Intel P8700 Data Sheet - Page 55
MB Die Micro-FCBGA Processor Package Drawing Sheet 1 of 2
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Package Mechanical Specifications and Pin Information Figure 12. 3-MB Die Micro-FCBGA Processor Package Drawing (Sheet 1 of 2) Datasheet B B1 SEE DETAIL B 479 BALLS G1 H1 C2 C1 TOP VIEW SEE DETAIL A FRONT VIEW øM DETAIL B SCALE 50 B2 J2 A SIDE VIEW SYMBOL B1 B2 C1 C2 F2 F3 G1 G2 H1 H2 J1 J2 M N W MILLIMETERS MIN MAX 34.95 35.05 34.95 35.05 8.7 9.4 0.88 1.937 2.207 31.75 BASIC 31.75 BASIC 15.875 BASIC 15.875 BASIC 1.27 BASIC 1.27 BASIC 0.61 0.69 0.6 0.8 6g COMMENTS ø0.203 L C A B ø0.071 L J1 BOTTOM VIEW Package Substrate Die Underfill N DETAIL A SCALE 20 G2 H2 F2 F3 C 0.203 B6741-01 D93702(1) 55
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Package Mechanical Specifications and Pin Information
Datasheet
55
Figure 12.
3-MB Die Micro-FCBGA Processor Package Drawing (Sheet 1 of 2)
B6741-01
D93702(1)
TOP VIEW
FRONT VIEW
SIDE VIEW
BOTTOM VIEW
DETAIL
B
SCALE 50
DETAIL
A
SCALE 20
F
3
0.203
F
2
C
Package
Substrate
Underfill
Die
N
SEE DETAIL
A
SEE DETAIL
B
479 BALLS
B
A
B
2
B
1
C
2
C
1
H
2
J
1
J
2
G
2
H
1
G
1
B
1
34.95
34.95
35.05
1.937
2.207
0.61
0.69
35.05
SYMBOL
COMMENTS
MILLIMETERS
MIN
MAX
B
2
9.4
C
2
8.7
C
1
0.88
F
2
31.75 BASIC
G
2
31.75 BASIC
G
1
15.875 BASIC
H
2
15.875 BASIC
H
1
W
M
6g
N
0.6
0.8
1.27 BASIC
J
2
1.27 BASIC
J
1
F
3
ø
0.203
C
A
L
B
ø
0.071
ø
M
L