HP HDX X16-1006TX HP HDX 16 Entertainment PC - Maintenance and Service Guide - Page 95
and the s of the, Replacement thermal material is included with all fan/heat sink assembly
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✎ The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly, the system board, and the processor each time the fan/heat sink assembly is removed: ■ Thermal paste is used on the processor 1 and the heat sink section 2 that services it. ■ Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it. ■ Thermal pads are used on various other system board components 5 and 7, and the sections of the heat sink 6 and 8. Replacement thermal material is included with all fan/heat sink assembly, system board, and processor spare part kits. Reverse this procedure to install the fan/heat sink assembly. Removal and replacement procedures 4-60
Removal and replacement procedures
4–60
✎
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly, the system board,
and the processor each time the fan/heat sink assembly is removed:
■
Thermal paste is used on the processor
1
and the heat sink section
2
that services it.
■
Thermal pads are used on the Northbridge chip
3
and the heat sink section
4
that services it.
■
Thermal pads are used on various other system board components
5
and
7
, and the sections of the
heat sink
6
and
8
.
Replacement thermal material is included with all fan/heat sink assembly, system board, and processor spare
part kits.
Reverse this procedure to install the fan/heat sink assembly.