Lenovo B50-10 Laptop Hardware Maintenance Manual - Lenovo B50-10 Laptop - Page 53
Heat sink assembly, 1060 PCI Express Mini Card for wireless LAN
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Lenovo B50-10 1100 Heat sink assembly For access, remove these FRUs in order: • "1010 Keyboard" on page 32 • "1020 Optical drive" on page 34 • "1030 Base cover" on page 36 • "1040 Battery pack" on page 39 • "1050 Hard disk drive" on page 41 • "1060 PCI Express Mini Card for wireless LAN" on page 43 • "1080 Speakers" on page 46 • "1090 System board" on page 47 Figure 10. Removal steps of heat sink assembly Remove the screws 1. 1 1 1 1 Step Screw (quantity) 1 M2 × 4, Phillips head, nylok-coated (4) THERMAL MODULE TO CPU BRK Color Torque Silver 1.85+/-0.15 kgf/cm Lift the heat sink in the direction shown by arrow 2. 2 49
49
Lenovo B50-10
1100 Heat sink assembly
For access, remove these FRUs in order:
•
“1010 Keyboard” on page 32
•
“1020 Optical drive” on page 34
•
“1030 Base cover” on page 36
•
“1040 Battery pack” on page 39
•
“1050 Hard disk drive” on page 41
•
“1060 PCI Express Mini Card for wireless LAN” on page 43
•
“1080 Speakers” on page 46
•
“1090 System board” on page 47
Figure 10. Removal steps of heat sink assembly
Remove the screws
1
.
1
1
1
1
Step
Screw (quantity)
Color
Torque
1
M2 × 4, Phillips head, nylok-coated (4)
THERMAL MODULE TO CPU BRK
Silver
1.85+/-0.15 kgf/cm
Lift the heat sink in the direction shown by arrow
2
.
2