Dell Latitude 7490 7390 7490 Technical Guidebook - Page 58

Method 516.5 SHOCK Procedure II: Material to be Packaged, Model, Dell Latitude 7000 Series

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Model Dell Latitude 7000 Series • METHOD 502.5 LOW TEMPERATURE Procedure I (Exaggerated) • METHOD 502.5 LOW TEMPERATURE Procedure II • METHOD 507.5 Procedure II Humidity Aggravated Cycle • METHOD 510.5 SAND AND DUST Procedure I • IP5x Dust Ingress Duration: 8 hours • METHOD 514.6 VIBRATION Procedure I • Method 516.6 SHOCK Procedure I: Functional Shock • Method 516.6 SHOCK Procedure IV: Transit Drop; Modified to be dropped at 30 • Method 516.5 SHOCK Procedure II: Material to be Packaged • Method 516.5 SHOCK Procedure V: Crash Hazard Shock • Method 516.6 SHOCK Procedure VI: Bench Handling 58 Engineering specifications

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Model
Dell Latitude 7000 Series
•
METHOD 502.5 LOW TEMPERATURE Procedure I
(Exaggerated)
•
METHOD 502.5 LOW TEMPERATURE Procedure II
•
METHOD 507.5 Procedure II Humidity Aggravated Cycle
•
METHOD 510.5 SAND AND DUST Procedure I
•
IP5x Dust Ingress Duration: 8 hours
•
METHOD 514.6 VIBRATION Procedure I
•
Method 516.6 SHOCK Procedure I: Functional Shock
•
Method 516.6 SHOCK Procedure IV: Transit Drop;
Modified
to
be dropped at 30
•
Method 516.5 SHOCK Procedure II: Material to be Packaged
•
Method 516.5 SHOCK Procedure V: Crash Hazard Shock
•
Method 516.6 SHOCK Procedure VI: Bench Handling
58
Engineering
specifications