ASRock H270 Pro4 User Manual - Page 57

DRAM Timing Configuration, RAS# Active Time tRAS

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H270 Pro4 DRAM Configuration DRAM Tweaker Fine tune the DRAM settings by leaving marks in checkboxes. Click OK to confirm and apply your new settings. DRAM Timing Configuration DRAM Reference Clock Select Auto for optimized settings. DRAM Frequency If [Auto] is selected, the motherboard will detect the memory module(s) inserted and assign the appropriate frequency automatically. Primary Timing CAS# Latency (tCL) The time between sending a column address to the memory and the beginning of the data in response. RAS# to CAS# Delay and Row Precharge (tRCDtRP) O RAS# to CAS# Delay : The number of clock cycles required between the opening of a row of memory and accessing columns within it. Row Precharge: The number of clock cycles required between the issuing of the precharge command and opening the next row. RAS# Active Time (tRAS) The number of clock cycles required between a bank active command and issuing the precharge command. Command Rate (CR) The delay between when a memory chip is selected and when the first active command can be issued. Secondary Timing Write Recovery Time (tWR) The amount of delay that must elapse after the completion of a valid write operation, before an active bank can be precharged. 51 English

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English
H270 Pro4
DRAM Configuration
DRAM Tweaker
Fine tune the DRAM settings by leaving marks in checkboxes. Click OK to confirm and
apply your new settings.
DRAM Timing Configuration
DRAM Reference Clock
Select Auto for optimized settings.
DRAM Frequency
If [Auto] is selected, the motherboard will detect the memory module(s) inserted
and assign the appropriate frequency automatically.
Primary Timing
CAS# Latency (tCL)
°e time between sending a column address to the memory and the beginning of the data
in response.
RAS# to CAS# Delay and Row Precharge (tRCDtRP) O
RAS# to CAS# Delay : °e number of clock cycles required between the opening of
a row of memory and accessing columns within it.
Row Precharge: °e number of clock cycles required between the issuing of the
precharge command and opening the next row.
RAS# Active Time (tRAS)
°e number of clock cycles required between a bank active command and issuing the
precharge command.
Command Rate (CR)
°e delay between when a memory chip is selected and when the first active command can
be issued.
Secondary Timing
Write Recovery Time (tWR)
°e amount of delay that must elapse aſter the completion of a valid write operation,
before an active bank can be precharged.