridge (CMIC-LE). The Champion Memory and I/O Controller LE (CMIC-LE) acts as the host bridge of the Grand Champion Low End (GCLE) SystemSet. The CMIC-LE device interfaces directly to the processor bus, and integrates the functions of the main memory controller and the Inter Module Bus (IMB) interface unit. The processor interface supports a 400MHz Front Side Bus (FSB) providing a 3.2GB/s bandwidth, 2-way interleaved 3.2GB/s memory bandwidth with up to 12GB registered ECC PC2100/1600 DDR DIMMs, and two high speed IMBs plus one thin IMB to connect to the south bridge CSB5. 5 DIP switches. This 5-switch Dual Inline Package (DIP) allows you to set the CPU external frequency. 6 604-pin CPU sockets. A 604-pin surface mount, Zero Insertion Force (ZIF) socket for the Intel® Xeon™ processor with 512KB L2 cache and a 400 MHz system bus that allows up to 3.2GB/s data transfer rate. 7 8-pin 12V SSI power connector. This power connector is for an ATX power supply. 8 IDE connectors. These dual-channel bus master IDE connectors support up to four Ultra DMA/100/66, PIO Modes 3 & 4 IDE devices. Both the primary (blue) and secondary (black) connectors are slotted to prevent incorrect insertion of the IDE ribbon cable. 1-8 Chapter 1: Product introduction

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1-8
Chapter 1: Product introduction
DDR DIMM sockets.
These six 184-pin DIMM sockets support up
to 12GB system memory using registered ECC PC2100/1600 DDR
DIMMs.
ServerWorks
®
64-bit I/O Bridge (CIOB-X2).
The Champion I/O
Bridge (CIOB-X2) provides a high performance data flow path
between the IMB and the I/O subsystem, which supports multiple
PCI-X interfaces that allows large, efficient, and flexible I/O
configurations. The CIOB-X2 supports dual 64-bit PCI-X I/O buses
that comply with PCI 2.2 specification. There are two CIOB-X2 on
the motherboard.
24/20-pin ATX power connector.
This power connector is for an
ATX power supply.
ServerWorks
®
Grand Champion LE north bridge (CMIC-LE).
The Champion Memory and I/O Controller LE (CMIC-LE) acts as
the host bridge of the Grand Champion Low End (GCLE)
SystemSet. The CMIC-LE device interfaces directly to the
processor bus, and integrates the functions of the main memory
controller and the Inter Module Bus (IMB) interface unit. The
processor interface supports a 400MHz Front Side Bus (FSB)
providing a 3.2GB/s bandwidth, 2-way interleaved 3.2GB/s memory
bandwidth with up to 12GB registered ECC PC2100/1600 DDR
DIMMs, and two high speed IMBs plus one thin IMB to connect to
the south bridge CSB5.
DIP switches.
This 5-switch Dual Inline Package (DIP) allows you
to set the CPU external frequency.
604-pin CPU sockets.
A 604-pin surface mount, Zero Insertion
Force (ZIF) socket for the Intel
®
Xeon™ processor with 512KB L2
cache and a 400 MHz system bus that allows up to 3.2GB/s data
transfer rate.
8-pin 12V SSI power connector.
This power connector is for an
ATX power supply.
IDE connectors.
These dual-channel bus master IDE connectors
support up to four Ultra DMA/100/66, PIO Modes 3 & 4 IDE
devices. Both the primary (blue) and secondary (black) connectors
are slotted to prevent incorrect insertion of the IDE ribbon cable.
8
7
6
5
4
3
2
1
1.4.2
Core specifications