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Intel DH77KC Technical Product Specification - Page 65

Reliability, Environmental

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Technical Reference 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Issue 2; Method I Case 3 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the Intel Desktop Board DH77KC is 182,503 hours. 2.8 Environmental Table 41 lists the environmental specifications for the board. Table 41. Environmental Specifications Parameter Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged Specification -20 °C to +70 °C 0 °C to +55 °C 50 g trapezoidal waveform Velocity change of 170 inches/s² Half sine 2 millisecond Product Weight (pounds) Free Fall (inches)

Section	Page
Intel® Desktop Board DH77KC Technical Product Specification	1
Revision History	2
Board Identification Information	3
Errata	3
Preface	5
Intended Audience	5
What This Document Contains	5
Typographical Conventions	5
Contents	7
1 Product Description	11
1.1 Overview	11
1.1.1 Feature Summary	11
1.1.2 Board Layout	13
1.1.3 Block Diagram	15
1.2 Online Support	16
1.3 Processor	16
1.3.1 Graphics Subsystem	17
1.4 System Memory	19
1.4.1 Memory Configurations	20
1.5 Intel® H77 Express Chipset	22
1.5.1 Direct Media Interface (DMI)	22
1.5.2 Display Interfaces	22
1.5.3 USB	25
1.5.4 SATA Interfaces	25
1.6 Real-Time Clock Subsystem	27
1.7 Legacy I/O Controller	27
1.7.1 Consumer Infrared (CIR)	27
1.8 Audio Subsystem	28
1.8.1 Audio Subsystem Software	28
1.8.2 Audio Subsystem Components	29
1.9 LAN Subsystem	30
1.9.1 Intel® 82579V Gigabit Ethernet Controller	30
1.9.2 LAN Subsystem Software	31
1.9.3 RJ-45 LAN Connector with Integrated LEDs	31
1.10 Hardware Management Subsystem	32
1.10.1 Hardware Monitoring	32
1.10.2 Fan Monitoring	32
1.10.3 Chassis Intrusion and Detection	32
1.10.4 Thermal Monitoring	33
1.11 Power Management	34
1.11.1 ACPI	34
1.11.2 Hardware Support	36
2 Technical Reference	41
2.1 Memory Resources	41
2.1.1 Addressable Memory	41
2.1.2 Memory Map	43
2.2 Connectors and Headers	43
2.2.1 Back Panel Connectors	44
2.2.2 Component-side Connectors and Headers	45
2.3 Jumper Block	58
2.4 Mechanical Considerations	60
2.4.1 Form Factor	60
2.5 Electrical Considerations	61
2.5.1 Power Supply Considerations	61
2.5.2 Fan Header Current Capability	62
2.5.3 Add-in Board Considerations	62
2.6 Thermal Considerations	62
2.7 Reliability	65
2.8 Environmental	65
3 Overview of BIOS Features	67
3.1 Introduction	67
3.2 BIOS Flash Memory Organization	68
3.3 Resource Configuration	68
3.3.1 PCI Express Autoconfiguration	68
3.4 System Management BIOS (SMBIOS)	69
3.5 Legacy USB Support	69
3.6 BIOS Updates	70
3.6.1 Language Support	70
3.6.2 Custom Splash Screen	71
3.7 BIOS Recovery	71
3.8 Boot Options	72
3.8.1 Optical Drive Boot	72
3.8.2 Network Boot	72
3.8.3 Booting Without Attached Devices	72
3.8.4 Changing the Default Boot Device During POST	72
3.9 Adjusting Boot Speed	73
3.9.1 Peripheral Selection and Configuration	73
3.9.2 BIOS Boot Optimizations	73
3.10 BIOS Security Features	74
3.11 BIOS Performance Features	75
4 Error Messages and Beep Codes	77
4.1 Speaker	77
4.2 BIOS Beep Codes	77
4.3 Front-panel Power LED Blink Codes	78
4.4 BIOS Error Messages	78
4.5 Port 80h Power On Self Test (POST) Codes	79
5 Regulatory Compliance and Battery Disposal Information	85
5.1 Regulatory Compliance	85
5.1.1 Safety Standards	85
5.1.2 European Union Declaration of Conformity Statement	86
5.1.3 Product Ecology Statements	87
5.1.4 China RoHS	90
5.1.5 EMC Regulations	91
5.1.6 ENERGY STAR* 5.0, e-Standby, and ErP Compliance	93
5.1.7 Regulatory Compliance Marks (Board Level)	94