ASRock H77M User Manual - Page 6

Platform, CAUTION 1, Chipset, Memory, CAUTION 2, CAUTION 3, Expansion Slot, CAUTION 4, CAUTION 5, - intel h77

Page 6 highlights

1.2 Specifications Platform CPU Chipset Memory Expansion Slot Graphics - Micro ATX Form Factor: 9.6-in x 8.5-in, 24.4 cm x 21.6 cm - All Solid Capacitor design - Supports 3rd and 2nd Generation Intel® CoreTM i7 / i5 / i3 in LGA1155 Package - Digi Power Design - 4 + 2 Power Phase Design - Supports Intel® Turbo Boost 2.0 Technology - Supports Intel® K-Series unlocked CPU - Supports Hyper-Threading Technology (see CAUTION 1) - Supports Intel® Rapid Start Technology and Smart Connect Technology with Intel® Ivy Bridge CPU - Intel® H77 - Dual Channel DDR3 Memory Technology (see CAUTION 2) - 2 x DDR3 DIMM slots - Supports DDR3 1600/1333/1066 non-ECC, un-buffered memory (DDR3 1600 with Intel® Ivy Bridge CPU, DDR3 1333 with Intel® Sandy Bridge CPU) - Max. capacity of system memory: 16GB (see CAUTION 3) - Supports Intel® Extreme Memory Profile (XMP)1.3/1.2 - 1 x PCI Express 3.0 x16 slot (PCIE1: x16 mode) (see CAUTION 4) * PCIE 3.0 is only supported with Intel® Ivy Bridge CPU. With Intel® Sandy Bridge CPU, it only supports PCIE 2.0. - 1 x PCI Express 2.0 x16 slot (PCIE2: x4 mode) - 2 x PCI slots - Supports AMD Quad CrossFireXTM and CrossFireXTM * Intel® HD Graphics Built-in Visuals and the VGA outputs can be supported only with processors which are GPU integrated. - Supports Intel® HD Graphics Built-in Visuals: Intel® Quick Sync Video, Intel® InTruTM 3D, Intel® Clear Video HD Technology, Intel® InsiderTM, Intel® HD Graphics 2500/4000, Intel® Advanced Vector Extensions (AVX) - Pixel Shader 5.0, DirectX 11 with Intel® Ivy Bridge CPU. Pixel Shader 4.1, DirectX 10.1 with Intel® Sandy Bridge CPU. - Max. shared memory 1760MB (see CAUTION 5) - Three VGA Output options: D-Sub, DVI-D and HDMI (see CAUTION 6) 6

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6
1.2
Specifications
Platform
- Micro ATX Form Factor: 9.6-in x 8.5-in, 24.4 cm x 21.6 cm
- All Solid Capacitor design
CPU
- Supports 3
rd
and 2
nd
Generation Intel
®
Core
TM
i7 / i5 / i3 in
LGA1155 Package
- Digi Power Design
- 4 + 2 Power Phase Design
- Supports Intel
®
Turbo Boost 2.0 Technology
- Supports Intel
®
K-Series unlocked CPU
- Supports Hyper-Threading Technology (see
CAUTION 1
)
- Supports Intel
®
Rapid Start Technology and Smart Connect
Technology with Intel
®
Ivy Bridge CPU
Chipset
- Intel
®
H77
Memory
- Dual Channel DDR3 Memory Technology (see
CAUTION 2
)
- 2 x DDR3 DIMM slots
- Supports DDR3 1600/1333/1066 non-ECC, un-buffered
memory (DDR3 1600 with Intel
®
Ivy Bridge CPU, DDR3
1333 with Intel
®
Sandy Bridge CPU)
- Max. capacity of system memory: 16GB (see
CAUTION 3
)
- Supports Intel
®
Extreme Memory Pro
le (XMP)1.3/1.2
Expansion Slot
- 1 x PCI Express 3.0 x16 slot (PCIE1: x16 mode)
(see
CAUTION 4
)
* PCIE 3.0 is only supported with Intel
®
Ivy Bridge CPU. With
Intel
®
Sandy Bridge CPU, it only supports PCIE 2.0.
- 1 x PCI Express 2.0 x16 slot (PCIE2: x4 mode)
- 2 x PCI slots
- Supports AMD Quad CrossFireX
TM
and CrossFireX
TM
Graphics
* Intel
®
HD Graphics Built-in Visuals and the VGA outputs can
be supported only with processors which are GPU
integrated.
- Supports Intel
®
HD Graphics Built-in Visuals: Intel
®
Quick
Sync Video, Intel
®
InTru
TM
3D, Intel
®
Clear Video HD
Technology, Intel
®
Insider
TM
, Intel
®
HD Graphics 2500/4000,
Intel
®
Advanced Vector Extensions (AVX)
- Pixel Shader 5.0, DirectX 11 with Intel
®
Ivy Bridge CPU.
Pixel Shader 4.1, DirectX 10.1 with Intel
®
Sandy Bridge
CPU.
- Max. shared memory 1760MB (see
CAUTION 5
)
- Three VGA Output options: D-Sub, DVI-D and HDMI
(see
CAUTION 6
)