Lexmark XM5263 Lexmark MS/MX71x 81x series Disassembly of Waste Electrical and - Page 2

Materials and components list for selective treatment, 3. Disassembly tools, Items, Quantity, Notes

Page 2 highlights

2. Materials and components list for selective treatment Items Polychlorinated biphenyls (PCB) containing capacitors Mercury containing components, such as switches or backlighting lamps Batteries Quantity 0 0 Notes N/A N/A 1 Lithium Manganese Dioxide coin cell located on the Controller board Printed circuit boards greater than 10 cm2 multiple 6 - MS71x and MS81x series 11 - MX71x and MX81x series See details in Annex D 1-for each Paper handling options See details in Annex E Toner cartridges, liquid and pasty, as well as colour toner Plastic containing brominated flame retardants 2 multiple Other options: 1-Fax, 1-Hard disk drive (HDD) 1 - Toner cartridge 1 - Imaging Unit 20 - MS71x and MS81x series 35 - MX71x and MX81x series Paper handling options: 5 - 250 Tray, 5 - 550 Tray, 3 - High capacity input tray, 4 - Output Expander, 5 - High Capacity Output Expander, 13 - Staple finisher, 4 - Mailbox, 10 - Staple, hole punch finisher, 11 - Offset stacker See details in Annex A, B and C Asbestos waste and components which contain asbestos Cathode ray tubes 0 N/A 0 N/A Chlorofluorocarbons (CFC), Hydrochlorofluorocarbons (HCFC) or Hydrofluorocarbons (HFC), Hydrocarbons (HC) Gas discharge lamps Liquid Crystal Display (LCD) greater than 100 cm2 and those back-lighted with Gas discharge lamps External electrical cables Components containing refractory fibres Components containing radioactive substances Electrolyte capacitors containing substances of concern (capacitors with height > 25 mm, diameter > 25 mm or proportionately similar volume) Electrical and Electronic (EE) Customer Replaceable devices Electrical and Electronic (EE) Customer Replaceable Internal/External Card options 0 0 1 1 0 0 4 multiple multiple N/A N/A MS812de LCD located inside OP panel Power cord located on the back lower left quadrant N/A N/A Capacitor(s) located on Power Supply, LVPS (universal) See details in Annex F See details in Annex G Doc No.: Rev. 04 Page 2 of 48

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Doc No.:
Rev. 04
Page 2 of 48
2.
Materials and components list for selective treatment
Items
Quantity
Notes
Polychlorinated biphenyls (PCB) containing capacitors
0
N/A
Mercury containing components, such as switches or
backlighting lamps
0
N/A
Batteries
1
Lithium Manganese Dioxide coin cell
located on the
Controller board
Printed circuit boards greater than 10 cm
2
multiple
6
MS71x and MS81x series
11
MX71x and MX81x series
See details in
Annex D
1-for each Paper handling options
See details in
Annex E
Other options:
1-Fax, 1-Hard disk drive (HDD)
Toner cartridges, liquid and pasty, as well as colour
toner
2
1
Toner cartridge
1
Imaging Unit
Plastic containing brominated flame retardants
multiple
20
MS71x and MS81x series
35
MX71x and MX81x series
Paper handling options: 5
250 Tray,
5
550 Tray, 3
High capacity input
tray,
4
Output Expander, 5
High
Capacity Output Expander,
13
Staple finisher, 4
Mailbox,
10
Staple, hole punch finisher,
11
Offset stacker
See details in
Annex A
,
B
and
C
Asbestos waste and components which contain
asbestos
0
N/A
Cathode ray tubes
0
N/A
Chlorofluorocarbons (CFC), Hydrochlorofluorocarbons
(HCFC) or Hydrofluorocarbons (HFC), Hydrocarbons
(HC)
0
N/A
Gas discharge lamps
0
N/A
Liquid Crystal Display (LCD) greater than 100 cm
2
and
those back-lighted with Gas discharge lamps
1
MS812de LCD located inside OP panel
External electrical cables
1
Power cord located on the back lower
left quadrant
Components containing refractory fibres
0
N/A
Components containing radioactive substances
0
N/A
Electrolyte capacitors containing substances of concern
(capacitors with height > 25 mm, diameter > 25 mm or
proportionately similar volume)
4
Capacitor(s) located
on Power Supply,
LVPS (universal)
Electrical and Electronic (EE) Customer Replaceable
devices
multiple
See details in
Annex F
Electrical and Electronic (EE) Customer Replaceable
Internal/External Card options
multiple
See details in
Annex G