Compaq BL10e HP BladeSystem c-Class architecture
Compaq BL10e - HP ProLiant - 512 MB RAM Manual
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Compaq BL10e manual content summary:
- Compaq BL10e | HP BladeSystem c-Class architecture - Page 1
Signal midplane provides reliability 17 Power backplane scalability and reliability 18 Power and cooling architecture with HP Thermal Logic 18 Server blades and processors ...19 Enclosure ...19 Meeting data center configurations 19 High-efficiency voltage conversions 19 Dynamic Power Saver Mode - Compaq BL10e | HP BladeSystem c-Class architecture - Page 2
Reduced logistical delay time ...26 Conclusion...26 For more information...27 Call to action ...28 - Compaq BL10e | HP BladeSystem c-Class architecture - Page 3
look at the BladeSystem c3000 enclosure http://h20000.www2.hp.com/bc/docs/support/SupportManual/c01204885/c01204885.pdf • HP BladeSystem c-Class server blades-describes the architecture and implementation of major technologies in HP ProLiant c-Class server blades; including processors, memory - Compaq BL10e | HP BladeSystem c-Class architecture - Page 4
Early generations of server blades solved some data center problems by increasing density evaluating computing trends, HP saw that significant changes supports multiple high-speed fabrics in a protocol-agnostic manner, so administrators can populate the enclosure with server blades service quality. 4 - Compaq BL10e | HP BladeSystem c-Class architecture - Page 5
can hold up to 16 server, storage, or I/O option blades. Figure 1. HP BladeSystem c7000 Enclosure as viewed from the front and the rear c7000 enclosure - front Half-height server blade Full-height server blade Storage blade c7000 enclosure - rear 8 interconnect bays Single-wide or double - Compaq BL10e | HP BladeSystem c-Class architecture - Page 6
holding up to eight blades, to a rack containing seven enclosures holding up to 56 server, storage, or option blades total. Figure 2. HP BladeSystem c3000 enclosure (rack-model) as viewed from the front and the rear Figure 3. HP BladeSystem c3000 enclosure (tower model) as viewed from the front - Compaq BL10e | HP BladeSystem c-Class architecture - Page 7
enclosure- with its device bays, interconnect bays, NonStop signal midplane, and Onboard Administrator-is a general-purpose infrastructure that can support many different options of server blades, storage blades, and interconnect devices. BladeSystem c-Class supports ProLiant server blades using - Compaq BL10e | HP BladeSystem c-Class architecture - Page 8
enclosure, the enclosure is rotated 90 degrees so that the blades slide into the enclosure horizontally rather than vertically. The HP configuration using wider device bays offers several advantages: • Supports memory modules (DIMMs) in the server blades for cost effectiveness. • Provides improved - Compaq BL10e | HP BladeSystem c-Class architecture - Page 9
Interconnect form factors HP selected a single-wide enclosure, while the blades are located above and below to provide the shortest possible trace widths between interconnect modules and blades • Optimized form factors for supporting bandwidth to each of the server blades. When using a double-wide - Compaq BL10e | HP BladeSystem c-Class architecture - Page 10
NonStop signal midplane provides flexibility The BladeSystem c-Class uses a high-speed, NonStop signal midplane that provides the flexibility to intermingle blades and interconnect fabrics in many ways to solve a multitude of application needs. The NonStop signal midplane is unique because it can - Compaq BL10e | HP BladeSystem c-Class architecture - Page 11
to be single-wide (for a 1x/2x connection) or double-wide (for a 4x connection). Re-using the traces in this manner avoids the problems of having to replicate traces to support each type of fabric on the NonStop signal midplane or of having large numbers of signal pins for the interconnect module - Compaq BL10e | HP BladeSystem c-Class architecture - Page 12
and 2. Figure 9 gives an example of how c-Class half-height server blades connect to the interconnect bays in the c3000 enclosure. Customers should review the appropriate user guide for each enclosure. The guides are available at http://h71028.www7.hp.com/enterprise/cache/316682-0-0-0-121.html. 12 - Compaq BL10e | HP BladeSystem c-Class architecture - Page 13
in the c7000 to the interconnect bays Figure 9. Connection of c-Class half-height server blades in the c3000 enclosure to the interconnect bays. To provide such inherent flexibility of the NonStop signal midplane, the architecture must provide a mechanism to properly match the mezzanine cards - Compaq BL10e | HP BladeSystem c-Class architecture - Page 14
-to-back modularity is supported by installing mezzanine cards in the server blades at the front of the enclosure, and the matching interconnect modules in the rear of the enclosure. For side-to-side modularity, HP has introduced storage blade and local I/O option blades that communicate with an - Compaq BL10e | HP BladeSystem c-Class architecture - Page 15
For detailed information about the c-Class server blades, see the technology brief titled "HP ProLiant c-Class server blades," available at http://h20000.www2.hp.com/bc/docs/support/SupportManual/c01136096/c01136096.pdf. NonStop signal midplane scalability The NonStop signal midplane is capable of - Compaq BL10e | HP BladeSystem c-Class architecture - Page 16
signal pins by a ground plane in the in c-Class enclosure midplane Receive Signal Pins Interconnect Bay Connector Transmit Signal Pins Separate topology for Device 1 on server blade 1 (a-b-c) is completely different than the topology for device 1 on server blade 4 (a-d-e). Therefore, an electronic - Compaq BL10e | HP BladeSystem c-Class architecture - Page 17
require different emphasis settings Server blade-1 a DEV-1 Midplane b PCB Switch-1 PCB c Switch e Device Server blade-4 a d DEV-1 used for decades in high-availability solutions such as the HP NonStop S-series, core networking switches from Cisco, Juniper Networks and core SAN - Compaq BL10e | HP BladeSystem c-Class architecture - Page 18
Onboard Administrator allocates power to the device bays based on the specific configuration of each blade in the enclosure. As blades are inserted into the enclosure, the Onboard Administrator discovers each blade and allocates power accordingly, based on actual measured power requirements. Onboard - Compaq BL10e | HP BladeSystem c-Class architecture - Page 19
