Compaq ProLiant 6500 Compaq ProLiant 7000 Server Technology - Page 22

Chassis Design, Processor Board, I/O Board

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ECG078/0698 TECHNOLOGY BRIEF (cont.) ... Chassis Design The ProLiant 7000 chassis has been engineered with flexibility, expandability, and longevity in mind. The chassis design features three key elements: • Extra space • Adaptable cabinet design • Extra airflow Pentium Pro processors are packaged in a pin-grid array (PGA) form factor, while the Pentium II Xeon processor from Intel has the new Single Edge Contact (SEC) cartridge form factor. The SEC cartridge and its associated heat sink are larger than the Pentium Pro PGA and require significantly more room in the chassis. When designing the ProLiant 7000 chassis, Compaq included enough room to accommodate the new Pentium II SEC cartridge form factor and up to eight processors. The chassis design also has the "headroom" to accommodate the additional airflow needed to cool an 8-way Pentium II Xeon configuration. The fans are mounted on sheet metal inserts that can easily be changed during the 8-way upgrade to provide the additional thermal capacity required. The ProLiant 7000 chassis design is extremely adaptable. As mentioned earlier, the chassis features separate compartments for the processor and I/O, which allow them to be replaced independently. All the sheet metal surrounding essential components can be easily changed to accommodate additional processors. This includes the processor board, the I/O board, and the I/O slots. Processor Board The ProLiant 7000 processor board is placed on a sheet metal subpan, as shown in Figure 15. The ProLiant 7000 Pentium Pro-based servers can be adapted to a new Pentium II Xeon-based system by simply removing the old subpan and sliding the new subpan and system board into the existing space. Subpan Processor Board Figure 15: Processor board and its corresponding subpan. I/O Board Like the processor board, the I/O board mounts on a subpan. A new I/O board and a new subpan of the same or different size can be added without a chassis change. 22

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T
ECHNOLOGY
B
RIEF
(cont.)
22
ECG078/0698
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Chassis Design
The ProLiant 7000 chassis has been engineered with flexibility, expandability, and longevity in
mind.
The chassis design features three key elements:
•
Extra space
•
Adaptable cabinet design
•
Extra airflow
Pentium Pro processors are packaged in a pin-grid array (PGA) form factor, while the Pentium II
Xeon processor from Intel has the new Single Edge Contact (SEC) cartridge form factor.
The
SEC cartridge and its associated heat sink are larger than the Pentium Pro PGA and require
significantly more room in the chassis. When designing the ProLiant 7000 chassis, Compaq
included enough room to accommodate the new Pentium II SEC cartridge form factor and up to
eight processors.
The chassis design also has the “headroom” to accommodate the additional airflow needed to cool
an 8-way Pentium II Xeon configuration.
The fans are mounted on sheet metal inserts that can
easily be changed during the 8-way upgrade to provide the additional thermal capacity required.
The ProLiant 7000 chassis design is extremely adaptable.
As mentioned earlier, the chassis
features separate compartments for the processor and I/O, which allow them to be replaced
independently.
All the sheet metal surrounding essential components can be easily changed to
accommodate additional processors.
This includes the processor board, the I/O board, and the I/O
slots.
Processor Board
The ProLiant 7000 processor board is placed on a sheet metal subpan, as shown in Figure 15.
The ProLiant 7000 Pentium Pro-based servers can be adapted to a new Pentium II Xeon-based
system by simply removing the old subpan and sliding the new subpan and system board into the
existing space.
Processor
Board
Subpan
Figure 15: Processor board and its corresponding subpan.
I/O Board
Like the processor board, the I/O board mounts on a subpan.
A new I/O board and a new subpan
of the same or different size can be added without a chassis change.