Intel DQ67OW DQ67OW Technical Product Specification - Page 9
Product Description - lga1155
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1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]) Processor Chipset Memory Graphics Audio • Intel® Core™ i7, Intel® Core™ i5, Intel® Core™ i3, and Intel® Pentium® processors in an LGA1155 socket with up to 95 W TDP: ― Integrated graphics processing (processors with Intel® Graphics Technology) ― External graphics interface controller ― Integrated memory controller Intel® Q67 Express Chipset consisting of the Intel® Q67 Platform Controller Hub (PCH) • Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets • Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs • Support for 1 Gb, 2 Gb, and 4 Gb memory technology • Support for up to 32 GB of system memory with four DIMMs using 4 Gb memory technology • Support for non-ECC memory • Integrated graphics support for processors with Intel® Graphics Technology: ― VGA ― DVI-D • Discrete graphics support for PCI Express 2.0 x16 add-in graphics card • Intel® High Definition Audio: ― Realtek* ALC888S audio codec ― S/PDIF audio header ― Front panel audio header ― Mono speaker header continued 9