Asus P8H61-M PLUS V3 P8H61-M PLUS V3 User's Manual - Page 9
P8H61-M PLUS V3 specifications summary - socket
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P8H61-M PLUS V3 specifications summary CPU Chipset Memory Expansion slots Storage LAN Audio USB ASUS unique features LGA1155 socket for Intel® 3rd/2nd Core™ i7 / i5 / i3 / Pentium® / Celeron® processors Supports 22nm / 32nm CPU Supports Enhanced Intel® SpeedStep Technology (EIST) * Refer to www.asus.com for Intel® CPU support list. Intel® H61 Express Chipset 2 x DIMM, max. 16GB**, DDR3 2200(O.C.) /2133(O.C.) /2000(O. C.) /1866(O.C.) /1800(O.C.) /1600 /1333 /1066 MHz, non-ECC, un-buffered memory Dual-channel memory architecture Supports Intel® Extreme Memory Profile (XMP) * 1600MHz and higher frequency is supported by Intel® 3rd generation processor. ** The maximum 16GB memory capacity can be supported with 8GB or above DIMMs. ASUS will update the memory QVL once the DIMMs are available in the market. *** Refer to www.asus.com for the latest Memory QVL (Qualified Vendors List). **** W hen you install a total memory of 4GB capacity or more, Windows® 32-bit operating system may only recognize less than 3GB. We recommend a maximum of 3GB system memory if you are using a Windows® 32-bit operating system. 1 x PCI Express 3.0/2.0 x16 slot 1 x PCI Express 2.0 x1 slots 2 x PCI slots Intel® H61 Express Chipset: - 4 x Serial ATA 3.0 Gb/s connectors Realtek® 8111E PCIe Gigabit LAN controller Realtek® ALC887 8-channel* High Definition Audio CODEC * Use a chassis with HD audio module in the front panel to support an 8-channel audio output. Intel® H61 Express Chipset: - 8 x USB 2.0/1.1 ports (4 ports at the mid-board, 4 ports at the back panel) ASUS ESD Guard ASUS GPU Boost ASUS Anti-Surge Protection ASUS UEFI BIOS ASUS CrashFree BIOS 3 ASUS EZ Flash 2 ASUS MyLogo 2™ 100% All High-quality Conductive Polymer Capacitors (continued on the next page) ix