HP 2000-2a28CA HP 2000 Notebook PC and Compaq CQ58 Notebook PC - Maintenance a - Page 102
equipped with an Intel processor and a graphics subsystem with discrete memory.
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● Thermal paste is used on the processor (1) and the heat sink section (2) that services it NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel processor and a graphics subsystem with discrete memory. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● Thermal paste is used on the graphics subsystem chip (3) and the heat sink section (4) that services it NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel processor and a graphics subsystem with UMA memory. 94 Chapter 4 Removal and replacement procedures ENWW
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
NOTE:
The following illustration shows the replacement thermal material locations on a computer model
equipped with an Intel processor and a graphics subsystem with discrete memory.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
Thermal paste is used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that services it
NOTE:
The following illustration shows the replacement thermal material locations on a computer model
equipped with an Intel processor and a graphics subsystem with UMA memory.
94
Chapter 4
Removal and replacement procedures
ENWW