Intel BLKDP55KG Product Specification - Page 59

Localized High Temperature Zones, Table 23., Thermal Considerations for Components

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Technical Reference Item A B C Description Processor voltage regulator area Processor Intel P55 Express Chipset Figure 17. Localized High Temperature Zones Table 23 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 23. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel P55 Express Chipset 111 oC (under bias) For information about Processor datasheets and specification updates Refer to Section 1.3, page 14 59

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Technical Reference
59
Item
Description
A
Processor voltage regulator area
B
Processor
C
Intel P55 Express Chipset
Figure 17.
Localized High Temperature Zones
Table 23 provides maximum case temperatures for the components that are sensitive
to thermal changes.
The operating temperature, current load, or operating frequency
could affect case temperatures.
Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 23.
Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel P55 Express Chipset
111
o
C (under bias)
For information about
Refer to
Processor datasheets and specification updates
Section 1.3, page 14