Lenovo B50-10 Laptop Hardware Maintenance Manual - Lenovo B50-10 Laptop - Page 53

Heat sink assembly, 1060 PCI Express Mini Card for wireless LAN

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Lenovo B50-10 1100 Heat sink assembly For access, remove these FRUs in order: • "1010 Keyboard" on page 32 • "1020 Optical drive" on page 34 • "1030 Base cover" on page 36 • "1040 Battery pack" on page 39 • "1050 Hard disk drive" on page 41 • "1060 PCI Express Mini Card for wireless LAN" on page 43 • "1080 Speakers" on page 46 • "1090 System board" on page 47 Figure 10. Removal steps of heat sink assembly Remove the screws 1. 1 1 1 1 Step Screw (quantity) 1 M2 × 4, Phillips head, nylok-coated (4) THERMAL MODULE TO CPU BRK Color Torque Silver 1.85+/-0.15 kgf/cm Lift the heat sink in the direction shown by arrow 2. 2 49

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49
Lenovo B50-10
1100 Heat sink assembly
For access, remove these FRUs in order:
“1010 Keyboard” on page 32
“1020 Optical drive” on page 34
“1030 Base cover” on page 36
“1040 Battery pack” on page 39
“1050 Hard disk drive” on page 41
“1060 PCI Express Mini Card for wireless LAN” on page 43
“1080 Speakers” on page 46
“1090 System board” on page 47
Figure 10. Removal steps of heat sink assembly
Remove the screws
1
.
1
1
1
1
Step
Screw (quantity)
Color
Torque
1
M2 × 4, Phillips head, nylok-coated (4)
THERMAL MODULE TO CPU BRK
Silver
1.85+/-0.15 kgf/cm
Lift the heat sink in the direction shown by arrow
2
.
2