Compaq BL10e HP BladeSystem c-Class architecture - Page 26
Reduced logistical delay time, Conclusion
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Finally, Onboard Administrator's thermal monitoring of the entire system ensures that the Active Cool fans deliver adequate cooling to the entire enclosure. Because the fan design uses a high-performance motor and impeller, it consumes less power and uses less airflow to cool an enclosure than a traditional fan design would. Because of its unique fan blade, housing, motor windings, bearings, and drive circuit, the Active Cool fan provides higher reliability than typical server fans. Reduced logistical delay time Like other ProLiant servers, the BladeSystem c-Class was designed with ease-of-use as a priority. Several important technologies in the BladeSystem c-Class reduce the amount of time needed to replace, upgrade, and configure systems: Onboard Administrator and the related Insight Display, Virtual Connect technology, and hot-plug devices. Onboard Administrator and Virtual Connect technologies have already been discussed in the section titled "Configuration and management technologies." With the intelligence of the Onboard Administrator and the easy-to-use Insight Display panel, administrators can configure and troubleshoot their systems in minutes, rather than hours or days. Adopting Virtual Connect technology removes administrative burdens from LAN and SAN administrators because that they are not required to change their network setup every time a configuration change occurs within the server blade environment. Furthermore, because the network connections are made to a pool of server blades, it is quick and easy to migrate the network service from a failed server blade to a functional server blade. Finally, the fans, power supplies, interconnect modules, Onboard Administrator modules, server blades, and storage blades are hot-pluggable, meaning that they can be removed without affecting any other components in the enclosure. Conclusion HP designed the BladeSystem c-Class as an architecture that would deliver on the promise of a modular, adaptive, automated data center. To do this, HP worked very closely with its customers to understand their requirements and challenges in managing their data centers. By combining this knowledge with the recognition of emerging industry standards and technologies, architects from multiple business units within HP collaborated to define the c-Class architecture, enclosure design, and Thermal Logic cooling technologies. The c-Class architectural model provides scalable device and interconnect bays plus power and cooling headroom that allows customers to add the components they need, when they need them. Customers can easily scale the enclosure from the minimum of one server blade to the maximum by adding more fans and power supplies. By designing a unique NonStop signal midplane that can adapt to customer needs and technology directions over multiple generations, HP has ensured flexibility and a long life for the BladeSystem c-Class. By consolidating key resources-volume space, power, cooling, and signal traces across the midplane-the BladeSystem c-Class ensures that resources can be shared efficiently to meet customer needs. The c-Class architecture is designed for longevity and interoperability with server blades, storage blades, and interconnect modules for several generations of products. The c-Class architecture enables multiple enclosure designs, optimized for different market segments. With the BladeSystem c-Class, HP has delivered even more hardware control, intelligent monitoring, automation capabilities, and virtualization capabilities than with previous generations of blade systems. The Onboard Administrator and Insight Display work in conjunction with the intelligent management processors on each server blade to provide information and control to administrators. In addition, HP has differentiated the BladeSystem c-Class from its competitors through HP Thermal Logic that dynamically monitors and controls power and cooling in an extremely cost-effective manner, and HP Virtual Connect technology that simplifies network management and IT changes by virtualizing I/O connections. 26