ASRock H570M-ITX/ac User Manual - Page 10
Specifications, English
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1.2 Specifications Platform CPU • Mini-ITX Form Factor • 8 Layer PCB • Supports 10th Gen Intel® CoreTM Processors and 11th Gen Intel® CoreTM Processors (LGA1200) • Digi Power design • 8 Power Phase design • Supports Intel® Turbo Boost Max 3.0 Technology Chipset • Intel® H570 Memory • Dual Channel DDR4 Memory Technology • 2 x DDR4 DIMM Slots • 11th Gen Intel® CoreTM Processors support DDR4 non-ECC, un-buffered memory up to 5066+(OC)* • 10th Gen Intel® CoreTM Processors support DDR4 non-ECC, un-buffered memory up to 4600+(OC)* * 11th Gen Intel® CoreTM (i9/i7/i5) support DDR4 up to 3200; CoreTM (i3), Pentium® and Celeron® support DDR4 up to 2666. * 10th Gen Intel® CoreTM (i9/i7) support DDR4 up to 2933; CoreTM (i5/i3), Pentium® and Celeron® support DDR4 up to 2666. * Please refer to Memory Support List on ASRock's website for more information. (http://www.asrock.com/) • Supports ECC UDIMM memory modules (operate in non- ECC mode) • Max. capacity of system memory: 64GB • Supports Intel® Extreme Memory Profile (XMP) 2.0 Expansion Slot 11th Gen Intel® CoreTM Processors • 1 x PCI Express 4.0 x16 Slot* 10th Gen Intel® CoreTM Processors • 1 x PCI Express 3.0 x16 Slot* * Supports NVMe SSD as boot disks • 1 x Vertical M.2 Socket (Key E) with the bundled WiFi- 802.11ac module (on the rear I/O) English 2