HP Dv5-1140us HP Pavilion dv5 Entertainment PC - Maintenance and Service Guide - Page 108
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7. Remove the fan/heat sink assembly (3). NOTE: Due to the adhesive quality of the thermal material located between the heat sink and system board components, it may be necessary to move the heat sink from side to side to detach the assembly. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board each time the fan/heat sink assembly is removed. Thermal paste is used on the processor (1) and the heat sink section (2) that services it. Thermal pads are used on the Northbridge chip (3), the graphics subsystem chip (4), and the sections of the heat sink (5) that service them. Replacement thermal material is included with all fan/heat sink assembly, system board, and processor spare part kits. The following illustration shows the replacement thermal material locations for computer models equipped with graphics subsystems with discrete memory. 100 Chapter 4 Removal and replacement procedures