ASRock Fatal1ty 970 Performance/3.1 User Manual - Page 10

Specifications, Platform, Chipset, Memory, Expansion - amd

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1.2 Speciications Platform • ATX Form Factor • ASRock DuraCap (2.5 x longer life time) (100% Japan-made high-quality conductive polymer capacitors) • High Density Glass Fabric PCB CPU • Supports Socket AM3+ processors • Supports Socket AM3 processors: AMD PhenomTM II X6 / X4 / X3 / X2 (except 920 / 940) / Athlon II X4 / X3 / X2 / Sempron processors • Supports 8-Core CPU • Supports UCC feature (Unlock CPU Core) • Digi Power design • 8 + 2 Power Phase design • Supports CPU up to 220W • Supports AMD's Cool 'n' Quiet Technology • FSB 2400 MHz (4.8 GT/s) • Supports Untied Overclocking Technology • Supports Hyper-Transport 3.0 (HT 3.0) Technology Chipset • Northbridge: AMD 970 • Southbridge: AMD SB950 Memory • Dual Channel DDR3 Memory Technology • 4 x DDR3 DIMM Slots • Supports DDR3 2400+(OC)/2100(OC)/1866(OC)/1800 (OC)/1600(OC)/1333/1066 non-ECC, un-bufered memory (see CAUTION1) • Max. capacity of system memory: 64GB (see CAUTION2) • Supports Intel® Extreme Memory Proile (XMP) 1.3 / 1.2 • Supports AMD Memory Proile Technology (AMP) up to AMP 2400 Expansion Slot • 3 x PCI Express 2.0 x16 Slots (PCIE2/PCIE4/PCIE5: single at x16 (PCIE2); dual at x8 (PCIE2) / x8 (PCIE4); triple at x8 (PCIE2) / x8 (PCIE4) / x4 (PCIE5)) * If M.2 PCI Express module is installed, PCIE5 slot will be disabled. English 2

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2
English
1.2
Speci±cations
Platform
•
ATX Form Factor
•
ASRock DuraCap (2.5 x longer life time) (100% Japan-made
high-quality conductive polymer capacitors)
•
¶igh Density Glass Fabric PCB
CPU
•
Supports Socket AM3+ processors
•
Supports Socket AM3 processors: AMD Phenom
TM
II X6
/ X4 / X3 / X2 (except 920 / 940) / Athlon II X4 / X3 / X2 /
Sempron processors
•
Supports 8-Core CPU
•
Supports UCC feature (Unlock CPU Core)
•
Digi Power design
•
8 + 2 Power Phase design
•
Supports CPU up to 220W
•
Supports AMD's Cool 'n' Quiet Technology
•
FSB 2400 M¶z (4.8 GT/s)
•
Supports Untied Overclocking Technology
•
Supports ¶yper-Transport 3.0 (¶T 3.0) Technology
Chipset
•
Northbridge: AMD 970
•
Southbridge: AMD SB950
Memory
•
Dual Channel DDR3 Memory Technology
•
4 x DDR3 DIMM Slots
•
Supports DDR3 2400+(OC)/2100(OC)/1866(OC)/1800
(OC)/1600(OC)/1333/1066 non-ECC, un-bu´ered memory
(see CAUTION1)
•
Max. capacity of system memory: 64GB (see CAUTION2)
•
Supports Intel® Extreme Memory Pro±le (XMP) 1.3 / 1.2
•
Supports AMD Memory Pro±le Technology (AMP) up to
AMP 2400
Expansion
Slot
•
3 x PCI Express 2.0 x16 Slots (PCIE2/PCIE4/PCIE5: single
at x16 (PCIE2); dual at x8 (PCIE2) / x8 (PCIE4); triple at x8
(PCIE2) / x8 (PCIE4) / x4 (PCIE5))
* If M.2 PCI Express module is installed, PCIE5 slot will be
disabled.