HP 2G Innovative technologies in HP ProLiant Gen8 servers - Page 4

Processors We use Intel Xeon E5-2600 series processors in the newly introduced 2-socket ProLiant Gen8 servers and c-Class server blades. These processors use hafnium-based, 32 nm Hi-k metal gate silicon technology and are based on the Intel Core Microarchitecture Sandy Bridge. Xeon E5-2600 series processors in our ProLiant Gen8 servers have two, four, six, or eight cores and operate from 60 W (Xeon LP) to 135 W. These processors feature an integrated northbridge and memory controller. The processors work with Registered (R) DIMMs, Unbuffered (U) DIMMs, Low-Voltage (LV) DIMMs, and Load-Reduced (LR) DIMMs. Table 1 summarizes the features of Xeon E5-2600 processors used in ProLiant Gen8 servers. Table 1: Intel Xeon E5-2600 processors Intel Xeon E5-2600 Cores 2, 4, 6, 8 L1/L2 Cache 32 KB / 256 KB L3 Cache 2.5 MB/core Direct Media Interface (DMI) x4 PCIe Gen2 speed Integrated PCI Express (PCIe) 40 lanes PCIe 3.0 QuickPath Interconnect links 2 DDR3 Memory controller (Channels/ DIMMs per channel) 4 Ch / 3 DPC Memory supported RDIMMs, UDIMMs, LVDIMMs, LRDIMMs Memory data rates 1600 MT/s Power 60 W-135 W The x4 DMI link is a bi-directional chip-to-chip interconnect between the processor and chipset. The link provides a total of 20 Gb/s in each direction, or 2.5 GB/s per unidirectional lane. Integrated PCI Express 3.0 lanes connect directly to the processor for increased performance and efficiency. For additional information about Intel Xeon E5-2600 series processors, read the HP paper titled ―AMD Opteron and Intel Xeon x86 processors in industry-standard servers.‖ It's available at www.hp.com/servers/technology. Memory technologies ProLiant Gen8 servers support HP SmartMemory and enhanced memory protection with HP Advanced Memory Error Detection Technology. HP SmartMemory IT trends such as server virtualization, cloud computing, and high-performance computing have significantly increased the average memory capacity of servers in the last several years. As a result, DRAM manufacturers are increasing chip component densities to support higher memory capacities. The combination of higher memory demand, component complexity, and availability requirements has increased the importance of system memory. It significantly defines the system's reliability, 4