Asus TUF Z270 MARK 2 TUF Z270 MARK 2 Users manual ENGLISH - Page 9

TUF Z270 MARK 2 specifications summary, Chipset, Memory, Expansion slots, Multi-GPU support

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TUF Z270 MARK 2 specifications summary CPU Chipset Memory Expansion slots VGA Multi-GPU support LAN LGA1151 socket for 7th & 6th Generation Intel® Core™ i7 / i5 / i3 / Pentium® / Celeron® Processors Supports 14nm CPU Supports Intel® Turbo Boost Technology 2.0* * The support of these features depends on the CPU types. ** Refer to www.asus.com for the complete CPU support list. Intel® Z270 Chipset 4 x DIMM, max. 64GB DDR4 3866(O.C.) / 3733(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200(O.C.) / 3000(O.C.) / 2800(O.C.) / 2666(O.C.) / 2400(O.C.) / 2133 MHz Non-ECC, Un-buffered Memory Dual channel memory architecture Supports Intel® Extreme Memory Profile (XMP)* * Hyper DIMM support is subject to the physical characteristics of individual CPUs. Please refer to Memory QVL (Qualified Vendors List) for details. ** R efer to www.asus.com for the complete Memory QVL (Qualified Vendors List). 2 x PCI Express 3.0/2.0 x16 slots (single at x16 or dual at x8/x8 mode) 1 x PCI Express 3.0/2.0 x16 slot* (max. at x2 mode, compatible with PCIe x1, x2 devices) 3 x PCI Express 3.0/2.0 x1 slots Integrated Graphics Processor- Intel® HD Graphics support Multi-VGA output support: DVI-D/HDMI port Supports DVI-D with max. resolution 1920 x 1200@60Hz Supports HDMI 1.4b with max. resolution 4096 x 2160@24Hz Supports Intel® InTru™ 3D/Quick Sync Video/Clear Video HD Technology/Insider™ Maximum shared memory of 1024MB Supports NVIDIA® 2-Way/Quad-GPU SLI® Technology Supports AMD® 2-Way/Quad-GPU CrossFireX™ Technology Gigabit Intel LAN connection- 802.3az Energy Efficient Ethernet (EEE) appliance Intel® I219-V Gigabit LAN- Dual interconnect between the integrated Media Access Controller (MAC) and physical layer (PHY) TUF LANGuard ASUS Turbo LAN Utility (continued on the next page) ix

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ix
CPU
LGA1151 socket for 7th & 6th Generation Intel
®
Core™ i7 / i5 / i3 /
Pentium
®
/ Celeron
®
Processors
Supports 14nm CPU
Supports Intel
®
Turbo Boost Technology 2.0*
*
The support of these features depends on the CPU types.
**
Refer to www.asus.com for the complete CPU support list.
Chipset
Intel
®
Z270 Chipset
Memory
4 x DIMM, max. 64GB DDR4 3866(O.C.) / 3733(O.C.) / 3600(O.C.) /
3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200(O.C.)
/ 3000(O.C.) / 2800(O.C.) / 2666(O.C.) / 2400(O.C.) / 2133 MHz
Non-ECC, Un-buffered Memory
Dual channel memory architecture
Supports Intel
®
Extreme Memory Profile (XMP)*
*
Hyper DIMM support is subject to the physical characteristics of
individual CPUs. Please refer to Memory QVL (Qualified Vendors List)
for details.
**
Refer to www.asus.com for the complete Memory QVL (Qualified
Vendors List).
Expansion slots
2 x PCI Express 3.0/2.0 x16 slots
(single at x16 or dual at x8/x8 mode)
1 x PCI Express 3.0/2.0 x16 slot*
(max. at x2 mode, compatible with PCIe x1, x2 devices)
3 x PCI Express 3.0/2.0 x1 slots
VGA
Integrated Graphics Processor- Intel
®
HD Graphics support
Multi-VGA output support: DVI-D/HDMI port
Supports DVI-D with max. resolution 1920 x 1200@60Hz
Supports HDMI 1.4b with max. resolution 4096 x 2160@24Hz
Supports Intel
®
InTru™ 3D/Quick Sync Video/Clear Video HD
Technology/Insider™
Maximum shared memory of 1024MB
Multi-GPU support
Supports NVIDIA
®
2-Way/Quad-GPU SLI
®
Technology
Supports AMD
®
2-Way/Quad-GPU CrossFireX™ Technology
LAN
Gigabit Intel LAN connection- 802.3az Energy Efficient Ethernet
(EEE) appliance
Intel
®
I219-V Gigabit LAN- Dual interconnect between the integrated
Media Access Controller (MAC) and physical layer (PHY)
TUF LANGuard
ASUS Turbo LAN Utility
(continued on the next page)
TUF Z270 MARK 2 specifications summary