Intel DX58OG English Product Guide - Page 16

Intel® X58 Express Chipset, Audio Subsystem

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Intel Desktop Board DX58OG Product Guide Intel® X58 Express Chipset The Intel X58 Express Chipset consists of the following devices: • Intel X58 Express Chipset I/O Hub (IOH) • Intel 82801IJR I/O Controller Hub (ICH10R) The IOH provides interfaces to the processor and the PCI Express bus. ICH10R is the centralized controller for the board's I/O paths. Go to the following link for more information about the Intel X58 Express Chipset: http://developer.intel.com/products/chipsets/index.htm Audio Subsystem The onboard audio subsystem consists of the following components: • Intel® ICH10R I/O controller hub • RealTek ALC892 codec The subsystem has the following headers and connectors: • Back panel audio connectors • High Definition (HD) Audio front panel header that provides mic in and line out signals for front panel audio connectors The audio subsystem supports the following features: • A signal-to-noise (S/N) ratio of 95 dB • Independent multi-streaming 6-channel (5.1) audio (using the back panel audio connectors) and 2-channel audio (using the Intel High Definition Audio front panel header) Go to the following link or pages for more information about: • The location of the onboard audio headers, Figure 23 on page 46 • The signal names for the Intel High Definition Audio front panel header, page 47 • The back panel audio connectors, Figure 24 on page 51 16

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Intel Desktop Board DX58OG Product Guide
16
Intel
®
X58 Express Chipset
The Intel X58 Express Chipset consists of the following devices:
•
Intel X58 Express Chipset I/O Hub (IOH)
•
Intel 82801IJR I/O Controller Hub (ICH10R)
The IOH provides interfaces to the processor and the PCI Express bus.
ICH10R is the
centralized controller for the board’s I/O paths.
Go to the following link for more information about the Intel X58 Express Chipset:
Audio Subsystem
The onboard audio subsystem consists of the following components:
•
Intel
®
ICH10R I/O controller hub
•
RealTek ALC892 codec
The subsystem has the following headers and connectors:
•
Back panel audio connectors
•
High Definition (HD) Audio front panel header that provides mic in and line out
signals for front panel audio connectors
The audio subsystem supports the following features:
•
A signal-to-noise (S/N) ratio of 95 dB
•
Independent multi-streaming 6-channel (5.1) audio (using the back panel audio
connectors) and 2-channel audio (using the Intel High Definition Audio front panel
header)
Go to the following link or pages for more information about:
•
The location of the onboard audio headers, Figure 23 on page 46
•
The signal names for the Intel High Definition Audio front panel header, page 47
•
The back panel audio connectors, Figure 24 on page 51