HP 3PAR StoreServ 7400 2-node HP 3PAR CIM API Programming Reference (OS 3.1.2 - Page 260
Description Single or double sided., Values {Unknown} ], uint16 SideType, Description CAS latency.
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[Description ("Single or double sided. ValueMap {"0"}, Values {"Unknown"} ] uint16 SideType; Not supported yet."), [Description ("Standard or stacked chips. Not supported yet."), ValueMap {"0"}, Values {"Unknown"} ] uint16 ChipsType; [Description ("CAS latency. / , in nS.") ] string CASLatency; Format: CL [Description ("JEDEC ID.") ] string JedecID; [Description ("Revision code.") ] string Revision; }; TPD NodePackagedMemory Association, Aggregation, Description ( "A Physical Memory contained by a Node PhysicalPackage.")] class TPD_NodePackagedMemory : CIM_PackagedComponent { [Aggregate, Override ( "GroupComponent" ), Max ( 1 ), Description ( "The NodePackage that contains PhysicalMemory(s).")] TPD_NodePackage REF GroupComponent; [Override ( "PartComponent" ), Description ( "The PhysicalMemory which is contained in the NodePackage.")] TPD_PhysicalMemory REF PartComponent; }; TPD IDE Drive Description ( "HP 3PAR IDE Drive in Controller Node.")] class TPD_IDEDrive : CIM_PhysicalComponent { [Description ("Position of the IDE Drive in the Node.") ] uint16 Position; [Description ("Firmware Revision code.") ] string FirmwareVersion; [Description ("Max Logical Block Address.") ] uint64 MaxLBA; [Description ("Capacity of the drive in bytes.") ] uint64 Capacity; }; TPD NodePackagedIDE Association, Aggregation, Description ( "An IDE Drive contained by a Node PhysicalPackage.")] class TPD_NodePackagedIDE : CIM_PackagedComponent { 260 Managed Object Format Files