Dell PowerEdge C6520 EMC Technical Specifications - Page 11

Dell PowerEdge C6520 Manual

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Table 19. Maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch NVMe drive configuration- Air cooled Processors TDP (W) Cores 6 x drives/ sled 4 x drives/sled 2 x drives/sled 1 x drive/sled No BP 8380 270 40 Not supported Not supported Not supported Not supported Not supported 8368 270 38 Not supported Not supported Not supported Not supported Not supported 8368Q 270 38 Not supported Not supported Not supported Not supported Not supported 8360Y 250 36 Not supported Not supported Not supported Not supported Not supported 8358 250 32 Not supported Not supported Not supported Not supported Not supported 8358P 240 32 Not supported Not supported Not supported Not supported 20 6348 235 28 Not supported Not supported Not supported Not supported 20 8352Y 205 32 20 20 25 25 25 8352S 205 32 20 20 25 25 25 6338 205 32 20 20 25 25 25 6330 205 28 20 20 25 25 25 6354 205 18 Not supported 20 20 20 25 6346 205 16 Not supported 20 20 20 25 8352V 195 36 20 20 25 25 25 6338N 185 32 20* 20* 25 25 25 6330N 165 28 25 25* 25* 25* 25* NOTE: ● Data with * mark means it can have a temperature offset by +5°C, if using extended processor 1 with HSK on this configuration. ● H745 is not supported with processor TDP > 185 W. ● Additional thermal restrictions are required for PCIE > 25 Watts, 128GB LRDIMM and GPU configuration. Table 20. Maximum continuous operating temperature for single processor with 2.5-inch direct drive configuration for processor 1 - Air cooled Processors TDP (W) Cores 6 x drives/ 4 x drives/ sled sled 2 x drives/ sled 1 x drive/ sled No BP 8380 270 40 20 20 20 20 25 8368 270 38 20 20 25 25 25 8368Q 270 38 Not Not supported Not supported Not supported Not supported supported 8360Y 250 36 20 20 25 25 25 8358 250 32 20 20 25 25 25 8358P 240 32 20 20 25 25 25 6348 235 28 25 25 25 25 30 8351N 225 36 20 20 25 25 25 Technical specifications 11

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Table 19. Maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch
NVMe drive configuration- Air cooled
Processors
TDP (W)
Cores
6 x drives/
sled
4 x drives/sled
2 x drives/sled
1 x drive/sled
No BP
8380
270
40
Not supported
Not supported
Not supported
Not supported
Not
supported
8368
270
38
Not supported
Not supported
Not supported
Not supported
Not
supported
8368Q
270
38
Not supported
Not supported
Not supported
Not supported
Not
supported
8360Y
250
36
Not supported
Not supported
Not supported
Not supported
Not
supported
8358
250
32
Not supported
Not supported
Not supported
Not supported
Not
supported
8358P
240
32
Not supported
Not supported
Not supported
Not supported
20
6348
235
28
Not supported
Not supported
Not supported
Not supported
20
8352Y
205
32
20
20
25
25
25
8352S
205
32
20
20
25
25
25
6338
205
32
20
20
25
25
25
6330
205
28
20
20
25
25
25
6354
205
18
Not supported
20
20
20
25
6346
205
16
Not supported
20
20
20
25
8352V
195
36
20
20
25
25
25
6338N
185
32
20*
20*
25
25
25
6330N
165
28
25
25*
25*
25*
25*
NOTE:
Data with * mark means it can have a temperature offset by +5°C, if using extended processor 1 with HSK on this
configuration.
H745 is not supported with processor TDP > 185 W.
Additional thermal restrictions are required for PCIE > 25 Watts, 128GB LRDIMM and GPU configuration.
Table 20. Maximum continuous operating temperature for single processor with 2.5-inch direct drive
configuration for processor 1 - Air cooled
Processors
TDP (W)
Cores
6 x drives/
sled
4 x drives/
sled
2 x drives/ sled
1 x drive/ sled
No BP
8380
270
40
20
20
20
20
25
8368
270
38
20
20
25
25
25
8368Q
270
38
Not
supported
Not supported
Not supported
Not supported
Not
supported
8360Y
250
36
20
20
25
25
25
8358
250
32
20
20
25
25
25
8358P
240
32
20
20
25
25
25
6348
235
28
25
25
25
25
30
8351N
225
36
20
20
25
25
25
Technical specifications
11