HP BL680c Delivering an Adaptive Infrastructure with the HP BladeSystem c-Clas - Page 11

configuration. A single Onboard Administrator module provides four services for the entire enclosure: discovery, identification, management, and control. An optional second Onboard Administrator in the c7000 enclosure provides complete redundancy for these services. ProLiant server blades and BladeSystem enclosures include enterprise-class technologies that support reliability, serviceability, and availability: • Hot-plug disk drives - SAS, SATA, and in the future, solid state drives (SSD)7 allow customers to choose the level of flexibility, performance, cost, and availability they need • Network interconnects - Embedded multifunction Gigabit Ethernet that use TCP/IP offload engine (TOE) technology provide higher availability by offloading TCP/IP network stack processing. HP 10 Gigabit network interconnects that use HP advanced Flex-10 NIC technology can partition the wide pipeline of a 10 Gb connection into four smaller pipelines, enabling redundancy and availability. • Processor socket technology - The latest Intel AMD processor packages use Land Grid Array (LGA) socket technology to enable higher CPU bus speeds. To prevent damage to the delicate processor socket pins, HP engineers developed a special tool to simplify and ease processor installation. • Integrated Lights-Out (iLO) management - HP BladeSystem c-Class employs iLO 2 processors to configure, update, and operate individual server blades remotely. The iLO management processor resides on the system board, using auxiliary power and operating independently of the host processor and the OS. Because it is independent of the OS, iLO is fully operational during server blade shut-downs and reboots. It does not depend on the host processor for operation; it is autonomous from the server hardware; and it can perform out-of-band management without any assistance from the OS. • Multiple I/O connectivity options: - Local direct-attached storage devices - SAS switches - Smart Array controllers that support RAID levels 0, 1, 1+0, 5, 6 with ADG, 50, and 60 with optional Battery-Backed Write Cache (BBWC) for availability Energy efficiency Because of their shared power and cooling, server blades across the industry use less power than their rack-mounted counterparts; and HP has invested significant resources in making the BladeSystem c-Class an exemplar of the savings possible when sharing power and cooling resources. The efficient BladeSystem c-Class architecture addresses the concern of balancing performance density with the power and cooling capacity of the data center. Thermal Logic technologies- mechanical features and control capabilities throughout the BladeSystem c-Class-enable IT administrators to optimize their power and thermal environment. HP Thermal Logic uses built-in instrumentation, accurate monitoring and control, and the ability to pool, share and allocate power to ensure the amount of power and cooling matches the demand. 7 In the first half of 2009, HP expects to introduce hot-plug SSDs using standard drive carriers that will be supported across the ProLiant product family. 11