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Intel DQ57TM Product Specification - Page 64

Reliability, Environmental

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Intel Desktop Board DQ57TM Technical Product Specification 2.8 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia "Reliability Prediction Procedure for Electronic Equipment" SR-332 Issue 1, an update of Bellcore TR-332, Issue 6. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is 107,515 hours. 2.9 Environmental Table 32 lists the environmental specifications for the board. Table 32. Environmental Specifications Parameter Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged Specification -40 °C to +60 °C 0 °C to +40 °C 50 g trapezoidal waveform Velocity change of 170 inches/second² Half sine 2 millisecond Product Weight (pounds) Free Fall (inches)

Section	Page
Intel® Desktop Board DQ57TM Technical Product Specification	1
Revision History	2
Preface	3
Intended Audience	3
What This Document Contains	3
Typographical Conventions	3
Contents	5
1 Product Description	9
1.1 Overview	9
1.1.1 Feature Summary	9
1.1.2 Board Layout	11
1.1.3 Block Diagram	13
1.2 Legacy Considerations	14
1.3 Online Support	14
1.4 Processor	14
1.5 Intel® Q57 Express Chipset	15
1.6 System Memory	15
1.6.1 Memory Configurations	16
1.7 Graphics Subsystem	18
1.7.1 Integrated Graphics	18
1.7.2 PCI Express x16 Graphics	19
1.8 USB	19
1.9 SATA Interfaces	20
1.10 Legacy I/O Controller	21
1.10.1 Serial Port	21
1.11 Audio Subsystem	21
1.11.1 Audio Subsystem Software	21
1.11.2 Audio Headers and Connectors	22
1.12 LAN Subsystem	23
1.12.1 Intel® 82578DM Gigabit Ethernet Controller	23
1.12.2 LAN Subsystem Software	23
1.12.3 RJ-45 LAN Connector with Integrated LEDs	24
1.13 Real-Time Clock Subsystem	25
1.14 Thermal Monitoring	26
1.15 Platform Management and Security	27
1.15.1 Hardware Management Subsystem	27
1.15.2 Intel® vPro™ Technology	28
1.16 Power Management	33
1.16.1 ACPI	34
1.16.2 Hardware Support	37
1.16.3 ENERGY STAR* 5.0, e-Standby, and ErP Compliance	41
2 Technical Reference	43
2.1 Memory Resources	43
2.1.1 Addressable Memory	43
2.1.2 Memory Map	45
2.2 Connectors and Headers	45
2.2.1 Back Panel Connectors	46
2.2.2 Component-side Connectors and Headers	47
2.3 BIOS Configuration Jumper Block	56
2.4 Clear CMOS Header	58
2.5 Mechanical Considerations	59
2.5.1 Form Factor	59
2.6 Electrical Considerations	60
2.6.1 Power Supply Considerations	60
2.6.2 Fan Header Current Capability	61
2.6.3 Add-in Board Considerations	61
2.7 Thermal Considerations	62
2.8 Reliability	64
2.9 Environmental	64
3 Overview of BIOS Features	65
3.1 Introduction	65
3.2 System Management BIOS (SMBIOS)	67
3.3 Legacy USB Support	67
3.4 BIOS Updates	68
3.4.1 Language Support	68
3.4.2 Custom Splash Screen	69
3.5 BIOS Recovery	69
3.6 Boot Options	70
3.6.1 Optical Drive Boot	70
3.6.2 Network Boot	70
3.6.3 Booting Without Attached Devices	70
3.6.4 Changing the Default Boot Device During POST	70
3.7 Hard Disk Drive Password Security Feature	71
3.8 BIOS Security Features	72
4 Error Messages and Beep Codes	75
4.1 Speaker	75
4.2 BIOS Beep Codes	75
4.3 Front-panel Power LED Blink Codes	76
4.4 BIOS Error Messages	76
4.5 Port 80h POST Codes	77
5 Regulatory Compliance and Battery Disposal Information	83
5.1 Regulatory Compliance	83
5.1.1 Safety Standards	83
5.1.2 European Union Declaration of Conformity Statement	84
5.1.3 Product Ecology Statements	85
5.1.4 EMC Regulations	89
5.1.5 Product Certification Markings (Board Level)	90