requirements of server blades, HP designed the c-Class enclosures to conform to typical data center facility power feeds. Thus, the enclosures are sized not only to amortize the cost of server blades across the infrastructure, but also to support the most server blades possible while using - Compaq BL10e | HP BladeSystem c-Class architecture - Page 20
possible because the power supplies are consolidated and shared across the enclosure. Active Cool fans Quite often, small form-factor servers such as blade or 1U servers use very small fans designed to provide localized cooling in specific areas. Because such fans generate fairly low flow (in cubic - Compaq BL10e | HP BladeSystem c-Class architecture - Page 21
the rest of the enclosure. One or more fans can fail and still leave enough fans to adequately cool the enclosure.6 To ensure scalability, HP designed both the fans on the HP technology website: www.hp.com/servers/technology. Integrated Lights-out technology Each ProLiant server blade designed for - Compaq BL10e | HP BladeSystem c-Class architecture - Page 22
. A simple Insight Display screen on the front of each HP BladeSystem c-Class enclosure (Figure 13) provides quick, on-site access to all the setup, management, and troubleshooting features of the Onboard Administrator. For example, when the enclosure is powered up for the first time, the Insight - Compaq BL10e | HP BladeSystem c-Class architecture - Page 23
provides the Onboard Administrator CLI, Insight Display, and KVM console connections to all the server blades in the enclosure. Virtualized network infrastructure with Virtual Connect technology HP BladeSystem c-Class is designed from the ground up integrating Virtual Connect technology. The OnBoard - Compaq BL10e | HP BladeSystem c-Class architecture - Page 24
www.hp.com/servers/technology. HP Virtual Connect Enterprise Manager is a software application that simplifies the management of large BladeSystem environments using Virtual Connect to control LAN and SAN connectivity. It allows administrators to seamlessly manage multiple c-Class enclosures using - Compaq BL10e | HP BladeSystem c-Class architecture - Page 25
. And the c7000 enclosure is capable of supporting either one or two enclosure to be a single point of failure, since it is not replicated. However, HP mitigated this risk and made the PCB extremely reliable: • Designed the NonStop signal midplane to provide redundant paths between the server blades - Compaq BL10e | HP BladeSystem c-Class architecture - Page 26
service from a failed server blade to a functional server blade. Finally, the fans, power supplies, interconnect modules, Onboard Administrator modules, server blades, and storage blades are hot-pluggable, meaning that they can be removed without affecting any other components in the enclosure - Compaq BL10e | HP BladeSystem c-Class architecture - Page 27
for ProLiant HP Technology Briefs: ƒ HP BladeSystem c-Class c7000 enclosure technologies ƒ HP BladeSystem c3000 Enclosure technologies ƒ HP Virtual Connect technology implementation for the HP BladeSystem c-Class ƒ Managing the HP BladeSystem c-Class ƒ HP ProLiant c-Class Server Blades ƒ HP - Compaq BL10e | HP BladeSystem c-Class architecture - Page 28
to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors
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HP BladeSystem c-Class architecture
technology brief, 2nd edition
Abstract
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3
Evaluating requirements for next-generation server and storage blades
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4
HP BladeSystem c-Class architecture overview
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4
Component overview
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5
General-purpose compute solution
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7
Physically scalable form factors
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7
Blade form factors
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7
Interconnect form factors
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9
Star topology
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9
NonStop signal midplane provides flexibility
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10
Physical layer similarities among I/O fabrics
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10
Connectivity between blades and interconnect modules
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12
NonStop signal midplane enables modularity
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14
BladeSystem c-Class architecture provides high bandwidth and compute performance
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14
Server-class components
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14
NonStop signal midplane scalability
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15
Best practices
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15
Separate power backplane
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16
Channel topology and emphasis settings
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16
Signal midplane provides reliability
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17
Power backplane scalability and reliability
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18
Power and cooling architecture with HP Thermal Logic
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18
Server blades and processors
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19
Enclosure
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19
Meeting data center configurations
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19
High-efficiency voltage conversions
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19
Dynamic Power Saver Mode
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20
Active Cool fans
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20
PARSEC architecture
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20
Configuration and management technologies
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21
Integrated Lights-out technology
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21
Onboard Administrator
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21
Virtualized network infrastructure with Virtual Connect technology
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23
Availability technologies
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25
Redundant configurations
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25
Reliable components
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25