Intel Q9300 Data Sheet - Page 76

Table 5-1., Processor Thermal Specifications - power consumption

Get Intel Q9300 - Core 2 Quad 2.5 GHz 6M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor PDF manuals and user guides
UPC - 675900938236
View all Intel Q9300 manuals
Add to My Manuals
Save this manual to your list of manuals

Page 76 highlights

Thermal Specifications and Design Considerations The case temperature is defined at the geometric top center of the processor. Analysis indicates that real applications are unlikely to cause the processor to consume maximum power dissipation for sustained time periods. Intel recommends that complete thermal solution designs target the Thermal Design Power (TDP) indicated in Table 5-1 instead of the maximum processor power consumption. The Thermal Monitor feature is designed to protect the processor in the unlikely event that an application exceeds the TDP recommendation for a sustained periods of time. For more details on the usage of this feature, refer to Section 5.2. In all cases the Thermal Monitor or Thermal Monitor 2 feature must be enabled for the processor to remain within specification. Table 5-1. Processor Thermal Specifications Processor Number Core Freq. (GHz) Thermal Design Power (W) 3, 4 Extended HALT Power (W)1 Deeper Sleep Power (W)2 QX9770 3.20 136 16 - QX9650 3.00 130 16 - Q9650 3.0 95 12 8 Q9550 2.83 95 12 8 Q9550 2.83 95 12 - Q9505 2.83 95 12 - Q9450 2.66 95 12 - Q9400 2.66 95 12 8 Q9300 2.50 95 12 - Q8400 2.66 95 12 8 Q8300 2.50 95 12 8 Q8200 2.33 95 12 - Q9550S 2.83 65 12 8 Q9505S 2.83 65 12 8 Q9400S 2.66 65 12 8 Q8400S 2.66 65 12 8 Q8200S 2.33 65 12 8 775_VR_CO NFIG5 Minimum TC (°C) Maximum TC (°C) Notes See Table 5-2 - 5 and 8 Figure 5-1 775_VR_CO NFIG_05B See Table 5-3 5 and 7, 8 Figure 5-2 775_VR_CO NFIG_05A 5 6 5 6 5 7 5 7 5 See Table 5-4 7 and 5 Figure 5-3 6 5 7 5 6 5 6 5 7 775_VR_CO NFIG_06 5 6 5 See Table 5-5 6 5 and 6 5 Figure 5-4 6 5 6 NOTES: 1. Specification is at 37° C Tc and minimum voltage loadline. Specification is ensured by design characterization and not 100% tested. 2. Specification is at 34° C Tc and minimum voltage loadline. Specification is ensured by design characterization and not 100% tested. 3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power that the processor can dissipate. 4. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the maximum TC will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for the allowed combinations of power and TC. 5. 775_VR_CONFIG_05 guidelines provide a design target for meeting future thermal requirements. 6. These processors have CPUID = 1067Ah. 7. These processors have CPUID = 10677h. 8. These processors have CPUID = 10676h. 76 Datasheet

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
Thermal Specifications and Design Considerations
76
Datasheet
The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 5-1
instead of the maximum processor power consumption. The Thermal Monitor
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to
Section 5.2
.
In all cases the Thermal Monitor or
Thermal Monitor 2 feature must be enabled for the processor to remain within
specification.
NOTES:
1.
Specification is at 37° C Tc and minimum voltage loadline. Specification is ensured by
design characterization and not 100% tested.
2.
Specification is at 34° C Tc and minimum voltage loadline. Specification is
ensured
by design
characterization and not 100% tested.
3.
Thermal Design Power (TDP) should be used for processor thermal solution design targets.
The TDP is not the maximum power that the processor can dissipate.
4.
This table shows the maximum TDP for a given frequency range. Individual processors
may have a lower TDP. Therefore, the maximum T
C
will vary depending on the TDP of the
individual processor. Refer to thermal profile figure and associated table for the allowed
combinations of power and T
C
.
5.
775_VR_CONFIG_05 guidelines provide a design target for meeting future thermal
requirements.
6.
These processors have CPUID = 1067Ah.
7.
These processors have CPUID = 10677h.
8.
These processors have CPUID = 10676h.
Table 5-1.
Processor Thermal Specifications
Processor
Number
Core
Freq.
(GHz)
Thermal
Design
Power
(W)
3, 4
Extended
HALT
Power
(W)
1
Deeper
Sleep
Power
(W)
2
775_VR_CO
NFIG
5
Minimum
T
C
(°C)
Maximum T
C
(°C)
Notes
QX9770
3.20
136
16
—
—
5
See
Table 5-2
and
Figure 5-1
8
QX9650
3.00
130
16
—
775_VR_CO
NFIG_05B
5
See
Table 5-3
and
Figure 5-2
7, 8
Q9650
Q9550
Q9550
Q9505
Q9450
Q9400
Q9300
Q8400
Q8300
Q8200
3.0
2.83
2.83
2.83
2.66
2.66
2.50
2.66
2.50
2.33
95
95
95
95
95
95
95
95
95
95
12
12
12
12
12
12
12
12
12
12
8
8
—
—
—
8
—
8
8
—
775_VR_CO
NFIG_05A
5
5
5
5
5
5
5
5
5
5
See
Table 5-4
and
Figure 5-3
6
6
7
7
7
6
7
6
6
7
Q9550S
Q9505S
Q9400S
Q8400S
Q8200S
2.83
2.83
2.66
2.66
2.33
65
65
65
65
65
12
12
12
12
12
8
8
8
8
8
775_VR_CO
NFIG_06
5
5
5
5
5
See
Table 5-5
and
Figure 5-4
6
6
6
6
6